Patents by Inventor Chikara MAEDA

Chikara MAEDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220341610
    Abstract: A residual value calculation system is for an air conditioner including an indoor unit and an outdoor unit. The residual value calculation system includes a management device that manages the air conditioner. The management device includes an obtaining unit and a calculating unit. The obtaining unit obtains first environment information related to an installation environment of the indoor unit, and second environment information related to an installation environment of the outdoor unit. The calculating unit calculates a residual value of the air conditioner after use over a set period based on the first environment information and the second environment information, the residual value including at least one of an initial estimation residual value and an actual estimation residual value based on actual use.
    Type: Application
    Filed: September 29, 2020
    Publication date: October 27, 2022
    Inventors: Chikara MAEDA, Yasutaka NARIKIYO
  • Publication number: 20220189762
    Abstract: A substrate processing method includes a processing liquid film forming step of supplying a processing liquid, containing a sublimable substance, to a pattern forming surface of a substrate, to form a processing liquid film on the pattern forming surface, a temperature maintaining step of maintaining a temperature of the processing liquid film, formed on the pattern forming surface, in a temperature range not lower than a melting point of the sublimable substance and lower than a boiling point of the sublimable substance, a film thinning step of thinning the processing liquid film while the temperature of the processing liquid film is in the temperature range, a freezing step of making the processing liquid film, thinned by the film thinning step, freeze on the pattern forming surface after the temperature maintaining step to form a frozen body of the sublimable substance, and a sublimating step of sublimating the frozen body to remove the frozen body from the pattern forming surface.
    Type: Application
    Filed: March 4, 2022
    Publication date: June 16, 2022
    Inventors: Manabu OKUTANI, Hiroaki TAKAHASHI, Masayuki OTSUJI, Hiroshi ABE, Chikara MAEDA, Hitoshi NAKAI, Yuta SASAKI
  • Patent number: 11302525
    Abstract: A substrate processing method includes a processing liquid film forming step of supplying a processing liquid, containing a sublimable substance, to a pattern forming surface of a substrate, to form a processing liquid film on the pattern forming surface, a temperature maintaining step of maintaining a temperature of the processing liquid film, formed on the pattern forming surface, in a temperature range not lower than a melting point of the sublimable substance and lower than a boiling point of the sublimable substance, a film thinning step of thinning the processing liquid film while the temperature of the processing liquid film is in the temperature range, a freezing step of making the processing liquid film, thinned by the film thinning step, freeze on the pattern forming surface after the temperature maintaining step to form a frozen body of the sublimable substance, and a sublimating step of sublimating the frozen body to remove the frozen body from the pattern forming surface.
    Type: Grant
    Filed: September 20, 2018
    Date of Patent: April 12, 2022
    Inventors: Manabu Okutani, Hiroaki Takahashi, Masayuki Otsuji, Hiroshi Abe, Chikara Maeda, Hitoshi Nakai, Yuta Sasaki
  • Publication number: 20210331192
    Abstract: A substrate processing method includes a first processing liquid supplying step of supplying a first processing liquid to an upper surface of the substrate, a holding layer forming step of solidifying or curing the first processing liquid to form a particle holding layer on the upper surface of the substrate, a holding layer removing step of peeling and removing the particle holding layer from the upper surface of the substrate, a liquid film forming step of forming, after removing the particle holding layer from the substrate, a liquid film of the second processing liquid, a solidifying step of cooling the liquid film to a temperature not more than a melting point of the sublimable substance to make the liquid film solidify on the substrate and form a solid film, and a sublimating step of sublimating and thereby removing the solid film from the substrate.
    Type: Application
    Filed: June 28, 2021
    Publication date: October 28, 2021
    Inventors: Yukifumi YOSHIDA, Hiroaki TAKAHASHI, Masayuki OTSUJI, Manabu OKUTANI, Chikara MAEDA, Hiroshi ABE, Shuichi YASUDA, Yasunori KANEMATSU
  • Patent number: 11101147
    Abstract: A substrate processing method includes a first processing liquid supplying step of supplying a first processing liquid to an upper surface of the substrate, a holding layer forming step of solidifying or curing the first processing liquid to form a particle holding layer on the upper surface of the substrate, a holding layer removing step of peeling and removing the particle holding layer from the upper surface of the substrate, a liquid film forming step of forming, after removing the particle holding layer from the substrate, a liquid film of the second processing liquid, a solidifying step of cooling the liquid film to a temperature not more than a melting point of the sublimable substance to make the liquid film solidify on the substrate and form a solid film, and a sublimating step of sublimating and thereby removing the solid film from the substrate.
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: August 24, 2021
    Inventors: Yukifumi Yoshida, Hiroaki Takahashi, Masayuki Otsuji, Manabu Okutani, Chikara Maeda, Hiroshi Abe, Shuichi Yasuda, Yasunori Kanematsu
  • Patent number: 10530154
    Abstract: A control apparatus includes a receiving unit, a demand response unit, a power consumption fluctuation unit, a fluctuation-amount-estimation unit and an adjustment control execution unit. The receiving unit receives a demand pertaining to power consumption sent from an energy management apparatus. The demand response unit executes a demand-response control in order to adjust total power consumption of a plurality of devices set up in a property in accordance with the demand. The power consumption fluctuation unit executes a non-demand-response control in order to cause total power consumption to fluctuate regardless of the demand. The fluctuation-amount-estimation unit estimates a power consumption that will fluctuate due to the non-demand-response control during the demand-response control.
    Type: Grant
    Filed: July 2, 2014
    Date of Patent: January 7, 2020
    Assignee: Daikin Industries, Ltd.
    Inventor: Chikara Maeda
  • Publication number: 20190176179
    Abstract: A substrate processing method includes a first processing liquid supplying step of supplying a first processing liquid to an upper surface of the substrate, a holding layer forming step of solidifying or curing the first processing liquid to form a particle holding layer on the upper surface of the substrate, a holding layer removing step of peeling and removing the particle holding layer from the upper surface of the substrate, a liquid film forming step of forming, after removing the particle holding layer from the substrate, a liquid film of the second processing liquid, a solidifying step of cooling the liquid film to a temperature not more than a melting point of the sublimable substance to make the liquid film solidify on the substrate and form a solid film, and a sublimating step of sublimating and thereby removing the solid film from the substrate.
    Type: Application
    Filed: November 29, 2018
    Publication date: June 13, 2019
    Inventors: Yukifumi YOSHIDA, Hiroaki TAKAHASHI, Masayuki OTSUJI, Manabu OKUTANI, Chikara MAEDA, Hiroshi ABE, Shuichi YASUDA, Yasunori KANEMATSU
  • Publication number: 20190091736
    Abstract: A substrate processing method includes a processing liquid film forming step of supplying a processing liquid, containing a sublimable substance, to a pattern forming surface of a substrate, to form a processing liquid film on the pattern forming surface, a temperature maintaining step of maintaining a temperature of the processing liquid film, formed on the pattern forming surface, in a temperature range not lower than a melting point of the sublimable substance and lower than a boiling point of the sublimable substance, a film thinning step of thinning the processing liquid film while the temperature of the processing liquid film is in the temperature range, a freezing step of making the processing liquid film, thinned by the film thinning step, freeze on the pattern forming surface after the temperature maintaining step to form a frozen body of the sublimable substance, and a sublimating step of sublimating the frozen body to remove the frozen body from the pattern forming surface.
    Type: Application
    Filed: September 20, 2018
    Publication date: March 28, 2019
    Inventors: Manabu OKUTANI, Hiroaki TAKAHASHI, Masayuki OTSUJI, Hiroshi ABE, Chikara MAEDA, Hitoshi NAKAI, Yuta SASAKI
  • Patent number: 10074980
    Abstract: A control apparatus includes a receiving unit, a demand-response unit, a power consumption fluctuation unit, and a setting unit. The receiving unit receives a demand relating to power consumption from an energy management apparatus. The demand-response unit executes a demand-response control in order to adjust power consumption of facility devices set up in a property in accordance with the demand when the demand is received by the receiving unit. The power consumption fluctuation unit executes a non-demand-response control in order to increase or decrease power consumption of the facility devices regardless of the demand. The setting unit sets the non-demand-response control to active or inactive.
    Type: Grant
    Filed: August 22, 2014
    Date of Patent: September 11, 2018
    Assignee: Daikin Industries, Ltd.
    Inventor: Chikara Maeda
  • Publication number: 20160218507
    Abstract: A control apparatus includes a receiving unit, a demand response unit, a power consumption fluctuation unit, a fluctuation-amount-estimation unit and an adjustment control execution unit. The receiving unit receives a demand pertaining to power consumption sent from an energy management apparatus. The demand response unit executes a demand-response control in order to adjust total power consumption of a plurality of devices set up in a property in accordance with the demand. The power consumption fluctuation unit executes a non-demand-response control in order to cause total power consumption to fluctuate regardless of the demand. The fluctuation-amount-estimation unit estimates a power consumption that will fluctuate due to the non-demand-response control during the demand-response control.
    Type: Application
    Filed: July 2, 2014
    Publication date: July 28, 2016
    Inventor: Chikara MAEDA
  • Publication number: 20160211665
    Abstract: A control apparatus includes a receiving unit, a demand-response unit, a power consumption fluctuation unit, and a setting unit. The receiving unit receives a demand relating to power consumption from an energy management apparatus. The demand-response unit executes a demand-response control in order to adjust power consumption of facility devices set up in a property in accordance with the demand when the demand is received by the receiving unit. The power consumption fluctuation unit executes a non-demand-response control in order to increase or decrease power consumption of the facility devices regardless of the demand. The setting unit sets the non-demand-response control to active or inactive.
    Type: Application
    Filed: August 22, 2014
    Publication date: July 21, 2016
    Applicant: Daikin Industries, Ltd.
    Inventor: Chikara MAEDA