Abstract: A copper alloy trolley wire is formed of a composition containing Mg in a range of 0.15% by mass or more and 0.50% by mass or less, Cr in a range of 0.25% by mass or more and 1.0% by mass or less, and a Cu balance containing inevitable impurities, in which a tensile strength is 600 MPa or higher and an electrical conductivity is 60% IACS or higher.

Abstract: A copper alloy has a composition including 0.05 mass % or more and 0.70 mass % or less of Co; 0.02 mass % or more and 0.20 mass % or less of P; 0.005 mass % or more and 0.70 mass % or less of Sn, one or more of B, Cr, and Zr; and furthermore, a Cu balance containing inevitable impurities, wherein X, Y, and Z satisfy the following Expression (1): 1?(X/5)+(Y/50)+(Z/100) and Expression (2): X+Y+Z?1,000, in case where an amount of B is represented by X (massppm), an amount of Cr is represented by Y (massppm), and an amount of Zr is represented by Z (massppm).

Abstract: A center-channel protector for a vehicle sash door is arranged between a main sash and a center channel. A body of the protector has an H-shaped upper-end surface which is compatible to cover the upper end of the center channel. The body integrally includes a pair of branch covering portions corresponding to a pair of branch portions constituting the center channel and a middle covering portion disposed between the branch covering portions so as to connect the both branch covering portions therewith. An engaging portion is provided with the body and is mechanically engaged, in a direction intersecting a vertical direction, with an engaged portion which is provided with a center channel side. In collaboration with the engaged portion, the engaging portion constitutes a fastening mechanism by which the protector is fastened on the center channel.

Abstract: A center-channel protector for a vehicle sash door is arranged between a main sash and a center channel. A body of the protector has an H-shaped upper-end surface which is compatible to cover the upper end of the center channel. The body integrally includes a pair of branch covering portions corresponding to a pair of branch portions constituting the center channel and a middle covering portion disposed between the branch covering portions so as to connect the both branch covering portions therewith. An engaging portion is provided with the body and is mechanically engaged, in a direction intersecting a vertical direction, with an engaged portion which is provided with a center channel side. In collaboration with the engaged portion, the engaging portion constitutes a fastening mechanism by which the protector is fastened on the center channel.

Abstract: A center-channel protector for a vehicle sash door is arranged between a main sash and a center channel. A body of the protector has an H-shaped upper-end surface which is compatible to cover the upper end of the center channel. The body integrally includes a pair of branch covering portions corresponding to a pair of branch portions constituting the center channel and a middle covering portion disposed between the branch covering portions so as to connect the both branch covering portions therewith. An engaging portion is provided with the body and is mechanically engaged, in a direction intersecting a vertical direction, with an engaged portion which is provided with a center channel side. In collaboration with the engaged portion, the engaging portion constitutes a fastening mechanism by which the protector is fastened on the center channel.

Abstract: A center-channel protector for a vehicle sash door is arranged between a main sash and a center channel. A body of the protector has an H-shaped upper-end surface which is compatible to cover the upper end of the center channel. The body integrally includes a pair of branch covering portions corresponding to a pair of branch portions constituting the center channel and a middle covering portion disposed between the branch covering portions so as to connect the both branch covering portions therewith. An engaging portion is provided with the body and is mechanically engaged, in a direction intersecting a vertical direction, with an engaged portion which is provided with a center channel side. In collaboration with the engaged portion, the engaging portion constitutes a fastening mechanism by which the protector is fastened on the center channel.

Abstract: An improved door security latch is disclosed in which the range of motion of a secured door is variable depending on the degree to which the latch is engaged. Like most prior art latches, an arm with a substantially spherical member is mounted to the inside surface of a door such that the arm extends beyond the free edge of the door. A pivotable first yoke mounted to the door frame engages the arm and substantially spherical member such that as the arm travels along the first yoke, the substantially spherical member constrains the arm within the first yoke, limiting the doors swing to the length of the first yoke. The present invention adds a second yoke which engages the substantially spherical member more closely, limiting the swing of the door to a fraction of an inch.

Abstract: A handle for opening and closing a shoji includes a pedestal fixed to the window frame side stile of a sliding door shoji; a lever handle attached to this pedestal and swingably pivoted in a predetermined angle range; a kicking-out member fixed to a shaft portion of the lever handle and projected toward the window frame side by the swinging operation of the lever handle performed by opening and operating the sliding door shoji, and assisting the opening operation of the shoji by reaction force for kicking-out the window frame; and a spring member for biasing this kicking-out member toward a projection opposing side rotating direction. Further, an auxiliary lock includes a rotatable locking hook piece in the lever handle and a receiving piece fixed to the window frame side and freely engaged with and disengaged from the locking hook piece.

Abstract: A plane layer and a number of thin filamentary interconnection patterns disposed therearound are disposed on the upper surface of a flexible insulating tape. A semiconductor chip is mounted on the plane layer on the insulating tape by flip-chip bonding, and has terminals on its reverse side which are connected to the plane layer and the interconnection patterns, respectively. Some of the terminals of the semiconductor chip are connected through the plane layer to solder balls, providing ground interconnections. Other terminals are connected to the interconnection patterns to other solder balls, providing power supply interconnections. Still other terminals are connected to other interconnection patterns to still other solder balls, providing signal interconnections. The semiconductor device can simply be fabricated, requires no device hole for semiconductor chip, can be reduced in size, have electric interconnected reduced, and can have electric characteristics stabilized.

Abstract: A bump formation plate is provided with a base and solder bumps formed on the base. The top portion of the solder bump inclines from the center thereof to the periphery thereof. A contact surface of the solder bump with the base may be flat. The base is made of, for example, aluminum or stainless steel.

Abstract: A bump formation plate is provided with a base and solder bumps formed on the base. The top portion of the solder bump inclines from the center thereof to the periphery thereof. A contact surface of the solder bump with the base may be flat. The base is made of, for example, aluminum or stainless steel.

Abstract: A bump formation plate is provided with a base and solder bumps formed on the base. The top portion of the solder bump inclines from the center thereof to the periphery thereof. A contact surface of the solder bump with the base may be flat. The base is made of, for example, aluminum or stainless steel.

Abstract: A bump formation plate is provided with a base and solder bumps formed on the base. The top portion of the solder bump inclines from the center thereof to the periphery thereof. A contact surface of the solder bump with the base may be flat. The base is made of, for example, aluminum or stainless steel.

Abstract: A plane layer and a number of thin filamentary interconnection patterns disposed therearound are disposed on the upper surface of a flexible insulating tape. A semiconductor chip is mounted on the plane layer on the insulating tape by flip-chip bonding, and has terminals on its reverse side which are connected to the plane layer and the interconnection patterns, respectively. Some of the terminals of the semiconductor chip are connected through the plane layer to solder balls, providing ground interconnections. Other terminals are connected to the interconnection patterns to other solder balls, providing power supply interconnections. Still other terminals are connected to other interconnection patterns to still other solder balls, providing signal interconnections. The semiconductor device can simply be fabricated, requires no device hole for semiconductor chip, can be reduced in size, have electric interconnected reduced, and can have electric characteristics stabilized.

Abstract: In a method for manufacturing a heat radiating resin-molded semiconductor device, a protrusion is formed on a side peripheral surface of a semiconductor chip, and the semiconductor chip is sealed with resin, so that spreading of the resin toward a back surface of the semiconductor chip is prevented by the protrusion. Also, a heat radiator is mounted on a back surface of the semiconductor chip.

Abstract: Copper foil wiring is applied to base film and the wiring is in turn covered by a cover resist. The electrodes of a semiconductor IC chip is connected to the inner leads of the copper foil wiring and the semiconductor chip is then encapsulated by encapsulation resin. Solder balls are supplied to lands through openings in the cover resist, and bumps are formed. The four sides of the film are then folded to form folded portions. These folded portions increase the strength of the edges of the film, thereby reducing warping and waviness and allowing simultaneous mounting of other devices such as QFP to the substrate. The angle of folding with respect to the film surface is preferably 20.degree. or greater and less than 90.degree., and still greater strength can be obtained by two-stage folding of the sides.

Abstract: In a semiconductor device which has a base film sheet to support a semiconductor chip in a center region of the base film sheet, a plurality of via holes are formed within a peripheral region of the base film sheet. The via holes may be used to mount a metal plate on the base film sheet or to support another semiconductor chip, by forming ball bumps on or in the via holes. A circuit board may be attached to the base film sheet by the use of the bumps or pins extended through the via holes.

Abstract: Disclosed is a semiconductor device which has a semiconductor IC chip, a base film forming a basis of a film carrier tape, through-holes and device holes which open in the base film, a copper-foil wiring formed on the base film, inner leads formed at the inside end of the copper-foil wiring, lands for connecting to outside, apertures formed in the center of the respective lands, cover resist formed on the base film except the lands, sealing resin for protecting the semiconductor IC chip and solder bumps.

Abstract: A method of producing a semiconductor device is disclosed and includes steps of temporarily connecting inner leads or lands provided on a film carrier tape and electrode pads provided on an IC chip at the same time by low-temperature gang bonding, and then bonding them by point bonding. The method enhances the reliable production of a semiconductor device by reducing the influence of localized load and temperature ascribable to the short accuracy of the gang bonding jig as well as the influence of the deformation of a film carrier tape due to heat applied during point bonding.

Abstract: It is the object of the invention to provide a method for manufacturing a sheet formed connector for inspecting an integrated circuit at the state of flip-chip bonding and at low pressure condition. The method for manufacturing comprises the steps of making holes on plastic insulating sheet, which is stuck to the metallic sheet, at a certain interval in both longitudinal and lateral directions, making predetermined patterned portions on the metallic sheet by etching, and melting a solder piece in each hole.