Abstract: A buildup board includes a buildup layer having a multilayer structure and/or a core layer having a multilayer structure. The multilayer structure includes a signal wiring pattern, a pad connected to the signal wiring pattern, an insulating part arranged around the pad on the same layer as the pad, and a conductor arranged around the insulating part on the same layer as the pad. The multilayer structure has at least two different keepouts where the keepout is defined as a minimum interval between an outline of the pad and the conductor closest to the pad on the same layer.

Abstract: A buildup board includes a buildup layer having a multilayer structure and/or a core layer having a multilayer structure. The multilayer structure includes a signal wiring pattern, a pad connected to the signal wiring pattern, an insulating part arranged around the pad on the same layer as the pad, and a conductor arranged around the insulating part on the same layer as the pad. The multilayer structure has at least two different keepouts where the keepout is defined as a minimum interval between an outline of the pad and the conductor closest to the pad on the same layer.

Abstract: The present invention relates to a circuit board in which signal lines transmitting a signal are wired, and which is capable of increasing the speed of signal transmission. There is provided a circuit board in which signal lines are wired, including: a signal pad which is formed at the tip of the signal line and has a signal via in the center thereof; and plural ground vias which are formed in positions to surround the signal pad and transmit a ground potential over plural wiring layers.

Abstract: A massive bus bar for supplying a determined power voltage to a circuit component mounted on a rigid circuit board having a conductor layer connecting the component to a bus bar connecting pad formed on the surface of the board. Plurality of first notches extend through a main surface of the bus bar from a common longitudinal edge, perpendicularly to the longitudinal axis of the bus bar and throughout the full longitudinal extent of the bus bar, and define a plurality of posts which are secured at their bottom surfaces to the conductive pads on the circuit board surface. The first notches facilitate flexing of the bus bar and reduce stresses otherwise produced due to the rigid connection of the bus bar to the circuit board, while not significantly diminishing the current handling capability of the bus bar.