Patents by Inventor Chin-Chen CHIU

Chin-Chen CHIU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220392761
    Abstract: A method for grinding a silicon carbide wafer includes the following steps. Firstly, a single crystal is sliced into several wafers, in which each wafer has a silicon-side surface, which is the first surface. The opposite side is a carbon-side surface, which is the second surface. Subsequently, the silicon-side of the wafer is faced down and placed on a grinding stage for performing a first grinding process. It should be noted that a supporting structure exist between the wafer and the grinding stage. The supporting structure can have a concave or a convex framework. After grinding the carbon-side and removing the wafer from the stage, the wafer will appear convex or concave shape on the carbon-side surface. Thereafter, the wafer is flipped upside down and the carbon-side is placed on a flat stage without any supporting structure. Finally, the silicon-side is ground as a second grinding process.
    Type: Application
    Filed: May 4, 2022
    Publication date: December 8, 2022
    Applicant: GlobalWafers Co., Ltd.
    Inventor: Chin Chen Chiu
  • Publication number: 20220336203
    Abstract: A fabrication method of a semiconductor substrate includes: performing a chemical mechanical polishing process on a silicon carbide wafer; and performing a heating process on the silicon carbide wafer to remove a naturally formed oxide layer, to remove contaminants, to obtain a scratch-free surface, and to planarize, wherein the heating process includes: heating a chamber of a furnace and the silicon carbide wafer to T degrees Celsius for a time t, and introducing hydrogen, argon, nitrogen, or/and hydrogen chloride into the chamber; and then cooling down the furnace.
    Type: Application
    Filed: April 6, 2022
    Publication date: October 20, 2022
    Applicant: GlobalWafers Co., Ltd.
    Inventors: Chin Chen Chiu, Hao-Wei Peng
  • Publication number: 20110209640
    Abstract: The present invention relates to a method of forming three-dimensional patterns on an article surface, and in particular, a method of forming patterns having a lumpy feel on an article surface by hydraulic transfer printing method.
    Type: Application
    Filed: September 21, 2010
    Publication date: September 1, 2011
    Inventor: Chin Chen Chiu
  • Publication number: 20110110801
    Abstract: A fluid pump for delivering cooled working fluid in an engine cooling system includes a housing unit defining front and rear chambers, an inlet disposed upstream of a central region of the front chamber, an outlet disposed downstream of a surrounding region of the front chamber, a canister member dividing the rear chamber into stator- and rotor-side spaces for receiving a stator and a rotor, respectively, a hollow shaft which is rotated with the rotor to turn an impeller in the central region and which defines a passage, and an auxiliary conduit communicated with the inlet and the rear chamber so as to divert part of the working fluid to flow through the internal duct and the passage, thereby diffusing heat generated within the housing unit.
    Type: Application
    Filed: November 9, 2009
    Publication date: May 12, 2011
    Applicant: JI-EE INDUSTRY CO., LTD.
    Inventors: Chin-Chen CHIU, Schief CHEN, Jerry HUANG, Jo CHEN