Patents by Inventor Chika Sugi

Chika Sugi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bonded structure of dissimilar metallic materials and method of joining dissimilar metallic materials
    Patent number: 10173281
    Abstract: Disclosed herein are bonded structures and methods of forming the same. One embodiment of a bonded structure comprises first and second metallic layers and a bonding interface between the first and second metallic layers formed by diffusion and comprising a layer of at least one intermetallic compound. The intermetallic compound layer is formed in an area 52% or greater of an area of the bonding interface and has a thickness of 0.5 to 3.2 ?m.
    Type: Grant
    Filed: January 31, 2014
    Date of Patent: January 8, 2019
    Assignee: Nissan Motor Co., Ltd.
    Inventors: Hiroshi Sakurai, Shigeyuki Nakagawa, Akira Fukushima, Sadao Yanagida, Chika Sugi
  • Bonded Structure of Dissimilar Metallic Materials and Method of Joining Dissimilar Metallic Materials
    Publication number: 20140144889
    Abstract: Disclosed herein are bonded structures and methods of forming the same. One embodiment of a bonded structure comprises first and second metallic layers and a bonding interface between the first and second metallic layers formed by diffusion and comprising a layer of at least one intermetallic compound. The intermetallic compound layer is formed in an area 52% or greater of an area of the bonding interface and has a thickness of 0.5 to 3.2 ?m.
    Type: Application
    Filed: January 31, 2014
    Publication date: May 29, 2014
    Applicant: Nissan Motor Co., Ltd.
    Inventors: Hiroshi Sakurai, Shigeyuki Nakagawa, Akira Fukushima, Sadao Yanagida, Chika Sugi
  • BONDED STRUCTURE OF DISSIMILAR METALLIC MATERIALS AND METHOD OF JOINING DISSIMILAR METALLIC MATERIALS
    Publication number: 20110123825
    Abstract: Disclosed herein are bonded structures and methods of forming the same. One embodiment of a bonded structure comprises first and second metallic layers and a bonding interface between the first and second metallic layers formed by diffusion and comprising a layer of at least one intermetallic compound. The intermetallic compound layer is formed in an area 52% or greater of an area of the bonding interface and has a thickness of 0.5 to 3.2 ?m.
    Type: Application
    Filed: August 7, 2008
    Publication date: May 26, 2011
    Applicant: NISSAN MOTOR CO., LTD.
    Inventors: Hiroshi Sakurai, Shigeyuki Nakagawa, Akira Fukushima, Sadao Yanagida, Chika Sugi