Patents by Inventor Chin-Chang Pan
Chin-Chang Pan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11966133Abstract: An electronic device is disclosed. The electronic device includes a substrate, a plurality of color filters disposed on the substrate, an optical film disposed on the plurality of color filter, and a defect disposed between the substrate and the optical film. The optical film has a first base, a protective layer on the first base, and a second base between the first base and the protective layer and having a first processed area. In a top view of the electronic device, the first processed area corresponds to the defect and at least partially overlaps at least two color filters.Type: GrantFiled: May 18, 2023Date of Patent: April 23, 2024Assignee: INNOLUX CORPORATIONInventors: Tai-Chi Pan, Chin-Lung Ting, I-Chang Liang, Chih-Chiang Chang Chien, Po-Wen Lin, Kuang-Ming Fan, Sheng-Nan Chen
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Publication number: 20240071888Abstract: A package structure including a redistribution circuit structure, a wiring substrate, first conductive terminals, an insulating encapsulation, and a semiconductor device is provided. The redistribution circuit structure includes stacked dielectric layers, redistribution wirings and first conductive pads. The first conductive pads are disposed on a surface of an outermost dielectric layer among the stacked dielectric layers, the first conductive pads are electrically connected to outermost redistribution pads among the redistribution wirings by via openings of the outermost dielectric layer, and a first lateral dimension of the via openings is greater than a half of a second lateral dimension of the outermost redistribution pads. The wiring substrate includes second conductive pads. The first conductive terminals are disposed between the first conductive pads and the second conductive pads. The insulating encapsulation is disposed on the surface of the redistribution circuit structure.Type: ApplicationFiled: August 28, 2022Publication date: February 29, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chien-Chang Lin, Yen-Fu Su, Chin-Liang Chen, Wei-Yu Chen, Hsin-Yu Pan, Yu-Min Liang, Hao-Cheng Hou, Chi-Yang Yu
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Publication number: 20140159853Abstract: A magnetic passive component and a method for manufacturing the same are provided. The magnetic passive component comprises a magnetic core, a metal-wire-layer winding around the surface of the magnetic core, and an insulating layer provided between the magnetic core and the metal-wire-layer. The material of the insulating layer is a kind of insulating material containing additive of metal ions. To form the metal-wire layer, a trace of metal-wire layer should be made first in the surface of the insulating layer by laser activation and then adopt electroplating process to form the metal-wire layer so as to finally form a metal winding wire on a surface of the magnetic core. The magnetic passive component and the method for manufacturing the same disclose here can realize a simple process, a low manufacturing cost, an automatic manufacturing and a stable and reliable quality.Type: ApplicationFiled: December 6, 2013Publication date: June 12, 2014Applicant: Delta Electronics (Chen Zhou) Co., LtdInventors: Chao Wei YANG, Wangjun HE, Xuefeng CHEN, Chang HSU, Chin Chang PAN, Ming En HSIEH
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Patent number: 7533564Abstract: A micro sample heating apparatus has a substrate, a micro heating device disposed on a first surface of the substrate, a cavity having a vertical sidewall and corresponding to the micro heating device positioned in a second surface of the substrate, and an isolation structure positioned on the second surface of the substrate. The isolation structure has an opening corresponding to the cavity, and the cavity and the opening form a sample room.Type: GrantFiled: May 2, 2006Date of Patent: May 19, 2009Assignee: Touch Micro-System Technology INC.Inventors: Chin-Chang Pan, Yu-Fu Kang
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Patent number: 7395706Abstract: A micro sample heating apparatus has a substrate, a micro heating device disposed on a first surface of the substrate, a cavity having an inclined sidewall and corresponding to the micro heating device positioned in a second surface of the substrate, and an isolation structure positioned on the second surface of the substrate. The isolation structure has an opening corresponding to the cavity, and the cavity and the opening form a sample room.Type: GrantFiled: June 23, 2006Date of Patent: July 8, 2008Assignee: Touch Micro-System Technology Inc.Inventors: Chin-Chang Pan, Yu-Fu Kang
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Publication number: 20080060454Abstract: A micro sample heating apparatus has a substrate, a micro heating device disposed on a first surface of the substrate, a cavity having a vertical sidewall and corresponding to the micro heating device positioned in a second surface of the substrate, and an isolation structure positioned on the second surface of the substrate. The isolation structure has an opening corresponding to the cavity, and the cavity and the opening form a sample room.Type: ApplicationFiled: May 2, 2006Publication date: March 13, 2008Inventors: Chin-Chang Pan, Yu-Fu Kang
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Publication number: 20070234794Abstract: A micro sample heating apparatus has a substrate, a micro heating device disposed on a first surface of the substrate, a cavity having an inclined sidewall and corresponding to the micro heating device positioned in a second surface of the substrate, and an isolation structure positioned on the second surface of the substrate. The isolation structure has an opening corresponding to the cavity, and the cavity and the opening form a sample room.Type: ApplicationFiled: June 23, 2006Publication date: October 11, 2007Inventors: Chin-Chang Pan, Yu-Fu Kang
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Patent number: 7262078Abstract: A substrate is provided. The substrate includes a plurality of devices disposed in the substrate, a plurality of contact pads disposed on a surface of the substrate and electrically connected to the devices, and a surface dielectric layer positioned on the surface of the substrate. Thereafter, a surface treatment process including at least a plasma etching process is performed. Subsequently, at least a plasma enhanced chemical vapor deposition (PECVD) process is performed to form a dielectric layer on a surface dielectric layer. The PECVD process is performed in a high frequency/low frequency alternating manner. Following that, a masking pattern on the dielectric layer is formed, and an anisotropic etching process is carried out to form a plurality of openings corresponding to the contact pads in the dielectric layer. The openings expose the contact pads, and each opening has an outwardly-inclined sidewall.Type: GrantFiled: March 15, 2005Date of Patent: August 28, 2007Assignee: Touch Micro-System Technology Inc.Inventors: Wei-Shun Lai, Shu-Hua Hu, Kuan-Jui Huang, Chin-Chang Pan, Yuan-Chin Hsu
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Publication number: 20060263934Abstract: The chip-type micro-connector includes a package substrate, a micro-connector disposed on the package structure, a plurality of chips, and a cap layer disposed on the micro-connector and the chips. The micro-connector includes a connection substrate, a plurality of connecting wires disposed in the connection substrate, and a plurality of contact pads exposed on a surface of the connection substrate and respectively connected to each connecting wire. The chips are coupled to one another via the contact pads and the connecting wires. The cap layer packages the micro-connector and the chips on the package substrate.Type: ApplicationFiled: August 1, 2006Publication date: November 23, 2006Inventors: Shu-Hua Hu, Kuan-Jui Huang, Chin-Chang Pan
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Publication number: 20060186523Abstract: The chip-type micro-connector includes a package substrate, a micro-connector disposed on the package structure, a plurality of chips, and a cap layer disposed on the micro-connector and the chips. The micro-connector includes a connection substrate, a plurality of connecting wires disposed in the connection substrate, and a plurality of contact pads exposed on a surface of the connection substrate and respectively connected to each connecting wire. The chips are coupled to one another via the contact pads and the connecting wires. The cap layer packages the micro-connector and the chips on the package substrate.Type: ApplicationFiled: April 11, 2005Publication date: August 24, 2006Inventors: Shu-Hua Hu, Kuan-Jui Huang, Chin-Chang Pan
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Publication number: 20060183259Abstract: A substrate is provided. The substrate includes a plurality of devices disposed in the substrate, a plurality of contact pads disposed on a surface of the substrate and electrically connected to the devices, and a surface dielectric layer positioned on the surface of the substrate. Thereafter, a surface treatment process including at least a plasma etching process is performed. Subsequently, at least a plasma enhanced chemical vapor deposition (PECVD) process is performed to form a dielectric layer on a surface dielectric layer. The PECVD process is performed in a high frequency/low frequency alternating manner. Following that, a masking pattern on the dielectric layer is formed, and an anisotropic etching process is carried out to form a plurality of openings corresponding to the contact pads in the dielectric layer. The openings expose the contact pads, and each opening has an outwardly-inclined sidewall.Type: ApplicationFiled: March 15, 2005Publication date: August 17, 2006Inventors: Wei-Shun Lai, Shu-Hua Hu, Kuan-Jui Huang, Chin-Chang Pan, Yuan-Chin Hsu
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Publication number: 20060183312Abstract: A substrate including a plurality of contact pads is provided. Thereafter, a photosensitive dielectric layer is formed on a surface of the substrate. Subsequently, an exposure-and-development process is preformed to partially remove the photosensitive dielectric layer so as to form a plurality of openings. The openings at least expose the contact pads, and the sidewall of each opening is inclined outwardly.Type: ApplicationFiled: March 15, 2005Publication date: August 17, 2006Inventors: Shu-Hua Hu, Kuan-Jui Huang, Chin-Chang Pan, Shih-Min Huang