Abstract: A method of manufacturing a semiconductor device structure includes forming a bond or joint between a first device and a second device. The first device comprises an integrated passive device (IPD) and a first contact pad disposed over the IPD. The second device comprises a second contact pad. The first contact pad has a first surface with first lateral extents. The second contact pad has a second surface with second lateral extents. The width of the second lateral extents is less than the width of the first lateral extents. The joint structure includes the first contact pad, the second contact pad, and a solder layer interposed therebetween. The solder layer has tapered sidewalls extending in a direction away from the first surface of the first contact pad to the second surface of the second contact pad. At least one of the first surface or the second surface is substantially planar.

Abstract: A method for multi-link operation (MLO) is provided. The method for MLO may be applied to an apparatus. The method for MLO may include the following steps. A multi-chip controller of the apparatus may assign different data to a plurality of chips of the apparatus, wherein each chip corresponds to one link of multi-links. Each chip may determine whether transmission of the assigned data has failed. A first chip of the chips may transmit the assigned data to an access point (AP) in response to the first chip determining that the transmission of the assigned data has not failed.

Abstract: A semiconductor structure includes a first interposer; a second interposer laterally adjacent to the first interposer, where the second interposer is spaced apart from the first interposer; and a first die attached to a first side of the first interposer and attached to a first side of the second interposer, where the first side of the first interposer and the first side of the second interposer face the first die.

Abstract: A method for forming a via in a semiconductor device and a semiconductor device including the via are disclosed. In an embodiment, the method may include bonding a first terminal and a second terminal of a first substrate to a third terminal and a fourth terminal of a second substrate; separating the first substrate to form a first component device and a second component device; forming a gap fill material over the first component device, the second component device, and the second substrate; forming a conductive via extending from a top surface of the gap fill material to a fifth terminal of the second substrate; and forming a top terminal over a top surface of the first component device, the top terminal connecting the first component device to the fifth terminal of the second substrate through the conductive via.

Abstract: A device includes a first package connected to an interconnect substrate, wherein the interconnect substrate includes conductive routing; and a second package connected to the interconnect substrate, wherein the second package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler and to a photodetector; a via extending through the substrate; an interconnect structure over the photonic layer, wherein the interconnect structure is connected to the photodetector and to the via; and an electronic die bonded to the interconnect structure, wherein the electronic die is connected to the interconnect structure.

Abstract: A tip assembly of an umbrella is revealed. The tip assembly includes a tip rod detachably disposed on a distal end of an outer cylindrical rib of a rib and a protection piece arranged at a distal end of the tip rod. The tip rod is provided with a mounting hole for mounting the distal end of the outer cylindrical rib therein. The protection piece includes a curved outer surface and an inner surface opposite to the outer surface. The outer surface is abutting against respective support ends of a canopy, without exposed outside the canopy. The distal end of the tip rod is located at the inner surface of the protection piece to be protected thereon. Thereby the tip assembly will not have a sharp end or expose outside the canopy while the canopy is extended by the plurality of ribs.

Abstract: A special-shaped folding umbrella which includes a plurality of 3-fold ribs and a plurality of 4-fold ribs is revealed. When the umbrella is closed, a height of a first connecting point of the 3-fold rib and that of a first connecting point of the 4-fold rib are quite similar (almost the same). A height of a sixth connecting point of the 3-fold rib is at similar to that of a seventh connecting point of the 4-fold rib. A third connecting point of the 3-fold rib and a fourth connecting point of the 4-fold rib are at similar height and so are a fourth connecting point of the 3-fold rib and a fifth connecting point of the 4-fold rib. A tip of the 3-fold rib and a tip of the 4-fold rib are maintained at similar level while the umbrella is closed.

Abstract: The present invention reveals a manufacturing method of a fluororesin bundle having a plurality of fluororesin tube hold by a fixing element as a bundle. The bundle is pre-sealed when the ends of the fluororesin tubes are heated to a status being deformable and mount on the fixing element while being place in a vacuum environment and receive a thermal energy. Immersing the pre-sealed bundle into a heating pool to extend the mounted surface between the fluororesin tubes and the fixing element. Thus, a high quality fluororesin bundle can be done by using the above processes.

Abstract: A tip assembly of an umbrella is revealed. The tip assembly includes a tip rod detachably disposed on a distal end of an outer cylindrical rib of a rib and a protection piece arranged at a distal end of the tip rod. The tip rod is provided with a mounting hole for mounting the distal end of the outer cylindrical rib therein. The protection piece includes a curved outer surface and an inner surface opposite to the outer surface. The outer surface is abutting against respective support ends of a canopy, without exposed outside the canopy. The distal end of the tip rod is located at the inner surface of the protection piece to be protected thereon. Thereby the tip assembly will not have a sharp end or expose outside the canopy while the canopy is extended by the plurality of ribs.

Abstract: A special-shaped folding umbrella which includes a plurality of 3-fold ribs and a plurality of 4-fold ribs is revealed. When the umbrella is closed, a height of a first connecting point of the 3-fold rib and that of a first connecting point of the 4-fold rib are quite similar (almost the same). A height of a sixth connecting point of the 3-fold rib is at similar to that of a seventh connecting point of the 4-fold rib. A third connecting point of the 3-fold rib and a fourth connecting point of the 4-fold rib are at similar height and so are a fourth connecting point of the 3-fold rib and a fifth connecting point of the 4-fold rib. A tip of the 3-fold rib and a tip of the 4-fold rib are maintained at similar level while the umbrella is closed.

Abstract: The present invention reveals a manufacturing method of a fluororesin bundle having a plurality of fluororesin tube hold by a fixing element as a bundle. The bundle is pre-sealed when the ends of the fluororesin tubes are heated to a status being deformable and mount on the fixing element while being place in a vacuum environment and receive a thermal energy. Immersing the pre-sealed bundle into a heating pool to extend the mounted surface between the fluororesin tubes and the fixing element. Thus, a high quality fluororesin bundle can be done by using the above processes.

Abstract: A method using light energy to excite brain waves and method using the same employ a light-power light source module in collaboration with a control module to apply a non-intrusive light energy stimulation at a specific frequency to users' skin so as to generate potential variation of brain wave of users. The device can be operated at different frequencies to stimulate nerves under skin and further affect the potential of brain waves, thereby improving functional imbalance such as anxiety, tension, uneasiness and insomnia.