Abstract: Apparatuses and methods for pre-emphasis control are described. An example apparatus includes a pull-up circuit and a pull-down circuit. The pull-up circuit is configured to receive a pull-up data activation signal and drive a data terminal to a pull-up voltage responsive to an active pull-up data activation signal. The pull-down circuit is configured to receive a pull-down activation signal and drive a data terminal to a pull-down voltage responsive to an active pull-down data activation signal. The example apparatus further includes a pre-emphasis circuit that includes a pre-emphasis timing control circuit configured to provide a timing control signal, and further includes a logic circuit. A pre-emphasis control signal based on at least one of the pull-up and pull-down data activation signals is provided to control providing pre-emphasis having a timing based on a mode of operation.

Abstract: Apparatuses and methods for pre-emphasis control are described. An example apparatus includes a pull-up circuit and a pull-down circuit. The pull-up circuit is configured to receive a pull-up data activation signal and drive a data terminal to a pull-up voltage responsive to an active pull-up data activation signal. The pull-down circuit is configured to receive a pull-down activation signal and drive a data terminal to a pull-down voltage responsive to an active pull-down data activation signal. The example apparatus further includes a pre-emphasis circuit that includes a pre-emphasis timing control circuit configured to provide a timing control signal, and further includes a logic circuit. A pre-emphasis control signal based on at least one of the pull-up and pull-down data activation signals is provided to control providing pre-emphasis having a timing based on a mode of operation.

Abstract: A semiconductor device includes an insulating substrate including a first surface and an opposing second surface, and a semiconductor chip. The semiconductor chip is mounted over the first surface, includes signal electrodes, power-supply electrodes and ground electrodes, which connect to pads on the first surface of the insulating substrate. Lands provided on the second surface of the insulating substrate include signal lands, power-supply lands and ground lands through vias penetrate from the first surface to the second surface of the insulating substrate, and include signal vias electrically connected the signal connection pads to the signal lands, power-supply vias electrically connected the power-supply connection pads to the power-supply lands and ground vias electrically connected the ground connection pads to the ground lands. At least one of the signal vias are closer to the connection pads than immediately adjacent one of the power-supply vias or the ground vias.

Abstract: A semiconductor device includes an insulating substrate including a first surface and an opposing second surface, and a semiconductor chip. The semiconductor chip is mounted over the first surface, includes signal electrodes, power-supply electrodes and ground electrodes, which connect to pads on the first surface of the insulating substrate. Lands provided on the second surface of the insulating substrate include signal lands, power-supply lands and ground lands through vias penetrate from the first surface to the second surface of the insulating substrate, and include signal vias electrically connected the signal connection pads to the signal lands, power-supply vias electrically connected the power-supply connection pads to the power-supply lands and ground vias electrically connected the ground connection pads to the ground lands. At least one of the signal vias are closer to the connection pads than immediately adjacent one of the power-supply vias or the ground vias.

Abstract: A semiconductor device includes an insulating substrate including a first surface and an opposing second surface, and a semiconductor chip. The semiconductor chip is mounted over the first surface, includes signal electrodes, power-supply electrodes and ground electrodes, which connect to pads on the first surface of the insulating substrate. Lands provided on the second surface of the insulating substrate include signal lands, power-supply lands and ground lands through vias penetrate from the first surface to the second surface of the insulating substrate, and include signal vias electrically connected the signal connection pads to the signal lands, power-supply vias electrically connected the power-supply connection pads to the power-supply lands and ground vias electrically connected the ground connection pads to the ground lands. At least one of the signal vias are closer to the connection pads than immediately adjacent one of the power-supply vias or the ground vias.