Patents by Inventor Chii-Ming W Wu

Chii-Ming W Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7705464
    Abstract: The present disclosure relates generally to the manufacturing of semiconductor devices, and more particularly to an improved connection structure for semiconductor devices. A connection structure for a semiconductor device includes: a peanut-shaped opening comprising a narrow area and one or more wide areas, wherein the narrow area is between two of the one or more wide areas; and a conductive plug for filling at least partially the peanut-shaped opening.
    Type: Grant
    Filed: September 13, 2004
    Date of Patent: April 27, 2010
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jhon Jhy Liaw, Sung-Chun Hsieh, Wesley Lin, Chii-Ming W Wu, Ren-Fen Tsui