Patents by Inventor Chihiro Mochizuki

Chihiro Mochizuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240051329
    Abstract: Provided is a writing implement that maximizes the effective area of a viewer portion allowing visual recognition in the writing direction and that facilitates writing at a high level, at the same time. This writing implement is a writing implement A, including for example, a pen tip 20 that feeds ink from a writing implement body 10 and has a viewer portion 33 allowing visual recognition in the writing direction. The pen tip 20 is comprised of, at least, a writing part 25 and a retainer 30 having the viewer portion 33, an ink feeder portion 26 for feeding the ink from the writing implement body 10 to the writing part 25. The minimum width X of the viewer portion 33 is 3.7 mm or greater and a length Y of the viewer portion 33 is 7.4 mm or greater. The ink feeder portion 26 is arranged on one side of the viewer portion 33.
    Type: Application
    Filed: February 9, 2022
    Publication date: February 15, 2024
    Applicant: MITSUBISHI PENCIL COMPANY, LIMITED
    Inventors: Hirotake IZAWA, Toshimi KAMITANI, Chihiro MOCHIZUKI, Kaito TSUKADA
  • Publication number: 20230166242
    Abstract: The present invention provides a carbon dioxide reduction catalyst that is used in reduction reactions of carbon dioxide and that has high methanol selectivity. A carbon dioxide reduction catalyst according to the present invention is used in producing methanol by reduction reactions of carbon dioxide, and contains Au and Cu as catalyst components and ZnO as a carrier. It is preferable that the catalyst components contain 7-25 mol % of Au as a catalyst component. This makes it possible to obtain high methanol selectivity—for example, selectivity of not less than 80%. The carbon dioxide reduction catalyst makes it possible to obtain high methanol selectivity even under the conditions of not more than 240° C. and not more than 50 bar.
    Type: Application
    Filed: April 19, 2021
    Publication date: June 1, 2023
    Inventors: Toru MURAYAMA, Tamao ISHIDA, Chihiro MOCHIZUKI, Ali M. Abdel-Mageed, Rolf Jurgen Behm
  • Patent number: 8744257
    Abstract: A lens apparatus includes: an optical member; a driving unit; a position detector; a rotary operation portion; a projection portion to be rotated interlockingly with the operation portion; an operation portion rotation detector; a driving controller for controlling the driving unit based on an amount of an operation of the operation portion; rotatable first (second) pins; first (second) side locking units; and a lock controller for controlling both the locking units based on a position of the optical member and a rotating direction of the operation portion. The projection portion is provided between the first regulation pin and the second regulation pin. The first regulation pin and the second regulation pin are elastically connected to each other. The lock controller locks the first (second) side locking unit when the focus unit reaches a first (second) end while the operation portion is operated toward the first (second) end.
    Type: Grant
    Filed: March 19, 2013
    Date of Patent: June 3, 2014
    Assignee: Canon Kabushiki Kaisha
    Inventor: Chihiro Mochizuki
  • Patent number: 8441115
    Abstract: A semiconductor package includes a print circuit part, a lower chip, an upper chip, a thermal conductivity part, and an encapsulation resin. The lower chip and the upper chip are mounted on the print circuit part through wire bonding connection. The thermal conductivity part efficiently dissipates heat from the chips to the outside of the package. The encapsulation resin entirely seals the package while exposing the thermal conductivity part. A adhesive sheet is hardened to form a bonding layer between the thermal conductivity part and the upper chip, a bonding layer between the semiconductor chips, and a bonding layer between the semiconductor chip and the wired component. The configuration contributes to miniaturization, high integration, and heat resistance reduction of a semiconductor package using high-heat-generating ICs.
    Type: Grant
    Filed: June 29, 2011
    Date of Patent: May 14, 2013
    Assignee: Hitachi, Ltd.
    Inventors: Chihiro Mochizuki, Hiroshi Kikuchi, Yoichiro Kobayashi, Yasuo Shima
  • Patent number: 8417108
    Abstract: A lens apparatus includes: an optical member; a driving unit; a position detector; a rotary operation portion; a projection portion to be rotated interlockingly with the operation portion; an operation portion rotation detector; a driving controller for controlling the driving unit based on an amount of an operation of the operation portion; rotatable first (second) pins; first (second) side locking units; and a lock controller for controlling both the locking units based on a position of the optical member and a rotating direction of the operation portion. The projection portion is provided between the first regulation pin and the second regulation pin. The first regulation pin and the second regulation pin are elastically connected to each other. The lock controller locks the first (second) side locking unit when the focus unit reaches a first (second) end while the operation portion is operated toward the first (second) end.
    Type: Grant
    Filed: July 20, 2011
    Date of Patent: April 9, 2013
    Assignee: Canon Kabushiki Kaisha
    Inventor: Chihiro Mochizuki
  • Patent number: 8376436
    Abstract: A storage box assembly for a vehicle includes a case in which an opening is formed on an upper surface thereof, and a lid for opening/closing the opening. When the lid is closed, a surface of the lid and an upper surface of the case substantially form a flush surface. When the lid is opened, the lid is moved to be retracted in the case by a guide mechanism.
    Type: Grant
    Filed: August 26, 2010
    Date of Patent: February 19, 2013
    Assignee: Nihon Plast Co., Ltd.
    Inventors: Tatsuhiko Nakamura, Kenichi Kamio, Yasunori Sei, Chihiro Mochizuki
  • Publication number: 20120027394
    Abstract: A lens apparatus includes: an optical member; a driving unit; a position detector; a rotary operation portion; a projection portion to be rotated interlockingly with the operation portion; an operation portion rotation detector; a driving controller for controlling the driving unit based on an amount of an operation of the operation portion; rotatable first (second) pins; first (second) side locking units; and a lock controller for controlling both the locking units based on a position of the optical member and a rotating direction of the operation portion. The projection portion is provided between the first regulation pin and the second regulation pin. The first regulation pin and the second regulation pin are elastically connected to each other. The lock controller locks the first (second) side locking unit when the focus unit reaches a first (second) end while the operation portion is operated toward the first (second) end.
    Type: Application
    Filed: July 20, 2011
    Publication date: February 2, 2012
    Applicant: CANON KABUSHIKI KAISHA
    Inventor: Chihiro MOCHIZUKI
  • Publication number: 20120001315
    Abstract: A semiconductor package includes a print circuit part, a lower chip, an upper chip, a thermal conductivity part, and an encapsulation resin. The lower chip and the upper chip are mounted on the print circuit part through wire bonding connection. The thermal conductivity part efficiently dissipates heat from the chips to the outside of the package. The encapsulation resin entirely seals the package while exposing the thermal conductivity part. A adhesive sheet is hardened to form a bonding layer between the thermal conductivity part and the upper chip, a bonding layer between the semiconductor chips, and a bonding layer between the semiconductor chip and the wired component. The configuration contributes to miniaturization, high integration, and heat resistance reduction of a semiconductor package using high-heat-generating ICs.
    Type: Application
    Filed: June 29, 2011
    Publication date: January 5, 2012
    Inventors: Chihiro Mochizuki, Hiroshi Kikuchi, Yoichiro Kobayashi, Yasuo Shima
  • Publication number: 20110049157
    Abstract: A storage box assembly for a vehicle includes a case in which an opening is formed on an upper surface thereof, and a lid for opening/closing the opening. When the lid is closed, a surface of the lid and an upper surface of the case substantially form a flush surface. When the lid is opened, the lid is moved to be retracted in the case by a guide mechanism.
    Type: Application
    Filed: August 26, 2010
    Publication date: March 3, 2011
    Applicant: NIHON PLAST CO., LTD.
    Inventors: Tatsuhiko NAKAMURA, Kenichi KAMIO, Yasunori SEI, Chihiro MOCHIZUKI
  • Patent number: 7675016
    Abstract: A solid-state image pickup device including a substrate having a first face and a second face which serves as an opposite face of the first face; a solid-state image pickup element having a plurality of electrodes and a light sensing part, an opposite face of the light sensing part being bonded to the first face via a bonding agent; a plurality of wires formed over the face, first ends of the wires serving as external electrode terminals; and a connection part for electrically connecting the electrodes to the wires, wherein an endless-shaped contraction frame formed of resin larger in thermal expansion coefficient than the substrate and image pickup element is bonded to and formed on surface of the substrate located outside the light sensing part so as to surround the light sensing part, and a light sensing face of the light sensing part is warped.
    Type: Grant
    Filed: August 17, 2007
    Date of Patent: March 9, 2010
    Assignees: Hitachi, Ltd., Pentax Corporation
    Inventors: Chihiro Mochizuki, Hiroshi Kikuchi, Akira Arimoto, Masaru Eguchi, Shinichi Arai
  • Patent number: 7656041
    Abstract: A technique for mounting a plurality of electronic parts on one surface of a wiring substrate is provided.
    Type: Grant
    Filed: February 15, 2008
    Date of Patent: February 2, 2010
    Assignee: Hitachi, Ltd.
    Inventors: Chihiro Mochizuki, Hiroshi Kikuchi
  • Publication number: 20080230922
    Abstract: A technique for mounting a plurality of electronic parts on one surface of a wiring substrate is provided.
    Type: Application
    Filed: February 15, 2008
    Publication date: September 25, 2008
    Inventors: Chihiro Mochizuki, Hiroshi Kikuchi
  • Patent number: 7354340
    Abstract: A louver apparatus includes a case member, a connecting member, and a louver pivotally secured to the case member, including a shaft portion including a shaft body being in the form of a substantially cylindrical shape, and a head portion being in the form of a substantially regular polygon, and being located at a tip end portion of the shaft body. At least a part of the head portion protruding radially from the shaft body. The connecting member includes an axial hole being in the form of a substantially regular polygon. The head portion is arranged to pass through the axial hole only at predetermined positions, and to be held not to pass through the axial hole at positions other than the predetermined positions.
    Type: Grant
    Filed: June 29, 2005
    Date of Patent: April 8, 2008
    Assignee: Nihon Plast Co., Ltd.
    Inventors: Chihiro Mochizuki, Kazuhisa Yamamoto
  • Publication number: 20080043127
    Abstract: A solid-state image pickup device including a substrate having a first face and a second face which serves as an opposite face of the first face; a solid-state image pickup element having a plurality of electrodes and a light sensing part, an opposite face of the light sensing part being bonded to the first face via a bonding agent; a plurality of wires formed over the face, first ends of the wires serving as external electrode terminals; and a connection part for electrically connecting the electrodes to the wires, wherein an endless-shaped contraction frame formed of resin larger in thermal expansion coefficient than the substrate and image pickup element is bonded to and formed on surface of the substrate located outside the light sensing part so as to surround the light sensing part, and a light sensing face of the light sensing part is warped.
    Type: Application
    Filed: August 17, 2007
    Publication date: February 21, 2008
    Inventors: Chihiro MOCHIZUKI, Hiroshi Kikuchi, Akira Arimoto, Masaru Eguchi, Shinichi Arai
  • Publication number: 20060073781
    Abstract: A louver apparatus includes a case member, a connecting member, and a louver pivotally secured to the case member, including a shaft portion including a shaft body being in the form of a substantially cylindrical shape, and a head portion being in the form of a substantially regular polygon, and being located at a tip end portion of the shaft body. At least a part of the head portion protruding radially from the shaft body. The connecting member includes an axial hole being in the form of a substantially regular polygon. The head portion is arranged to pass through the axial hole only at predetermined positions, and to be held not to pass through the axial hole at positions other than the predetermined positions.
    Type: Application
    Filed: June 29, 2005
    Publication date: April 6, 2006
    Inventors: Chihiro Mochizuki, Kazuhisa Yamamoto