Patents by Inventor Chihiro Makara

Chihiro Makara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus for conveyance of semiconductor chips
    Patent number: 6382900
    Abstract: An apparatus for conveyance of a semiconductor chip. The apparatus includes an arm for conveying a semiconductor chip, a pickup on the arm for holding the semiconductor chip. A first transmission mechanism is provided for producing power acting in a first direction. The first transmission mechanism includes pulleys and a wire. An interconnection mechanism is provided for interconnecting the wire and the arm for causing movement of the arm in the first direction. A second transmission mechanism is connected to the arm for moving the arm in a second direction which is substantially orthogonal to the first direction. The interconnection mechanism is configured to permit movement of the arm with respect to the first transmission mechanism in the second direction and to transmit the power from the first transmission mechanism to the arm.
    Type: Grant
    Filed: March 12, 1999
    Date of Patent: May 7, 2002
    Assignee: Fujitsu Limited
    Inventors: Chihiro Makara, Tetsuji Kadowaki