Patents by Inventor Chikako van Koten nee Kitabayashi

Chikako van Koten nee Kitabayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead frame and semiconductor device
    Patent number: RE37690
    Abstract: A lead frame and a semiconductor device wherein a through hole is formed in the center of a semiconductor chip-mounting surface of a chip pad at the center of the lead frame, the through hole being tapered or being one which corresponds to a surface area that is greater on the surface of the chip-mounting surface of the chip pad than on the surface of the side opposite to the chip-mounting surface thereof. This prevents the occurrence of cracks in the sealing plastic portion in the step of reflow soldering of the lead frame to the substrate.
    Type: Grant
    Filed: May 24, 1995
    Date of Patent: May 7, 2002
    Assignee: Hitachi, Ltd.
    Inventors: Makoto Kitano, Sueo Kawai, Asao Nishimura, Hideo Miura, Akihiro Yaguchi, Chikako van Koten nee Kitabayashi, Ichio Shimizu, Toshio Hatsuda, Toshinori Ozaki, Toshio Hattori, Souji Sakata