Patents by Inventor Chi-hoon Lee
Chi-hoon Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11760152Abstract: A Coupled Torsion Beam Axle (CTBA) bush may include an axial stiffness control portion which forms a cross section of a bush pipe 3 in a cross-sectional structure of additionally securing a gap, the bush pipe generating a rotation against an external load so that lateral stiffness performance and lateral steer performance are enhanced together; and a front and rear stiffness control portion which forms a bush mass in an X-shaped asymmetric bridge structure, the bush mass forming the bush pipe as an external diameter and forming a bush core as an internal diameter so that handling performance and ride comfort performance are enhanced together.Type: GrantFiled: July 15, 2020Date of Patent: September 19, 2023Assignees: Hyundai Motor Company, Kia Motors CorporationInventors: Shin-Ah Nam, Young-Kyoon Shin, Min-Soo Kang, Back-Gon Ko, Sung-Il Kim, Chi-Hoon Lee
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Patent number: 11494642Abstract: A thickness prediction network learning method includes measuring spectrums of optical characteristics of a plurality of semiconductor structures each including a substrate and first and second semiconductor material layers alternately stacked thereon to generate sets of spectrum measurement data, measuring thicknesses of the first and second semiconductor material layers to generate sets of thickness data, training a simulation network using the sets of spectrum measurement data and the sets of thickness data, generating sets of spectrum simulation data of spectrums of the optical characteristics of a plurality of virtual semiconductor structures based on thicknesses of first and second virtual semiconductor material layers using the simulation network, each of the first and second virtual semiconductor layers including the same material as the first and second semiconductor material layers, respectively; and training a thickness prediction network by using the sets of spectrum measurement data and the setsType: GrantFiled: November 8, 2019Date of Patent: November 8, 2022Assignees: Samsung Electronics Co., Ltd., Korea Advanced Institute of Science and TechnologyInventors: Su-il Cho, Sung-yoon Ryu, Yu-sin Yang, Chi-hoon Lee, Hyun-su Kwak, Jung-won Kim
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Publication number: 20210276391Abstract: A Coupled Torsion Beam Axle (CTBA) bush may include an axial stiffness control portion which forms a cross section of a bush pipe 3 in a cross-sectional structure of additionally securing a gap, the bush pipe generating a rotation against an external load so that lateral stiffness performance and lateral steer performance are enhanced together; and a front and rear stiffness control portion which forms a bush mass in an X-shaped asymmetric bridge structure, the bush mass forming the bush pipe as an external diameter and forming a bush core as an internal diameter so that handling performance and ride comfort performance are enhanced together.Type: ApplicationFiled: July 15, 2020Publication date: September 9, 2021Applicants: Hyundai Motor Company, Kia Motors CorporationInventors: Shin-Ah Nam, Young-Kyoon Shin, Min-Soo Kang, Back-Gon Ko, Sung-Il Kim, Chi-Hoon Lee
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Patent number: 10989520Abstract: A method for nondestructive measurement of an underlying layer thickness includes irradiating, with a pump laser pulse, a sample to induce generation of an acoustic wave in the sample such that the acoustic wave propagates through the sample over time, where the sample includes a substrate, an underlying layer on the substrate, and an overlying layer on the underlying layer and the underlying layer is isolated from an exterior of the sample by at least the overlying layer, irradiating the sample with a probe laser pulse after irradiating the sample with the pump laser pulse, determining a reflectance variation of the sample over time, based on monitoring a variation of a reflection of the probe laser pulse from the sample over time, to generate a first graph showing a variation of reflectance of the sample over time, and determining a thickness of the underlying layer based on the first graph.Type: GrantFiled: December 16, 2019Date of Patent: April 27, 2021Assignee: Samsung Electronics Co., Ltd.Inventors: Duck-mahn Oh, Jong-an Kim, Si-hyeon Choi, Young-hoon Sohn, Yu-sin Yang, Chi-hoon Lee
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Publication number: 20200208964Abstract: A method for nondestructive measurement of an underlying layer thickness includes irradiating, with a pump laser pulse, a sample to induce generation of an acoustic wave in the sample such that the acoustic wave propagates through the sample over time, where the sample includes a substrate, an underlying layer on the substrate, and an overlying layer on the underlying layer and the underlying layer is isolated from an exterior of the sample by at least the overlying layer, irradiating the sample with a probe laser pulse after irradiating the sample with the pump laser pulse, determining a reflectance variation of the sample over time, based on monitoring a variation of a reflection of the probe laser pulse from the sample over time, to generate a first graph showing a variation of reflectance of the sample over time, and determining a thickness of the underlying layer based on the first graph.Type: ApplicationFiled: December 16, 2019Publication date: July 2, 2020Applicant: Samsung Electronics Co., Ltd.Inventors: Duck-mahn OH, Jong-an Kim, Si-hyeon Choi, Young-hoon Sohn, Yu-sin Yang, Chi-hoon Lee
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Publication number: 20200193290Abstract: A thickness prediction network learning method includes measuring spectrums of optical characteristics of a plurality of semiconductor structures each including a substrate and first and second semiconductor material layers alternately stacked thereon to generate sets of spectrum measurement data, measuring thicknesses of the first and second semiconductor material layers to generate sets of thickness data, training a simulation network using the sets of spectrum measurement data and the sets of thickness data, generating sets of spectrum simulation data of spectrums of the optical characteristics of a plurality of virtual semiconductor structures based on thicknesses of first and second virtual semiconductor material layers using the simulation network, each of the first and second virtual semiconductor layers including the same material as the first and second semiconductor material layers, respectively; and training a thickness prediction network by using the sets of spectrum measurement data and the setsType: ApplicationFiled: November 8, 2019Publication date: June 18, 2020Applicant: Korea Advanced Institute of Science and TechnologyInventors: Su-il CHO, Sung-yoon RYU, Yu-sin YANG, Chi-hoon LEE, Hyun-su KWAK, Jung-won KIM
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Publication number: 20160092843Abstract: An electronic device, a method of managing a schedule, and a non-transitory computer-readable storage medium are provided. The electronic device includes a processor configured to acquire schedule-related information, acquire parsed data by parsing the acquired schedule-related information, and transmit the parsed data to a plurality of applications, and an output unit configured to output a result of processing the parsed data through the plurality of applications. The method includes acquiring schedule-related information; acquiring parsed data by parsing the acquired schedule-related information; transmitting the parsed data to a plurality of applications; and processing the parsed data through the plurality of applications.Type: ApplicationFiled: September 28, 2015Publication date: March 31, 2016Inventors: Da-Hey YOO, Yo-Han LEE, Chi-Hoon LEE
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Publication number: 20140059494Abstract: A method for providing an application list depending on an external device connected to a mobile device is provided. The method includes displaying a plurality of first shortcut keys for executing a plurality of first applications, on a display of the mobile device, determining whether the mobile device is connected to an external device, if the mobile device is connected to the external device, displaying on the display at least one second shortcut key for executing at least one second application, with which the external device can be used, among the plurality of first applications, determining whether the second shortcut key displayed on the display is selected, if the second shortcut key is selected, executing a second application corresponding to the selected second shortcut key in the mobile device, and displaying execution results of the second application on the display.Type: ApplicationFiled: August 23, 2013Publication date: February 27, 2014Applicant: Samsung Electronics Co., Ltd.Inventors: Chi-Hoon LEE, Sang-Hyuk KOH, Dong-Jun SHIN, Chul-Ho JANG, Eun-Sun KIM, Hwa-Young SONG, Hyung-Bo SIM, Yu-Jin LEE
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Publication number: 20140009388Abstract: A User Interface method and an apparatus therefor are provided. The method includes dividing a photographing region into a plurality of portions of the photographing region, acquiring corresponding information from respective image signals output while being classified according to the divided portion of the photographing region, verifying a command corresponding to the acquired information, and performing an operation according to the verified command.Type: ApplicationFiled: June 27, 2013Publication date: January 9, 2014Inventors: Ji-Young KANG, Mi-Jung PARK, Chi-Hoon LEE, Sae-Gee OH
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Publication number: 20130321368Abstract: An apparatus and a method for providing an image to allow a user to feel the perspective of images on a terminal depending on his or her gaze position and distance are provided. The apparatus includes a camera module for capturing a face image and a controller for displaying an image by rearranging a plurality of screen layers constituting the image depending on a change in positions of two eye images extracted from the face image captured by the camera module.Type: ApplicationFiled: May 15, 2013Publication date: December 5, 2013Applicant: Samsung Electronics Co., Ltd.Inventors: Chi-Hoon LEE, Ji-Young KANG, Mi-Jung PARK, Sae-Gee OH
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Patent number: 8255414Abstract: One embodiment selects from a set of query-suggestion pairs a first query and a subset of query-suggestion pairs that each has the first query as its query; computes a Log Likelihood Ratio (LLR) value for each query-suggestion pair from the subset of query-suggestion pairs; ranks the subset of query-suggestion pairs according to their respective LLR values; removes from the subset of query-suggestion pairs all query-suggestion pairs whose LLR values are below a predetermined LLR threshold; computes a Pointwise Mutual Information (PMI) value for each remaining query suggestion pair from the subset of query-suggestion pairs; removes from the subset of query-suggestion pairs all query-suggestion pairs whose PMI values are below a predetermine PMI threshold; and constructs a ranked set of suggestions for the first query, wherein the ranked set of suggestions comprises one or more suggestions of the remaining query-suggestion pairs from the subset of query-suggestion pairs.Type: GrantFiled: September 15, 2010Date of Patent: August 28, 2012Assignee: Yahoo! Inc.Inventors: Chi-Hoon Lee, Eric Crestan, Jiefeng Shen, Richard Allan Kasperski, Su-Lin Wu, Omer Emre Velipasaoglu, Benoit Dumoulin
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Publication number: 20120066195Abstract: One embodiment selects from a set of query-suggestion pairs a first query and a subset of query-suggestion pairs that each has the first query as its query; computes a Log Likelihood Ratio (LLR) value for each query-suggestion pair from the subset of query-suggestion pairs; ranks the subset of query-suggestion pairs according to their respective LLR values; removes from the subset of query-suggestion pairs all query-suggestion pairs whose LLR values are below a predetermined LLR threshold; computes a Pointwise Mutual Information (PMI) value for each remaining query suggestion pair from the subset of query-suggestion pairs; removes from the subset of query-suggestion pairs all query-suggestion pairs whose PMI values are below a predetermine PMI threshold; and constructs a ranked set of suggestions for the first query, wherein the ranked set of suggestions comprises one or more suggestions of the remaining query-suggestion pairs from the subset of query-suggestion pairs.Type: ApplicationFiled: September 15, 2010Publication date: March 15, 2012Applicant: YAHOO! INC.Inventors: Chi-Hoon Lee, Eric Crestan, Jiefeng Shen, Richard Allan Kasperski, Su-Lin Wu, Omer Emre Velipasaoglu, Benoit Dumoulin
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Patent number: 7916237Abstract: A liquid crystal display device has a reinforced rigidity against external impacts. The liquid crystal display device includes a liquid crystal display panel and a backlight assembly; and a bottom chassis disposed to receive the liquid crystal display panel and the backlight assembly, the bottom chassis having a projection projected from an inner surface of the bottom chassis towards the liquid crystal display panel and the backlight assembly.Type: GrantFiled: July 17, 2008Date of Patent: March 29, 2011Assignee: Samsung Mobile Display Co., Ltd.Inventors: Jai-sang Jung, Tae-yong Kim, Min-seop Kim, Jae-ho Jung, Chi-hoon Lee
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Publication number: 20090073342Abstract: A liquid crystal display device has a reinforced rigidity against external impacts. The liquid crystal display device includes a liquid crystal display panel and a backlight assembly; and a bottom chassis disposed to receive the liquid crystal display panel and the backlight assembly, the bottom chassis having a projection projected from an inner surface of the bottom chassis towards the liquid crystal display panel and the backlight assembly.Type: ApplicationFiled: July 17, 2008Publication date: March 19, 2009Inventors: Jai-sang Jung, Tae-yong Kim, Min-seop Kim, Jae-ho Jung, Chi-hoon Lee
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Publication number: 20080214009Abstract: Methods of forming a recess structure having a gentle curvature are provided. Such methods include forming a hard mask on a substrate, forming a first preliminary recess on the substrate using the hard mask as an etching mask and forming a spacer on a sidewall of the first preliminary recess. Methods may include forming a second preliminary recess from the first preliminary recess using the spacer as an etching mask and forming the recess structure having an enlarged lower portion from the second preliminary recess using the spacer as an etching mask.Type: ApplicationFiled: January 28, 2008Publication date: September 4, 2008Inventors: Chi-Hoon Lee, Jong-Chul Park, Tae-Woo Lee, Tae-Woo Kang, Jang-Bin Yim
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Patent number: 6835998Abstract: A fuse area structure in a semiconductor device and a method of forming the same are provided. The fuse area structure includes a protection film formed of a passivation film for preventing moisture from seeping into the sidewall of an exposed fuse opening. In order to form the protection film, an etching stop film is formed on a fuse line, and the fuse opening is formed at the same time using the etching stop film when a contact hole required for the semiconductor device is formed. A conductive material layer for forming an upper interconnection layer is formed on the entire surface of a resultant structure on which the contact hole and the fuse opening are formed. The conductive material layer formed on the fuse opening is removed. The exposed etching stop film is removed. Finally, the fuse area is completed by forming a passivation film on the entire surface of the resultant structure and removing the passivation film formed on the bottom of the fuse opening into which laser is to be irradiated.Type: GrantFiled: July 19, 2002Date of Patent: December 28, 2004Assignee: Samsung Electronics Co., Ltd.Inventors: Chi-hoon Lee, Young-hoon Park, Hyo-dong Ban, Sung-hoon Kho
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Patent number: 6696353Abstract: An integrated circuit chip having an anti-moisture-absorption film at the edge thereof and a method of forming the anti-moisture-absorption film are provided. In the integrated circuit chip which has predetermined devices inside and whose uppermost layer is covered with a passivation film, a trench is formed by etching interlayer dielectric films to a predetermined depth along the perimeter of the integrated circuit chip to be adjacent to the edge of the integrated circuit chip and an anti-moisture-absorption film is formed to fill the trench or is formed on the sidewall of the trench to a predetermined thickness, in order to prevent moisture from seeping into the edge of the integrated circuit chip. Moisture is effectively prevented from seeping into the edge of the chip by forming the anti-moisture-absorption film at the edge of the chip using the conventional processes of manufacturing the integrated circuit chip without an additional process.Type: GrantFiled: March 25, 2003Date of Patent: February 24, 2004Assignee: Samsung Electronics Co., Ltd.Inventors: Eun-young Minn, Young-hoon Park, Chi-Hoon Lee, Hyo-dong Ban
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Publication number: 20030181045Abstract: An integrated circuit chip having an anti-moisture-absorption film at the edge thereof and a method of forming the anti-moisture-absorption film are provided. In the integrated circuit chip which has predetermined devices inside and whose uppermost layer is covered with a passivation film, a trench is formed by etching interlayer dielectric films to a predetermined depth along the perimeter of the integrated circuit chip to be adjacent to the edge of the integrated circuit chip and an anti-moisture-absorption film is formed to fill the trench or is formed on the sidewall of the trench to a predetermined thickness, in order to prevent moisture from seeping into the edge of the integrated circuit chip. Moisture is effectively prevented from seeping into the edge of the chip by forming the anti-moisture-absorption film at the edge of the chip using the conventional processes of manufacturing the integrated circuit chip without an additional process.Type: ApplicationFiled: March 25, 2003Publication date: September 25, 2003Inventors: Eun-Young Minn, Young-Hoon Park, Chi-Hoon Lee, Hyo-Dong Ban
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Patent number: 6566735Abstract: An integrated circuit chip having an anti-moisture-absorption film at the edge thereof and a method of forming the anti-moisture-absorption film are provided. In the integrated circuit chip which has predetermined devices inside and whose uppermost layer is covered with a passivation film, a trench is formed by etching interlayer dielectric films to a predetermined depth along the perimeter of the integrated circuit chip to be adjacent to the edge of the integrated circuit chip and an anti-moisture-absorption film is formed to fill the trench or is formed on the sidewall of the trench to a predetermined thickness, in order to prevent moisture from seeping into the edge of the integrated circuit chip. Moisture is effectively prevented from seeping into the edge of the chip by forming the anti-moisture-absorption film at the edge of the chip using the conventional processes of manufacturing the integrated circuit chip without an additional process.Type: GrantFiled: November 17, 2000Date of Patent: May 20, 2003Assignee: Samsung Electronics Co., Ltd.Inventors: Eun-young Minn, Young-hoon Park, Chi-Hoon Lee, Hyo-dong Ban
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Patent number: RE46549Abstract: An integrated circuit chip having an anti-moisture-absorption film at the edge thereof and a method of forming the anti-moisture-absorption film are provided. In the integrated circuit chip which has predetermined devices inside and whose uppermost layer is covered with a passivation film, a trench is formed by etching interlayer dielectric films to a predetermined depth along the perimeter of the integrated circuit chip to be adjacent to the edge of the integrated circuit chip and an anti-moisture-absorption film is formed to fill the trench or is formed on the sidewall of the trench to a predetermined thickness, in order to prevent moisture from seeping into the edge of the integrated circuit chip. Moisture is effectively prevented from seeping into the edge of the chip by forming the anti-moisture-absorption film at the edge of the chip using the conventional processes of manufacturing the integrated circuit chip without an additional process.Type: GrantFiled: September 12, 2013Date of Patent: September 12, 2017Assignee: Conversant Intellectual Property Management Inc.Inventors: Eun-Young Minn, Young-Hoon Park, Chi-Hoon Lee, Hyo-Dong Ban