Patents by Inventor Chikaya Sakai

Chikaya Sakai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5295325
    Abstract: A plant cutting and transplanting apparatus comprises a plant cutting/transplantation room accommodating a first culture box in which multiplied plants to be cut are planted, and a second culture box in which nodular pieces made by cutting the plants are transplanted; a cutting device adapted to cut, in one lot, the plants in the first culture box to the form of nodular pieces and configured to allow the nodular pieces to rest on the edges thereof, the cutting device being arranged so as to be moved vertically and transversely above the space where the first and second culture boxes are placed; and a blade device having a blade for shaking down the nodular pieces which rest on the cutter and which have been moved to a position above the second culture box.
    Type: Grant
    Filed: January 14, 1991
    Date of Patent: March 22, 1994
    Assignee: Kabushiki Kaisha Komatsu Seisakusho
    Inventors: Shigeru Honda, Masahiro Sei, Hitoshi Uemura, Tatsuya Mori, Chikaya Sakai, Ruriko Oda, Chiyoko Shimada, Yusaku Sekino
  • Patent number: 5209011
    Abstract: There is disclosed an immature plant grafting apparatus capable of seizing en bloc a plurality of saplings raised in array irrespective of a scatter in diameters of stems without requiring hand works and damaging the saplings and of grafting the saplings at a remarkably high efficiency but at low costs. The grafting apparatus has a plurality of induction plates (9a and 9b) formed with a plurality of induction grooves (10) open to seizing surfaces, corresponding to the number of saplings (3a and 3b) to be seized and their positions, induction plates so attached to upper and lower surfaces of one of a pair of seizing devices (4 and 5) as to protrude from the seizing surfaces, and buffer members (13) projecting from the seizing surfaces of the other seizing device so that each buffer member is fitted in between the pair of induction plates.
    Type: Grant
    Filed: September 9, 1991
    Date of Patent: May 11, 1993
    Assignee: Kabushiki Kaisha Komatsu Seisakusho
    Inventors: Tatsuya Mori, Masahiro Cei, Shigeru Honda, Hitoshi Uemura, Chikaya Sakai, Ruriko Oda, Chiyoko Shimada, Yusaku Sekino