Patents by Inventor Chilwin Tanamal

Chilwin Tanamal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Encapsulates
    Patent number: 10894908
    Abstract: The invention discloses a microencapsulated phase change material having a specific Thermal Efficiency Index (TEI). TEI=?(R?T)*?(R?H)*?(RMP)*?(RTGA@180)*?(RFW) The problem of achieving effective and efficient microencapsulated phase change material can be solved to yield a commercially useful material having the described combination of physical and chemical characteristics based on the parameters described in the specification. Microcapsules according to the invention are highly effective at delivering enhanced thermal performance as compared to conventional microcapsules.
    Type: Grant
    Filed: January 26, 2018
    Date of Patent: January 19, 2021
    Inventors: Hanwei Zhang, Chilwin Tanamal, John Charles DeBraal, Travis Ian Bardsley, Biao Duan, Nianxi Yan
  • Encapsulates
    Publication number: 20180215982
    Abstract: The invention discloses a microencapsulated phase change material having a specific Thermal Efficiency Index (TEI). TEI=?(R?T)*?(R?H)*?(RMP)*?(RTGA@180)*?(RFW) The problem of achieving effective and efficient microencapsulated phase change material can be solved to yield a commercially useful material having the described combination of physical and chemical characteristics based on the parameters described in the specification.
    Type: Application
    Filed: January 26, 2018
    Publication date: August 2, 2018
    Applicant: Encapsys, LLC
    Inventors: Hanwei Zhang, Chilwin Tanamal, John Charles DeBraal, Travis Ian Bardsley, Biao Duan, Nianxi Yan