Patents by Inventor Chikaya Mimura

Chikaya Mimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing a laminated leadframe
    Patent number: 7665205
    Abstract: Disclosed are a method for manufacturing a laminated lead frame and a laminated lead frame manufactured thereby, wherein lead frame single plates to be laminated one on top of the other can be reliably bonded together with a relatively light load. Under the method for manufacturing a laminated lead frame by means of stacking and bonding lead frame single plates 10 and 11, each of which has been processed into a predetermined shape, a plurality of protuberance sections 12 are formed in at least one of mutually-opposing surfaces of the lead frame single plates 10 and 11 that vertically pair up with each other. The mutually-opposing lead frame single plates 11, 12 are bonded together via the protuberance sections 12.
    Type: Grant
    Filed: November 9, 2006
    Date of Patent: February 23, 2010
    Assignee: Mitsui High-Tec, Inc.
    Inventors: Kiyoshi Matsunaga, Chikaya Mimura, Takao Shioyama
  • Method of manufacturing laminated lead frame and lead frame produced by the method
    Publication number: 20070119050
    Abstract: Disclosed are a method for manufacturing a laminated lead frame and a laminated lead frame manufactured thereby, wherein lead frame single plates to be laminated one on top of the other can be reliably bonded together with a relatively light load. Under the method for manufacturing a laminated lead frame by means of stacking and bonding lead frame single plates 10 and 11, each of which has been processed into a predetermined shape, a plurality of protuberance sections 12 are formed in at least one of mutually-opposing surfaces of the lead frame single plates 10 and 11 that vertically pair up with each other. The mutually-opposing lead frame single plates 11, 12 are bonded together via the protuberance sections 12.
    Type: Application
    Filed: November 9, 2006
    Publication date: May 31, 2007
    Inventors: Kiyoshi Matsunaga, Chikaya Mimura, Takao Shioyama
  • Semiconductor device
    Patent number: 6388311
    Abstract: A semiconductor device capable of preventing moisture from entering into a package and also capable of preventing peeling between a pad and the package from occurring. The semiconductor device comprises grooves formed on a semiconductor element mounting surface of the pad to surround the semiconductor element, plated portions formed on only a ground bond area of the semiconductor element mounting surface of the pad, a thin portion formed on an entire peripheral edge portions on the back of the pad, and thin portions formed at portions which connect with the pad, on backs of support bars extending from the pad.
    Type: Grant
    Filed: December 6, 1999
    Date of Patent: May 14, 2002
    Assignee: Mitsui High-Tec Incorporated
    Inventors: Kaoru Nakashima, Chikaya Mimura, Seiichiro Sakata
  • SEMICONDUCTOR DEVICE
    Publication number: 20020050640
    Abstract: A semiconductor device capable of preventing moisture from entering into a package and also capable of preventing peeling between a pad and the package from occurring.
    Type: Application
    Filed: December 6, 1999
    Publication date: May 2, 2002
    Inventors: KAORU NAKASHIMA, CHIKAYA MIMURA, SEIICHIRO SAKATA