Abstract: An object is to provide a probe card that enables probes to be arranged at a narrow pitch while causing the probes being inserted through guide holes of a guide plate to be locked to the guide plate so as not to fall out. Two or more probes 200 and a first guide plate 14 including two or more first guide holes 14h through which the probes 200 are inserted, respectively, are provided. The probe 200 is arranged so as to be inclined with respect to the first guide plate 14, and has a locking portion 21 formed by causing a side surface 210 on a first direction dl side, which is a side surface above the first guide plate 14 and has an acute angle with respect to the first guide plate 14, to protrude, and an offset portion 22 formed by offsetting a side surface 220 on a second direction d2 side, which is a side surface above the first guide plate 14 and has an obtuse angle with respect to the first guide plate 14, to the locking portion side 21.

Abstract: Disclosed is a probe card ease for accommodating a probe card. The probe card case includes: a first case member configured to mount the probe card at a predetermined position therein; a second case member configured to be fitted to a top side of the first case member, and including a card fixing mechanism for fixing the probe card; and a case fixing mechanism configured to fix the first case member and the second case member. The probe card is capable of being transferred in a state where the probe card is accommodated in the probe card case and the first case member and the second case member are fixed, and the probe card is capable of being transferred only with the second case member in a state where the probe card is fixed to the second case member.

Abstract: A probe guide plate includes: a silicon substrate including one surface and the other surface opposite to the one surface; a through hole formed through the silicon substrate to extend from the one surface of the silicon substrate to the other surface of the silicon substrate; a silicon oxide layer formed on the one surface of the silicon substrate, the other surface of the silicon substrate, and an inner wall surface of the through hole; and a protective insulating layer formed on the silicon oxide layer. The protective insulating layer is formed on at least one of the one surface and the other surface of the silicon substrate via the silicon oxide layer, and partially formed on the inner wall surface of the through hole via the silicon oxide layer.

Abstract: Disclosed is a probe card case for accommodating a probe card. The probe card case includes: a first case member configured to mount the probe card at a predetermined position therein; a second case member configured to be fitted to a top side of the first case member, and including a card fixing mechanism for fixing the probe card; and a case fixing mechanism configured to fix the first case member and the second case member. The probe card is capable of being transferred in a state where the probe card is accommodated in the probe card case and the first case member and the second case member are fixed, and the probe card is capable of being transferred only with the second case member in a state where the probe card is fixed to the second case member.

Abstract: OBJECT To improve the strength of a probe guide and improve the abrasion resistance of the probe guide. MEANS FOR SETTLEMENT A guide plate 20 is formed of a silicon plate 22 having guide holes 23 respectively adapted to support contact probes 13, the inner walls of the guide holes 23 include a guide film 25 formed on the inner wall surfaces of corresponding penetration-processed holes 24 of the silicon plate 22, the cross-sectional areas of the penetration-processed holes 24 gradually increase toward a first surface of the silicon plate 22, and the film thickness of the guide film 25 gradually increases toward the first surface of the silicon plate 22. By employing such a configuration, as compared with the tilts of the inner wall surfaces of the penetration-processed holes 24, the tilts of the inner wall surfaces of the guide holes 23 can be suppressed, and the strength of the silicon plate 20 can be improved. Accordingly, the abrasion resistance of a probe guide 100 can be improved.

Abstract: OBJECT To improve the strength of a probe guide and improve the abrasion resistance of the probe guide. MEANS FOR SETTLEMENT A guide plate 20 is formed of a silicon plate 22 having guide holes 23 respectively adapted to support contact probes 13, the inner walls of the guide holes 23 include a guide film 25 formed on the inner wall surfaces of corresponding penetration-processed holes 24 of the silicon plate 22, the cross-sectional areas of the penetration-processed holes 24 gradually increase toward a first surface of the silicon plate 22, and the film thickness of the guide film 25 gradually increases toward the first surface of the silicon plate 22. By employing such a configuration, as compared with the tilts of the inner wall surfaces of the penetration-processed holes 24, the tilts of the inner wall surfaces of the guide holes 23 can be suppressed, and the strength of the silicon plate 20 can be improved. Accordingly, the abrasion resistance of a probe guide 100 can be improved.

Abstract: Disclosed is a probe card ease for accommodating a probe card. The probe card case includes: a first case member configured to mount the probe card at a predetermined position therein; a second case member configured to be fitted to a top side of the first case member, and including a card fixing mechanism for fixing the probe card; and a case fixing mechanism configured to fix the first case member and the second case member. The probe card is capable of being transferred in a state where the probe card is accommodated in the probe card case and the first case member and the second case member are fixed, and the probe card is capable of being transferred only with the second case member in a state where the probe card is fixed to the second case member.

Abstract: A probe guide plate includes: a silicon substrate including one surface and the other surface opposite to the one surface; a through hole formed through the silicon substrate to extend from the one surface of the silicon substrate to the other surface of the silicon substrate; a silicon oxide layer formed on the one surface of the silicon substrate, the other surface of the silicon substrate, and an inner wall surface of the through hole; and a protective insulating layer formed on the silicon oxide layer. The protective insulating layer is formed on at least one of the one surface and the other surface of the silicon substrate via the silicon oxide layer, and partially formed on the inner wall surface of the through hole via the silicon oxide layer.

Abstract: Disclosed is a probe card case for accommodating a probe card. The probe card case includes: a first case member configured to mount the probe card at a predetermined position therein; a second case member configured to be fitted to a top side of the first case member, and including a card fixing mechanism for fixing the probe card; and a case fixing mechanism configured to fix the first case member and the second case member. The probe card is capable of being transferred in a state where the probe card is accommodated in the probe card case and the first case member and the second case member are fixed, and the probe card is capable of being transferred only with the second case member in a state where the probe card is fixed to the second case member.

Abstract: [Problem] It is aimed to provide a probe whose handling is easy at probe replacement and mounting times and which allows arrangement at a narrow pitch. [Solving Means] A probe is composed of a mounting portion mounted on an electrode of a probe card, an arm portion extending from the mounting portion, and a leading end portion provided at a leading end of the arm portion and contacting with an electrode of an object to be tested, where a handling plate held by a probe hand mechanism holding a probe is provided.

Abstract: A probe card includes a main substrate, a main reinforcing plate attached to the upper surface of the main substrate, a sub-reinforcing plate attached to the upper surface of the main reinforcing plate, and coupling force adjusting means that couples the main reinforcing plate with the sub-reinforcing plate and adjusts the coupling force therebetween. The coupling force adjusting means has a plurality of threaded holes provided at intersections of a plurality of imaginary concentric circles, which is provided with a distance from a center of a probe card on a surface of the sub-reinforcing plate, and a plurality of imaginary straight lines, which is provided radially from the center at an predetermined angle; a plurality of screw holes provided at same intersections on a surface of the main reinforcing plate; and a plurality of coupling screws threaded selectively into the threaded holes 23a and the screw holes.

Abstract: The probe card to be used for the measurement of the electrical characteristics of a semiconductor device such as an LSI chip and comprising the contactor mounting substrate on which a plurality of contactors are provided, in which the contactor comprises an insertion part for mounting the contactor on the contactor mounting substrate, a support part for supporting the insertion part and performing positioning in the height direction by contacting a surface of the, contactor mounting substrate, an arm part extending from the support part, and a contact part arranged at a tip end of the arm part to come in contact with an electrode of an object to be tested, and the insertion part is detachably mounted on an electrode hole provided in the surface of the contactor mounting substrate and made to be conductive by a wiring pattern. In some embodiments, a contactor includes a holding part and/or pressurized part integrated with the supporting part.

Abstract: Probe card for examining semiconductor devices on semiconductor wafers that allows the members configuring the probe card to be easily separated and assembled, prevents the occurrence of electrical conduction failure between electrodes and achieves high electrical contact and high reliability. The probe card is used for measuring electrical properties of a measuring object and includes a space transformer including a plurality of contacts contacting an electrode pad of the measuring object on one surface and a plurality of connecting pins on a surface opposite the surface with the contact, a main substrate including a plurality of first connecting electrodes contacting an electrode pad of measuring equipment, and a sub-substrate including a plurality of through-holes, through which the connecting pin is inserted between the main substrate and the space transformer, for electrically conducting with the first connecting electrode, where the sub-substrate and the main substrate are coupled together.

Abstract: A probe card including a substrate body, a contactor unit provided below the substrate body for establishing an electrical contact with the subject to be tested as well as for establishing an electrical contact with the substrate body, a supporting device for supporting the contactor unit from below with elastic force and parallelism adjusting screws that come in contact with the contactor unit from above in a vertical direction for adjusting a degree of parallelism of the contactor unit. In particular, the supporting device is configured to include a coil spring interposed toward a vertical direction between a flange section provided at the inside section of the support member arranged below the substrate body and a flange section provided at the outside section of the contactor unit.

Abstract: The present invention relates to a probe card which measures electrical characteristics of a semiconductor device such as an LSI chip and it is an object to provide a mounting structure of a contactor which comes in contact with the semiconductor device. The probe card has a contactor mounting substrate on which a plurality of contactors are provided, in which the contactor comprises an insertion part for mounting the contactor on the contactor mounting substrate, a support part for supporting the insertion part and performing positioning in the height direction by contacting a surface of the, contactor mounting substrate, an arm part extending from the support part, and a contact part arranged at a tip end of the arm part to come in contact with an electrode of an object to be tested, and the insertion part is detachably mounted on an electrode hole provided in the surface of the contactor mounting substrate and made to be conductive by a wiring pattern.

Abstract: A probe card includes a main substrate, a main reinforcing plate attached to the upper surface of the main substrate, a sub-reinforcing plate attached to the upper surface of the main reinforcing plate, and coupling force adjusting means that couples the main reinforcing plate with the sub-reinforcing plate and adjusts the coupling force therebetween. The coupling force adjusting means has a plurality of threaded holes provided at intersections of a plurality of imaginary concentric circles, which is provided with a distance from a center of a probe card on a surface of the sub-reinforcing plate, and a plurality of imaginary straight lines, which is provided radially from the center at an predetermined angle; a plurality of screw holes provided at same intersections on a surface of the main reinforcing plate; and a plurality of coupling screws threaded selectively into the threaded holes 23a and the screw holes.

Abstract: A probe card used for measuring electrical characteristics of a semiconductor device such as an LSI chip and comprising a contactor mounting substrate on which a plurality of contactors are arranged, in which the contactor comprises an insertion part for mounting the contactor on the contactor mounting substrate, a support part for supporting the insertion part and performing positioning in the height direction by contacting a surface of the contactor mounting substrate, an arm part extending from the support part, and a contact part arranged at a tip end of the arm part to come in contact with an electrode of an object to be tested, and the insertion part is detachably mounted on an electrode hole provided in the surface of the contactor mounting substrate and made to be conductive by a wiring pattern.

Abstract: It is an object of the present invention to provide a connection pin for a probe card which measures electrical characteristics of a semiconductor device such as a LSI ship. The connection pin for the probe card which tests the semiconductor device has a U-shaped or V-shaped spring part manufactured by etching or pressing of metal.

Abstract: The present invention relates to a probe card which measures electrical characteristics of a semiconductor device such as an LSI chip and it is an object to provide a mounting structure of a contactor which comes in contact with the semiconductor device. The probe card has a contactor mounting substrate on which a plurality of contactors are provided, in which the contactor comprises an insertion part for mounting the contactor on the contactor mounting substrate, a support part for supporting the insertion part and performing positioning in the height direction by contacting a surface of the, contactor mounting substrate, an arm part extending from the support part, and a contact part arranged at a tip end of the arm part to come in contact with an electrode of an object to be tested, and the insertion part is detachably mounted on an electrode hole provided in the surface of the contactor mounting substrate and made to be conductive by a wiring pattern.