Patents by Inventor Chin Chai Gan

Chin Chai Gan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Spring-based probe pin that allows kelvin testing
    Patent number: 7271606
    Abstract: The voltage at a node of an integrated circuit can be measured or controlled using a two-wire kelvin contact with spring-based probe pins by offsetting and tapering the lower end section of the spring-based probe pin. As a result, multiple spring-based probe pins can be connected to a single contact bump, such as a solder bump.
    Type: Grant
    Filed: August 4, 2005
    Date of Patent: September 18, 2007
    Assignee: National Semiconductor Corporation
    Inventors: Tze Kang Tang, Sek Hoi Chong, Chin Chai Gan, Hai Ching Tan
  • Bilevel probe
    Patent number: 7102371
    Abstract: An apparatus for electrical testing of semiconductor devices is provided. A printed circuit board is provided. A first plurality of probe pins for probing bump connectors is electrically and mechanically connected to the printed circuit board. A second plurality of probe pins for probing probe pads is electrically and mechanically connected to the printed circuit board.
    Type: Grant
    Filed: May 19, 2004
    Date of Patent: September 5, 2006
    Assignee: National Semiconductor Corporation
    Inventors: Tze Kang Tang, Sek Hoi Chong, Chin Chai Gan, Fuen Siang Ng