Abstract: A component mounting device includes a suction nozzle supplied with negative pressure air to perform pickup operation of a component, and is blocked from the negative pressure air to perform mounting operation of the component on a board, a first negative pressure supply section to supply the negative pressure air when the suction nozzle starts the pickup operation to when the suction nozzle starts the mounting operation, a second negative pressure supply section to supply the negative pressure air, a negative pressure detection section, and a negative pressure supply control section to operate the second negative pressure supply section when the detected pressure value of the negative pressure air is closer to an atmospheric pressure value than a predetermined value set between the atmospheric pressure value and a vacuum value.

Abstract: A component transfer device including: a component mounting tool mounted on a movable mounting head, the component mounting tool being configured to collect a component from a component supply device and mount the component on a board; a side imaging section configured to image the component held by the component mounting tool from the side; a cleaning nozzle having an emission port on a side surface only of the cleaning nozzle that opens toward the side imaging section; and a positive pressure air supply section configured to supply positive pressure air to the cleaning nozzle and blow out the positive pressure air from the emission port toward the side imaging section.

Abstract: An electronic component mounter including a suction nozzle to pick up an electronic component housed in a housing section; a switching device configured to switch air supplied to a nozzle hole of the suction nozzle to negative pressure air when picking up the electronic component, and to switch the air supplied to the nozzle hole of the suction nozzle to positive pressure air when mounting the electronic component that was picked up by the suction nozzle on the circuit board; and a blow supply device configured to supply a first blow to the suction nozzle for a specified time when the positive pressure air is being supplied to the nozzle hole by a switching device. After the specified time has elapsed, stop the first blow and supply a second blow with a lower pressure than the first blow to the suction nozzle.

Abstract: A component transfer device including: a component mounting tool mounted on a movable mounting head, the component mounting tool being configured to collect a component from a component supply device and mount the component on a board; a side imaging section configured to image the component held by the component mounting tool from the side; a cleaning nozzle having an emission port on a side surface only of the cleaning nozzle that opens toward the side imaging section; and a positive pressure air supply section configured to supply positive pressure air to the cleaning nozzle and blow out the positive pressure air from the emission port toward the side imaging section.

Abstract: An electronic component mounter including a suction nozzle to pick up an electronic component housed in a housing section; a switching device configured to switch air supplied to a nozzle hole of the suction nozzle to negative pressure air when picking up the electronic component, and to switch the air supplied to the nozzle hole of the suction nozzle to positive pressure air when mounting the electronic component that was picked up by the suction nozzle on the circuit board; and a blow supply device configured to supply a first blow to the suction nozzle for a specified time when the positive pressure air is being supplied to the nozzle hole by a switching device. After the specified time has elapsed, stop the first blow and supply a second blow with a lower pressure than the first blow to the suction nozzle.

Abstract: An electronic component mounting device, including: a board conveyance device which conveys and positions a board on which an electronic component is mounted; a mounting device which positions and mounts the electronic component to a mounting position of the board; a loading device which picks up multiple engaged members (clips), and positions and loads the engaged members to a loading position of the board; and a placing device which picks up a cover component that covers the mounted electronic component and that is provided with an engaging portion at a predetermined position, and positions and places the cover component to a position such that the engaging portion corresponds to the engaged member.

Abstract: A suction nozzle, including a suction assistance section provided within an intake passage and connecting a side downstream of a pin and a side upstream of the pin, is provided. A cross section (the area of a cross section cut in a direction perpendicular to the direction in which the intake passage extends) of the intake passage is narrowed by the pin. Air bypasses the pin by flowing through the suction assistance section.

Abstract: A head holding unit that moves in the XYZ direction is configured to exchangeably hold one of multi-nozzle head that exchangeably holds multiple suction nozzles, and single-nozzle head that holds a single nozzle section. Single-nozzle head is divided into attachment section held by head holding unit, and nozzle section, and the holding configuration of nozzle section on attachment section, and the holding configuration of suction nozzle on multi-nozzle head are shared, therefore it is possible to use nozzle section of single-nozzle head as a suction nozzle of multi-nozzle head. By this, various single-nozzle heads with different sizes and shapes of nozzle sections can be provided at low cost, and increase in storage space required due to the increased quantity of various single-nozzle heads is curtailed.

Abstract: In a component mounting device, a head held by a head holding section is automatically exchanged from one of a pickup head attached with a suction nozzle that holds and releases component, and a dispensing head with a dispensing tool that dispenses adhesive, to the other of the heads. When the pickup head is held, a nozzle camera images the suction nozzles at nozzle positions attached to the pickup head from the side using an optical system unit and acquires suction nozzle image data. When the dispensing head is held, the nozzle camera images a dispensing nozzle positioned at the center axis of the head holding body from the side using the optical system unit and acquires dispensing nozzle image data. Component related inspection is performed based on the suction nozzle image data and dispensing related inspection is performed based on the dispensing nozzle image data.

Abstract: A suction nozzle, including a suction assistance section provided within an intake passage and connecting a side downstream of a pin and a side upstream of the pin, is provided. A cross section (the area of a cross section cut in a direction perpendicular to the direction in which the intake passage extends) of the intake passage is narrowed by the pin. Air bypasses the pin by flowing through the suction assistance section.

Abstract: In a component mounting device, a head held by a head holding section is automatically exchanged from one of a pickup head attached with a suction nozzle that holds and releases component, and a dispensing head with a dispensing tool that dispenses adhesive, to the other of the heads. When the pickup head is held, a nozzle camera images the suction nozzles at nozzle positions attached to the pickup head from the side using an optical system unit and acquires suction nozzle image data. When the dispensing head is held, the nozzle camera images a dispensing nozzle positioned at the center axis of the head holding body from the side using the optical system unit and acquires dispensing nozzle image data. Component related inspection is performed based on the suction nozzle image data and dispensing related inspection is performed based on the dispensing nozzle image data.

Abstract: An electronic component mounting device, including: a board conveyance device which conveys and positions a board on which an electronic component is mounted; a mounting device which positions and mounts the electronic component to a mounting position of the board; a loading device which picks up multiple engaged members (clips), and positions and loads the engaged members to a loading position of the board; and a placing device which picks up a cover component that covers the mounted electronic component and that is provided with an engaging portion at a predetermined position, and positions and places the cover component to a position such that the engaging portion corresponds to the engaged member.