Patents by Inventor Chika MATSUI

Chika MATSUI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11562979
    Abstract: A power module includes a plurality of conductive wire groups and a sealing member. The plurality of conductive wire groups each include a first bonded portion and a second bonded portion. A maximum gap between intermediate portions of a pair of conductive wire groups adjacent to each other is larger than a first gap between the first bonded portions of the pair of conductive wire groups adjacent to each other. The maximum gap between the intermediate portions of the pair of conductive wire groups adjacent to each other is larger than a second gap between the second bonded portions of the pair of conductive wire groups adjacent to each other. Therefore, the power module is improved in reliability.
    Type: Grant
    Filed: June 18, 2019
    Date of Patent: January 24, 2023
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Chika Matsui, Junji Fujino, Satoshi Kondo, Masao Uchigasaki
  • Publication number: 20210217724
    Abstract: A power module includes a plurality of conductive wire groups and a sealing member. The plurality of conductive wire groups each include a first bonded portion and a second bonded portion. A maximum gap between intermediate portions of a pair of conductive wire groups adjacent to each other is larger than a first gap between the first bonded portions of the pair of conductive wire groups adjacent to each other. The maximum gap between the intermediate portions of the pair of conductive wire groups adjacent to each other is larger than a second gap between the second bonded portions of the pair of conductive wire groups adjacent to each other. Therefore, the power module is improved in reliability.
    Type: Application
    Filed: June 18, 2019
    Publication date: July 15, 2021
    Applicant: Mitsubishi Electric Corporation
    Inventors: Chika MATSUI, Junji FUJINO, Satoshi KONDO, Masao UCHIGASAKI
  • Publication number: 20190393184
    Abstract: A semiconductor element, a substrate on which the semiconductor element is mounted, a connecting portion formed constituted by an arrangement of a plurality of wirings, a casing in which the substrate is disposed on a side of a bottom surface thereof and the semiconductor element and the connecting portion are accommodated therein, and an insulating sealing material filled in the casing, are provided. The plurality of wirings constituting the connecting portion are aligned in a loop shape in a same direction, and each height thereof is arranged such that each of the wiring has a height which is gradually increased one after another toward one direction in the arrangement.
    Type: Application
    Filed: May 14, 2019
    Publication date: December 26, 2019
    Applicant: Mitsubishi Electric Corporation
    Inventors: Satoshi KONDO, Junji FUJINO, Chika MATSUI