Abstract: A method for manufacturing a semiconductor package includes: (a) providing a package device, the package device comprising a substrate, a package body and a plurality of connecting elements, the substrate having a first surface, the package body being disposed adjacent to the first surface of the substrate, and the connecting elements being disposed adjacent to the first surface of the substrate and encapsulated by the package body; and (b) removing a portion of the package body along one or more machining paths to expose the connecting elements, wherein each machining path has one or more first paths passing over, between, or along a side of at least two connecting elements, wherein a portion of each of the at least two connecting elements is within the package body, and another portion of each of the at least two connecting elements protrudes from a surface of the package body.

Abstract: The present disclosure relates to a semiconductor package and a method for manufacturing the same. The semiconductor package includes a substrate, a package body and at least two connecting elements. The substrate has a first surface. The package body is disposed adjacent to the first surface of the substrate, and the package body defines a groove having a substantially flat bottom surface. The connecting elements are disposed adjacent to the first surface of the substrate. A portion of each of the connecting elements is within the package body, and another portion of each of the connecting elements protrudes from the substantially flat bottom surface of the groove.

Abstract: An antenna includes a substrate, a microstrip patch or a slot, a feed line connected to the microstrip patch or slot, and a diffraction grating modulator mounted on the substrate and formed with a spatial periodic structure. The microstrip patch or slot radiates and receives electromagnetic waves when a signal between the substrate and the microstrip patch or slot satisfies resonance conditions. The diffraction grating modulator diffracts the electromagnetic waves in a predetermined manner so as to improve antenna gain and side lobe bandwidth and modulate directionality of the antenna.