Patents by Inventor Chikage Katou

Chikage Katou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8946889
    Abstract: A semiconductor module is provided which includes a semiconductor unit which is made by a resin mold. The resin mold has formed therein a coolant path through which a coolant flows to cool a semiconductor chip embedded in the resin mold. The resin mold also includes heat spreaders, and electric terminals embedded therein. Each of the heat spreaders has a fin heat sink exposed to the flow of the coolant. The fin heat sink is welded to a surface of each of the heat spreaders through an insulator, thus minimizing an electrical leakage from the heat spreader to the coolant.
    Type: Grant
    Filed: November 4, 2013
    Date of Patent: February 3, 2015
    Assignee: Denso Corporation
    Inventors: Chikage Katou, Hiroaki Arai, Yoshiyuki Yamauchi, Yasuou Yamazaki, Naoki Sugimoto, Yasuyuki Sakai
  • Publication number: 20140091452
    Abstract: A semiconductor module is provided which includes a semiconductor unit which is made by a resin mold. The resin mold has formed therein a coolant path through which a coolant flows to cool a semiconductor chip embedded in the resin mold. The resin mold also includes heat spreaders, and electric terminals embedded therein. Each of the heat spreaders has a fin heat sink exposed to the flow of the coolant. The fin heat sink is welded to a surface of each of the heat spreaders through an insulator, thus minimizing an electrical leakage from the heat spreader to the coolant.
    Type: Application
    Filed: November 4, 2013
    Publication date: April 3, 2014
    Applicant: DENSO CORPORATION
    Inventors: Chikage Katou, Hiroaki Arai, Yoshiyuki Yamauchi, Yasuou Yamazaki, Naoki Sugimoto, Yasuyuki Sakai