Patents by Inventor Chin-Chen Kuo

Chin-Chen Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200118481
    Abstract: An imaging module includes abase, a light source, a light shielding member and a light transmissive member. The light source is disposed in the base. The light shielding member is connected to the base and includes a light transmissive region. The light transmissive member is selectively connected to one of the base and the light shielding member. The light source emits a light towards the light shielding member. The light passes through the light transmissive region and is projected to the light transmissive member, such that the light forms a light pattern corresponding to the light transmissive region through the light transmissive member.
    Type: Application
    Filed: January 29, 2019
    Publication date: April 16, 2020
    Inventors: Chun-Yi Yen, Chin-Chen Kuo, Shin-Hao Wu
  • Publication number: 20190279871
    Abstract: A method of enhancing generation efficiency of patterned optical coating is disclosed. When an exposure and development process is performed after a photoresist process on the silicon wafer, a dummy pattern is formed on a scribe line around a chip as a sacrificial layer. After an optical coating process is completed, the dummy pattern from the photoresist to be removed can be selected as the starting point of a photoresist lift-off process, such that the photoresist removal can be more efficient and accurate, and the generation efficiency of patterned optical coating is enhanced.
    Type: Application
    Filed: March 9, 2018
    Publication date: September 12, 2019
    Inventors: Wei-Kuo CHENG, Chin-Chen KUO, Tsung-Hsiu WU, Yun-Hui TAI, Cheng-Hung CHEN
  • Publication number: 20190011617
    Abstract: A multi-functional hybrid filter comprises a transparent substrate having a hybrid light filtering portion and an infrared light filtering portion; wherein, said hybrid light filtering portion is constructed by an infrared light absorbing material layer and a reflective interference type infrared cut filtering layer (IRCF) formed on the surface of said transparent substrate.
    Type: Application
    Filed: July 10, 2017
    Publication date: January 10, 2019
    Inventors: Wei-Kuo CHENG, Chin-Chen KUO, Tsung-Hsiu WU
  • Publication number: 20170023214
    Abstract: Disclosed is a composite multi-layer circuit board and the manufacturing method thereof, on which at least two sets of circuits are formed on a ceramic substrate for supplying power to two groups of different color temperature LEDs respectively; specifically, the two sets of circuits are intertwined with each other, so that the first color temperature LED and the second color temperature LED are disposed adjacently. Also, one of the circuits is embedded in the surface of the ceramic substrate.
    Type: Application
    Filed: July 23, 2015
    Publication date: January 26, 2017
    Inventors: Wei-Kuo CHENG, Chin-Chen KUO, Sheng-Wei WANG
  • Patent number: 8129762
    Abstract: A method is provided for processing a substrate. The substrate has at least one filter region, a plurality of bond pads, and a plurality of scribe lines arranged around the filter region and bond pads. A first planarization layer is formed above the substrate. The planarization layer has a substantially flat top surface overlying the filter region, the bond pads and the scribe lines. At least one color resist layer is formed over the first planarization layer and within the filter region while the first planarization layer covers the bond pads and the scribe lines.
    Type: Grant
    Filed: December 31, 2008
    Date of Patent: March 6, 2012
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Fu-Tien Weng, Yu-Kung Hsiao, Hung-Jen Hsu, Yi-Ming Dai, Chin Chen Kuo, Te-Fu Tseng, Chih-Kung Chang, Jack Deng, Chung-Sheng Hsiung, Bii-Junq Chang
  • Patent number: 7812302
    Abstract: The present invention provides an image sensor which comprises improved microlenses to cope with different optical requirements for oblique incident light or different components of light. In one embodiment, the image sensor comprises at least two microlenses having different radii of curvature. In another embodiment, the image sensor comprises at least one asymmetrical microlens.
    Type: Grant
    Filed: October 17, 2008
    Date of Patent: October 12, 2010
    Assignee: VisEra Technologies Company Limited
    Inventors: Chin-Chen Kuo, Wu-Chieh Liu, Hsiao-Wen Lee, Bii-Cheng Chang
  • Publication number: 20090104547
    Abstract: A method is provided for processing a substrate. The substrate has at least one filter region, a plurality of bond pads, and a plurality of scribe lines arranged around the filter region and bond pads. A first planarization layer is formed above the substrate. The planarization layer has a substantially flat top surface overlying the filter region, the bond pads and the scribe lines. At least one color resist layer is formed over the first planarization layer and within the filter region while the first planarization layer covers the bond pads and the scribe lines.
    Type: Application
    Filed: December 31, 2008
    Publication date: April 23, 2009
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Fu-Tien Weng, Yu-Kung Hsiao, Hung-Jen Hsu, Yi-Ming Dai, Chin Chen Kuo, Te-Fu Tseng, Chih-Kung Chang, Jack Deng, Chung-Sheng Hsiung, Bii-Junq Chang
  • Publication number: 20090078855
    Abstract: The present invention provides an image sensor which comprises improved microlenses to cope with different optical requirements for oblique incident light or different components of light. In one embodiment, the image sensor comprises at least two microlenses having different radii of curvature. In another embodiment, the image sensor comprises at least one asymmetrical microlens.
    Type: Application
    Filed: October 17, 2008
    Publication date: March 26, 2009
    Inventors: Chin-Chen Kuo, Wu-Chieh Liu, Hsiao-Wen Lee, Bii-Cheng Chang
  • Patent number: 7507598
    Abstract: A method is provided for processing a substrate. The substrate has at least one filter region, a plurality of bond pads, and a plurality of scribe lines arranged around the filter region and bond pads. A first planarization layer is formed above the substrate. The planarization layer has a substantially flat top surface overlying the filter region, the bond pads and the scribe lines. At least one color resist layer is formed over the first planarization layer and within the filter region while the first planarization layer covers the bond pads and the scribe lines.
    Type: Grant
    Filed: June 20, 2005
    Date of Patent: March 24, 2009
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Fu-Tien Weng, Yu-Kung Hsiao, Hung-Jen Hsu, Yi-Ming Dai, Chin Chen Kuo, Te-Fu Tseng, Chih-Kung Chang, Jack Deng, Chung-Sheng Hsiung, Bii-Junq Chang
  • Patent number: 7505206
    Abstract: A method of manufacturing a microlens device by depositing a microlens material layer over a substrate that includes photo-sensors. The microlens material layer is then exposed and developed to define microlens material elements, including first microlens material elements and second microlens material elements. Each second microlens material element is substantially greater in thickness relative to each first microlens material element. The microlens material elements are then heated to form a microlens array that includes first microlens array elements, each corresponding to a first microlens material element, and second microlens array elements, each corresponding to a second microlens material element. Each first microlens array element has a substantially greater focal length relative to each second microlens array element. For example, each second microlens array element is substantially greater in thickness relative to each first microlens array element.
    Type: Grant
    Filed: July 10, 2006
    Date of Patent: March 17, 2009
    Assignee: Taiwan Semiconductor Manufacturing Company
    Inventors: Jack Deng, Chih-Kung Chang, Chin Chen Kuo, Ming-Chang Kao, Fu-Tien Weng, Bii-Junq Chang
  • Patent number: 7372497
    Abstract: An image sensor device and method for forming said device are described. The image sensor structure comprises a substrate with photodiodes, an interconnect structure formed on the substrate, a color filter layer above the interconnect structure, a first microlens array, an overcoat layer, and a second microlens array. A key feature is that a second microlens has a larger radius of curvature than a first microlens. Additionally, each first microlens and second microlens is a flat convex lens. Thus, a thicker second microlens with a short focal length is aligned above a thinner first microlens having a long focal length. A light column that includes a first microlens, a second microlens and a color filter region is formed above each photodiode. A second embodiment involves replacing a second microlens in each light column with a plurality of smaller second microlenses that focus light onto a first microlens.
    Type: Grant
    Filed: April 28, 2004
    Date of Patent: May 13, 2008
    Assignee: Taiwan Semiconductor Manufacturing Company
    Inventors: Fu-Tien Weng, Yu-Kung Hsiao, Chin-Kung Chang, Hung-Jen Hsu, Yi-Ming Dai, Chin-Chen Kuo
  • Publication number: 20080011936
    Abstract: The present invention provides an image sensor which comprises improved microlenses to cope with different optical requirements for oblique incident light or different components of light. In one embodiment, the image sensor comprises at least two microlenses having different radii of curvature. In another embodiment, the image sensor comprises at least one asymmetrical microlens.
    Type: Application
    Filed: July 14, 2006
    Publication date: January 17, 2008
    Inventors: Chin-Chen Kuo, Wu-Chieh Liu, Hsiao-Wen Lee, Bii-Cheng Chang
  • Publication number: 20080007839
    Abstract: A method of manufacturing a microlens device by depositing a microlens material layer over a substrate that includes photo-sensors. The microlens material layer is then exposed and developed to define microlens material elements, including first microlens material elements and second microlens material elements. Each second microlens material element is substantially greater in thickness relative to each first microlens material element. The microlens material elements are then heated to form a microlens array that includes first microlens array elements, each corresponding to a first microlens material element, and second microlens array elements, each corresponding to a second microlens material element. Each first microlens array element has a substantially greater focal length relative to each second microlens array element. For example, each second microlens array element is substantially greater in thickness relative to each first microlens array element.
    Type: Application
    Filed: July 10, 2006
    Publication date: January 10, 2008
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Jack DENG, Chih-Kung CHANG, Chin Chen KUO, M. C. KAO, Fu-Tien WENG, Bii-Junq CHANG
  • Patent number: 7264976
    Abstract: A method of manufacturing a plurality of microlenses on a substrate comprises forming a grid having raised ridges defining a plurality of openings on the substrate and forming a plurality of patterned photoresist features each disposed within one of the plurality of openings. The plurality of patterned photoresist features can then be reflowed inside the grid.
    Type: Grant
    Filed: February 23, 2005
    Date of Patent: September 4, 2007
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jack Deng, Chin Chen Kuo, Fu-Tien Weng, Chih-Kung Chang, Bii-Junq Chang
  • Publication number: 20060206631
    Abstract: A data duplication method and system used between USB devices is exploited to control data transmission between a source USB device and at least a target USB device without any assistance from a computer. The duplication system comprises at least a serial interface engine circuit, a CPU, and a data buffer unit. The CPU is connected to the source USB device and these target USB devices via these serial interface engine circuits. The CPU controls these serial interface engine circuits to transmit digital data in the source USB device to these target USB devices. The data buffer unit is connected to these serial interface engine circuits and the CPU, and is used to provide memory buffer space required during the digital data duplication process.
    Type: Application
    Filed: March 9, 2005
    Publication date: September 14, 2006
    Inventors: Chin-Chen Kuo, Fok-Kei Loo
  • Patent number: 7102542
    Abstract: An apparatus and a method for determining output signals according to pressure and depressing time mainly includes a timer, a scanner and a keyboard connecting electronically to the timer and the scanner. The keyboard has a plurality of button keys. When in use, the timer is set to zero and stops counting time. Then the scanner scans the keyboard to locate the button key being depressed by an external force. A signal is output depending on the external force. A first signal is output when the external force is small. When the external force is large and the time counted by the timer does not exceed a selected time period, the first signal is output. When the time counted by the timer exceeds the selected time period, a second signal is output. Thus input information may be entered through fewer button keys, and injury that might otherwise occur by using composite keys may be avoided.
    Type: Grant
    Filed: May 5, 2003
    Date of Patent: September 5, 2006
    Assignee: Lite-On Technology Corporation
    Inventors: Hsien-Ming Lin, Chin-Chen Kuo
  • Publication number: 20060019424
    Abstract: A method is provided for processing a substrate. The substrate has at least one filter region, a plurality of bond pads, and a plurality of scribe lines arranged around the filter region and bond pads. A first planarization layer is formed above the substrate. The planarization layer has a substantially flat top surface overlying the filter region, the bond pads and the scribe lines. At least one color resist layer is formed over the first planarization layer and within the filter region while the first planarization layer covers the bond pads and the scribe lines.
    Type: Application
    Filed: June 20, 2005
    Publication date: January 26, 2006
    Inventors: Fu-Tien Weng, Yu-Kung Hsiao, Hung-Jen Hsu, Yi-Ming Dai, Chin Chen Kuo, Te-Fu Tseng, Chih-Kung Chang, Jack Deng, Chung-Sheng Hsiung, Bii-Junq Chang
  • Patent number: 6964916
    Abstract: A method for processing a semiconductor substrate includes providing a substrate having at least one filter region with a plurality of bond pads in it. Metal is deposited above the bond pads, to reduce the bond pad step height. A planarization layer is formed such that the deposited metal has a height near to a height of the planarization layer. At least one color resist layer is formed above the planarization layer.
    Type: Grant
    Filed: February 17, 2004
    Date of Patent: November 15, 2005
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chin Chen Kuo, Chih-Kung Chang, Hung-Jen Hsu, Fu-Tien Weng, Te-Fu Tseng
  • Publication number: 20050242271
    Abstract: An image sensor device and method for forming said device are described. The image sensor structure comprises a substrate with photodiodes, an interconnect structure formed on the substrate, a color filter layer above the interconnect structure, a first microlens array, an overcoat layer, and a second microlens array. A key feature is that a second microlens has a larger radius of curvature than a first microlens. Additionally, each first microlens and second microlens is a flat convex lens. Thus, a thicker second microlens with a short focal length is aligned above a thinner first microlens having a long focal length. A light column that includes a first microlens, a second microlens and a color filter region is formed above each photodiode. A second embodiment involves replacing a second microlens in each light column with a plurality of smaller second microlenses that focus light onto a first microlens.
    Type: Application
    Filed: April 28, 2004
    Publication date: November 3, 2005
    Inventors: Fu-Tien Weng, Yu-Kung Hsiao, Chin-Kung Chang, Hung-Jen Hsu, Yi-Ming Dai, Chin-Chen Kuo
  • Patent number: 6956253
    Abstract: A color filter includes a substrate having a plurality of scribe lines arranged to form at least one filter region surrounded by the scribe lines. The scribe lines are at least partially filled with a resist material. At least one color resist layer is formed above the substrate within the at least one filter region.
    Type: Grant
    Filed: June 6, 2003
    Date of Patent: October 18, 2005
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Fu-Tien Weng, Yu-Kung Hsiao, Hung-Jen Hsu, Yi-Ming Dai, Chin-Chen Kuo, Te-Fu Tseng