Patents by Inventor Chikara Kaneta

Chikara Kaneta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor module and method of manufacturing the same
    Patent number: 7332808
    Abstract: A semiconductor module according to the invention includes: an island formed of a conductive material; a plurality of leads disposed in vicinity of the island; a resin sealing body which is mounted on the island and disposed such that a back surface of a circuit board on which semiconductor elements is exposed upward; a sensor which is mounted on the back surface of the circuit board; and a thin metallic wire which electrically connects the circuit board with the leads. The island, the resin sealing body, the sensor, and parts of the leads are sealed by a second sealing resin.
    Type: Grant
    Filed: March 29, 2006
    Date of Patent: February 19, 2008
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Noriaki Sakamoto, Chikara Kaneta, Yoshihiko Yanase, Yoshiyuki Kobayashi
  • Semiconductor module and method of manufacturing the same
    Publication number: 20060220189
    Abstract: A semiconductor module according to the invention includes: an island formed of a conductive material; a plurality of leads disposed in vicinity of the island; a resin sealing body which is mounted on the island and disposed such that a back surface of a circuit board on which semiconductor elements is exposed upward; a sensor which is mounted on the back surface of the circuit board; and a thin metallic wire which electrically connects the circuit board with the leads. The island, the resin sealing body, the sensor, and parts of the leads are sealed by a second sealing resin.
    Type: Application
    Filed: March 29, 2006
    Publication date: October 5, 2006
    Inventors: Noriaki Sakamoto, Chikara Kaneta, Yoshihiko Yanase, Yoshiyuki Kobayashi