Abstract: A semiconductor package is provided. The semiconductor package includes a heat dissipation substrate including a first conductive through-via embedded therein; a sensor die disposed on the heat dissipation substrate; an insulating encapsulant laterally encapsulating the sensor die; a second conductive through-via penetrating through the insulating encapsulant; and a first redistribution structure and a second redistribution structure disposed on opposite sides of the heat dissipation substrate. The second conductive through-via is in contact with the first conductive through-via. The sensor die is located between the second redistribution structure and the heat dissipation substrate. The second redistribution structure has a window allowing a sensing region of the sensor die receiving light. The first redistribution structure is electrically connected to the sensor die through the first conductive through-via, the second conductive through-via and the second redistribution structure.

Abstract: In an embodiment, a magnetic assembly includes: an inner permeance annulus; and an outer permeance annulus connected to the inner permeance annulus via magnets, wherein the outer permeance annulus comprises a peak region with a thickness greater than other regions of the outer permeance annulus.

Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.

Abstract: A device comprises a first transistor, a second transistor, a first contact, and a second contact. The first transistor comprises a first gate structure, first source/drain regions on opposite sides of the first gate structure, and first gate spacers spacing the first gate structure apart from the first source/drain regions. The second transistor comprises a second gate structure, second source/drain regions on opposite sides of the second gate structure, and second gate spacers spacing the second gate structure apart from the second source/drain regions. The first contact forms a first contact interface with one of the first source/drain regions. The second contact forms a second contact interface with one of the second source/drain regions. An area ratio of the first contact interface to top surface the first source/drain region is greater than an area ratio of the second contact interface to top surface of the second source/drain region.

Abstract: Disclosed are calibration techniques that can be implemented by a device that conducts biological tests. In certain embodiments, the device for testing a biological specimen includes a receiving mechanism to receive a carrier, a camera module arranged to capture imagery of the carrier, and a processor. Some examples of the processor can detect a calibration mode trigger. In calibration mode, the processor can divide the captured imagery into segments and selectively perform one or more calibration procedures for each segment. Then, the processor records a calibration result for each segment.

Abstract: A connection structure of a semiconductor device is provided in the present invention. The connection structure includes an interlayer dielectric, a top metal structure, and a passivation layer. The interlayer dielectric is disposed on a substrate. The top metal structure is disposed on the interlayer dielectric. The top metal structure includes a bottom portion and a top portion disposed on the bottom portion. The bottom portion includes a first sidewall, and the top portion includes a second sidewall. A slope of the first sidewall is larger than a slope of the second sidewall. The passivation layer is conformally disposed on the second sidewall, the first sidewall, and a top surface of the interlayer dielectric.

Abstract: Film-on-wire (FOW) based IC devices and FOW based methods for IC packaging are described. In an embodiment, a method for packaging an IC dies involves applying a film layer to IC dies and bond wires that are attached to a substrate or a leadframe to form a film-on-wire layer, where the IC dies and the bond wires are enclosed by the film-on-wire layer, and cutting the substrate or the leadframe into IC devices. Other embodiments are also described. The FOW based method for IC packaging can eliminate the need for molding in the IC packaging process and consequently, can reduce the cost of IC packaging and the dimensions of packaged IC devices.

Abstract: An ultrasonic humidifier includes a base that is formed with a recess, as well as a water tank and a mist spraying tube that are disposed on the base and that are in fluid communication with the recess. An ultrasonic oscillator is disposed in a bottom end of the recess for atomizing water in the recess. An ultraviolet light unit is disposed in said mist spraying tube.

Abstract: An ultrasonic humidifier includes a base that is formed with a recess, as well as a water tank and a mist spraying tube that are disposed on the base and that are in fluid communication with the recess. An ultrasonic oscillator is disposed in a bottom end of the recess for atomizing water in the recess. A mist purifying member is disposed within the mist spraying tube, and contains silver ions.

Abstract: The present invention discloses a method for reducing booting time of a computer system, and the method is applied in a computer booting process. If a computer receives an easy booting signal, the computer will read an easy booting data built in a basic input output system (BIOS) of the computer, start an operating system (OS) of the computer and enable at least one terminate-and-stay-resident (TSR) program of the operating system, such that the whole booting process can be completed quickly without wasting unnecessary time on self-testing all hardware devices for the booting process or loading all terminate-and-stay-resident programs.

Abstract: A display with a message prompt function and a playing method thereof are provided. A prompt message corresponding to a scheduled time is acquired and then played to remind a user, when the scheduled time set in a notepad is consistent with a real time after a comparison.

Abstract: A display with settings changed according to a user's ID and a method thereof, suitable for being applied to a display are provided. After the display has been powered on, the corresponding display settings are stored according to the user's ID. After inputting a user's ID, having been compared by a recognizing device, the display settings are updated to the state set by the user.

Abstract: A child wheeled vehicle includes a vehicle body, an operation bar, a push bar, and a braking device. The vehicle body includes a circular frame and a vibration-proof guard bar. A main frame has a front section provided with a foot tread plate and an upright pivot rod, a mediate section defining a receiving recess, and a rear section provided with two rear wheels and formed with a raised seat mounting portion for supporting a seat plate. The operation bar for controlling movement of the vehicle body has an upper section provided with a C-shaped bar, a mediate section pivoted with the pivot rod seat, and a lower section provided with a front wheel set. The push bar includes a sleeve section, a retractable section, and a locking member. The braking device includes a tread rod, a compression member, a snap ring, and a braking pad.