Patents by Inventor Chin-An Su

Chin-An Su has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190057920
    Abstract: A method for manufacturing a semiconductor package includes: (a) providing a package device, the package device comprising a substrate, a package body and a plurality of connecting elements, the substrate having a first surface, the package body being disposed adjacent to the first surface of the substrate, and the connecting elements being disposed adjacent to the first surface of the substrate and encapsulated by the package body; and (b) removing a portion of the package body along one or more machining paths to expose the connecting elements, wherein each machining path has one or more first paths passing over, between, or along a side of at least two connecting elements, wherein a portion of each of the at least two connecting elements is within the package body, and another portion of each of the at least two connecting elements protrudes from a surface of the package body.
    Type: Application
    Filed: October 24, 2018
    Publication date: February 21, 2019
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chia-Ling LEE, Ming-Wei SUN, Chin-An SU, Cheng-Hua LIU
  • Publication number: 20160379910
    Abstract: The present disclosure relates to a semiconductor package and a method for manufacturing the same. The semiconductor package includes a substrate, a package body and at least two connecting elements. The substrate has a first surface. The package body is disposed adjacent to the first surface of the substrate, and the package body defines a groove having a substantially flat bottom surface. The connecting elements are disposed adjacent to the first surface of the substrate. A portion of each of the connecting elements is within the package body, and another portion of each of the connecting elements protrudes from the substantially flat bottom surface of the groove.
    Type: Application
    Filed: June 24, 2015
    Publication date: December 29, 2016
    Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chia-Ling Lee, Ming-Wei Sun, Chin-An Su, Cheng-Hua Liu
  • Patent number: 6037904
    Abstract: An antenna includes a substrate, a microstrip patch or a slot, a feed line connected to the microstrip patch or slot, and a diffraction grating modulator mounted on the substrate and formed with a spatial periodic structure. The microstrip patch or slot radiates and receives electromagnetic waves when a signal between the substrate and the microstrip patch or slot satisfies resonance conditions. The diffraction grating modulator diffracts the electromagnetic waves in a predetermined manner so as to improve antenna gain and side lobe bandwidth and modulate directionality of the antenna.
    Type: Grant
    Filed: February 9, 1999
    Date of Patent: March 14, 2000
    Inventors: Yuan-Tung Cheng, Chin-An Su