Patents by Inventor CHIHO CHO

CHIHO CHO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus for bonding flexible part including inclined leads
    Patent number: 10475728
    Abstract: An apparatus for bonding a flexible part including inclined leads is provided, more particularly, an apparatus for bonding a flexible part including inclined leads, which aligns parts to bond the parts is provided. According to the apparatus for bonding a flexible part including inclined leads, an electronic part may be easily bonded to a part having an inclined surface.
    Type: Grant
    Filed: February 13, 2018
    Date of Patent: November 12, 2019
    Assignee: PROTEC CO., LTD.
    Inventors: Moo Sup Shim, Seong Yong Ji, Hyoung Yeon Ju, Chiho Cho
  • Method for bonding flexible part including inclined leads
    Patent number: 10384286
    Abstract: A method of bonding a flexible part including inclined leads is provided, and more particularly, a method of bonding a flexible part including inclined leads, in which parts are aligned to bond the parts is provided. According to the method of bonding the flexible part including inclined leads, an electronic part may be easily bonded to a part having an inclined surface.
    Type: Grant
    Filed: February 13, 2018
    Date of Patent: August 20, 2019
    Assignee: PROTEC CO., LTD.
    Inventors: Moo Sup Shim, Seong Yong Ji, Hyoung Yeon Ju, Chiho Cho
  • METHOD FOR BONDING FLEXIBLE PART INCLUDING INCLINED LEADS
    Publication number: 20190001426
    Abstract: A method of bonding a flexible part including inclined leads is provided, and more particularly, a method of bonding a flexible part including inclined leads, in which parts are aligned to bond the parts is provided. According to the method of bonding the flexible part including inclined leads, an electronic part may be easily bonded to a part having an inclined surface.
    Type: Application
    Filed: February 13, 2018
    Publication date: January 3, 2019
    Applicant: PROTEC CO., LTD.
    Inventors: MOO SUP SHIM, SEONG YONG JI, HYOUNG YEON JU, CHIHO CHO
  • APPARATUS FOR BONDING FLEXIBLE PART INCLUDING INCLINED LEADS
    Publication number: 20180342445
    Abstract: An apparatus for bonding a flexible part including inclined leads is provided, more particularly, an apparatus for bonding a flexible part including inclined leads, which aligns parts to bond the parts is provided. According to the apparatus for bonding a flexible part including inclined leads, an electronic part may be easily bonded to a part having an inclined surface.
    Type: Application
    Filed: February 13, 2018
    Publication date: November 29, 2018
    Applicant: PROTEC CO., LTD.
    Inventors: MOO SUP SHIM, SEONG YONG JI, HYOUNG YEON JU, CHIHO CHO