Patents by Inventor Chihiro Ueda

Chihiro Ueda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200184644
    Abstract: Provided are a medical image processing device and a medical image processing method which can accurately grasp a reproduction status of a video of a medical image by a user such as a doctor. A video reproduction control unit that controls reproduction of a video of a medical image in a display device; a reproduction number control unit that counts the reproduction number of the video by the video reproduction control unit, and counts up the reproduction number of the video in a case where the video is reproduced until a specific frame image among a plurality of frame images constituting the video; and an information display control unit that causes the display device to display the reproduction number of the video, which is counted by the reproduction number control unit are included.
    Type: Application
    Filed: February 13, 2020
    Publication date: June 11, 2020
    Applicant: FUJIFILM Corporation
    Inventor: Chihiro UEDA
  • Publication number: 20110042120
    Abstract: A wire (a twisted pair cable) that transmits a gigahertz band signal and that is provided with a pair of core wires that are twisted with each other, a first insulation coating material, a second insulation coating material, and a shield material that shields evanescent waves emitted from the pair of core wires. The pair of core wires have a twisting pitch, a diameter, and a spacing so that the wire has a characteristic impedance of 100 to 200? and the phases of the TEM (Transverse Electro-Magnetic) wave and the evanescent wave that are emitted from the pair of core wires are matched.
    Type: Application
    Filed: February 2, 2009
    Publication date: February 24, 2011
    Applicants: IBIDEN CO., LTD., NEC CORPORATION, FUJITSU SEMICONDUCTOR LIMITED, FUJI XEROX CO., LTD., KYOCERA CORPORATION
    Inventors: Kanji Otsuka, Tamotsu Usami, Chihiro Ueda, Yutaka Akiyama
  • Patent number: 7872612
    Abstract: An antenna apparatus utilizing an aperture of transmission line, which is connected to a first transmission line having a predetermined characteristic impedance, includes a tapered line portion, and an aperture portion. The tapered line portion is connected to one end of the transmission line, and the tapered line portion includes a second transmission line including a pair of line conductors. The tapered line portion keeps a predetermined characteristic impedance constant and expands at least one of a width of the transmission line and an interval in a tapered shape at a predetermined taper angle. The aperture portion has a radiation aperture connected to one end of the tapered line portion. A size of one side of the aperture end plane of the aperture portion is set to be equal to or higher than a quarter wavelength of the minimum operating frequency of the antenna apparatus.
    Type: Grant
    Filed: May 30, 2008
    Date of Patent: January 18, 2011
    Assignees: Renesas Electronics Corporation, Kabushiki Kaisha Toshiba, Fujitsu Microelectronics Limited, Fuji Xerox Co., Ltd., Ibiden Co., Ltd, Kyocera Corporation
    Inventors: Kanji Otsuka, Tamotsu Usami, Yutaka Akiyama, Chihiro Ueda
  • Publication number: 20080316136
    Abstract: An antenna apparatus utilizing an aperture of transmission line, which is connected to a first transmission line having a predetermined characteristic impedance, includes a tapered line portion, and an aperture portion. The tapered line portion is connected to one end of the transmission line, and the tapered line portion includes a second transmission line including a pair of line conductors. The tapered line portion keeps a predetermined characteristic impedance constant and expands at least one of a width of the transmission line and an interval in a tapered shape at a predetermined taper angle. The aperture portion has a radiation aperture connected to one end of the tapered line portion. A size of one side of the aperture end plane of the aperture portion is set to be equal to or higher than a quarter wavelength of the minimum operating frequency of the antenna apparatus.
    Type: Application
    Filed: May 30, 2008
    Publication date: December 25, 2008
    Inventors: Kanji Otsuka, Tamotsu Usami, Yutaka Akiyama, Chihiro Ueda
  • Patent number: 7113002
    Abstract: A differential signal transmission cable structure for transmitting differential signals having GHz frequency band in the present invention is provided with a differential signal transmission pair cable 30 connecting a driver circuit 23a and a receiver circuit 23b, for transmitting differential signals having GHz frequency band, and a power supply ground transmission pair cable 31 connecting ground and a first power supply 26a connected to the driver circuit and ground and a second power supply 26b connected to the receiver circuit. Further characteristic impedance of the differential signal transmission pair cable is matched to that of the driver circuit and the receiver circuit, thereby enabling TEM waves of differential signals having GHz frequency band transmission mode to be maintained when the differential signals are transmitted.
    Type: Grant
    Filed: May 14, 2004
    Date of Patent: September 26, 2006
    Assignee: Fujikura Ltd.
    Inventors: Kanji Otsuka, Tamotsu Usami, Chihiro Ueda, Yutaka Akiyama, Osamu Koyasu
  • Publication number: 20040227580
    Abstract: A differential signal transmission cable structure for transmitting differential signals having GHz frequency band in the present invention is provided with a differential signal transmission pair cable 30 connecting a driver circuit 23a and a receiver circuit 23b, for transmitting differential signals having GHz frequency band, and a power supply ground transmission pair cable 31 connecting ground and a first power supply 26a connected to the driver circuit and ground and a second power supply 26b connected to the receiver circuit. Further characteristic impedance of the differential signal transmission pair cable is matched to that of the driver circuit and the receiver circuit, thereby enabling TEM waves of differential signals having GHz frequency band transmission mode to be maintained when the differential signals are transmitted.
    Type: Application
    Filed: May 14, 2004
    Publication date: November 18, 2004
    Applicant: FUJIKURA LTD.
    Inventors: Kanji Otsuka, Tamotsu Usami, Chihiro Ueda, Yutaka Akiyama, Osamu Koyasu
  • Patent number: 6763581
    Abstract: A spiral contactor for establishing an electric connection with a semiconductor device or an electronic part including a solder ball includes a spiral probe having a spiral shape, as viewed from the top. The spiral probe is embedded in an insulating substrate in a manner that permits resilient deformation thereof in accordance with a shape of the solder ball. An edge of the spiral probe is pressed to engage the solder ball, and slides along a periphery of the solder ball, thereby cutting an oxide membrane thereon. The spiral contactor may be manufactured by combination of the photolithography technique and the plating process, and used for a semiconductor inspecting apparatus and an electronic part.
    Type: Grant
    Filed: October 21, 2002
    Date of Patent: July 20, 2004
    Inventors: Yukihiro Hirai, Chihiro Ueda, Kouichi Yoshida
  • Publication number: 20030060064
    Abstract: To provide a spiral contactor 1 characterized as comprising of making an electrical connection with semiconductor devices or electronic parts having solder balls, and equipping with a spiral probe 2 having a spiral shape seen in top view to connect with raised solder balls as ductility in response to the shape of this spiral probe when connecting with this solder probe on the insulting substrate, A spiral contactor, a semiconductor inspection device (test socket, test board, Probe card) and electronic parts (mounting socket, mounting connector) which are capable for responding to from small semiconductor devices to packages, super smaller bear chips, moreover, to wafer also, forming carry-current circuits without causing a soft solder probe to deform or flaw, and capable for corresponding to densification of solder probes and realistic for reasonable price and high reliable inspection, can be provided.
    Type: Application
    Filed: October 21, 2002
    Publication date: March 27, 2003
    Applicant: Yukihiro HIRAI
    Inventors: Yukihiro Hirai, Chihiro Ueda, Kouichi Yoshida
  • Patent number: 6517362
    Abstract: A spiral contactor for establishing an electric connection with a semiconductor device or an electronic part including a solder ball includes a spiral probe having a spiral shape as viewed from a top thereof. The spiral probe is embedded in an insulating substrate in a manner that permits resilient deformation thereof in accordance with a shape of the solder ball, and an edge of the spiral probe is pressed to engage into the solder ball and slides along a periphery of the solder ball, thereby cutting oxide membrane thereon. The spiral contactor may be manufactured by combination of the photolithography technique and the plating process, and used for a semiconductor inspecting apparatus and an electronic part.
    Type: Grant
    Filed: August 10, 2001
    Date of Patent: February 11, 2003
    Inventors: Yukihiro Hirai, Chihiro Ueda, Kouichi Yoshida
  • Publication number: 20020037657
    Abstract: To provide a spiral contactor 1 characterized as comprising of making an electrical connection with semiconductor devices or electronic parts having solder balls, and equipping with a spiral probe 2 having a spiral shape seen in top view to connect with raised solder balls as ductility in response to the shape of this spiral probe when connecting with this solder probe on the insulting substrate, A spiral contactor, a semiconductor inspection device (test socket, test board, Probe card) and electronic parts (mounting socket, mounting connector) which are capable for responding to from small semiconductor devices to packages, super smaller bear chips, moreover, to wafer also, forming carry-current circuits without causing a soft solder probe to deform or flaw, and capable for corresponding to densification of solder probes and realistic for reasonable price and high reliable inspection, can be provided.
    Type: Application
    Filed: August 10, 2001
    Publication date: March 28, 2002
    Inventors: Yukihiro Hirai, Chihiro Ueda, Kouichi Yoshida