Abstract: A method for determining a plant growth curve includes obtaining color images and depth images of a plant to be detected at different time points, performing alignment processing on each color image and each depth image to obtain an alignment image, detecting the color image through a pre-trained target detection model to obtain a target bounding box, calculating an area ratio of the target bounding box in the color image, determining a depth value of all pixel points in the target boundary frame according to the aligned image, performing denoising processing on each depth value to obtain a target depth value, generating a first growth curve of the plant to be detected according to the target depth values and corresponding time points, and generating a second growth curve of the plant to be detected according to the area ratios and the corresponding time points.

Abstract: An electrical connection structure is provided. The electrical connection structure includes a through hole, a first pad, a second pad and a conductive bridge. The through hole has a first end and a second end. The first pad at least partially surrounds the first end of the through hole and is electrically connected to a first circuit. The second pad is located at the second end of the through hole and is electrically connected to a second circuit. The conductive bridge is connected to the first pad and second pad through the through hole, thereby making the first and second circuits electrically connected to each other.

Abstract: A method for determining a height of a plant, an electronic device, and a storage medium are disclosed. In the method, a target image is obtained by mapping an obtained color image with an obtained depth image. The electronic device processes the color image by using a pre-trained mobilenet-ssd network, obtains a detection box appearance of the plant, and extracts target contours of the plant to be detected from the detection box. The electronic device determines a depth value of each of pixel points in the target contour according to the target image. Target depth values are obtained by performing a de-noising on depth values of the pixel points, and a height of the plant to be detected is determined according to the target depth value. The method improves accuracy of height determination of a plant.

Abstract: A bracket includes a bracket body and an imaging module. The imaging module includes a first light source, a first pattern plate, a second light source, a second pattern plate and an imaging screen. The first light source projects a first illumination light. The first pattern plate having a first transmissive pattern is located on an optical path of the first illumination light, such that the first illumination light passing through the first transmissive pattern becomes a first pattern light. The second light source projects a second illumination light. The second pattern plate having a second transmissive pattern is located on an optical path of the second illumination light, such that the second illumination light passing through the second transmissive pattern becomes a second pattern light. The imaging screen receives the projection of the first and second pattern light.

Abstract: A bracket includes a bracket body and an imaging module. The imaging module includes a first light source, a first pattern plate, a second light source, a second pattern plate and an imaging screen. The first light source projects a first illumination light. The first pattern plate having a first transmissive pattern is located on an optical path of the first illumination light, such that the first illumination light passing through the first transmissive pattern becomes a first pattern light. The second light source projects a second illumination light. The second pattern plate having a second transmissive pattern is located on an optical path of the second illumination light, such that the second illumination light passing through the second transmissive pattern becomes a second pattern light. The imaging screen receives the projection of the first and second pattern light.

Abstract: An imaging module includes abase, a light source, a light shielding member and a light transmissive member. The light source is disposed in the base. The light shielding member is connected to the base and includes a light transmissive region. The light transmissive member is selectively connected to one of the base and the light shielding member. The light source emits a light towards the light shielding member. The light passes through the light transmissive region and is projected to the light transmissive member, such that the light forms a light pattern corresponding to the light transmissive region through the light transmissive member.

Abstract: A method of enhancing generation efficiency of patterned optical coating is disclosed. When an exposure and development process is performed after a photoresist process on the silicon wafer, a dummy pattern is formed on a scribe line around a chip as a sacrificial layer. After an optical coating process is completed, the dummy pattern from the photoresist to be removed can be selected as the starting point of a photoresist lift-off process, such that the photoresist removal can be more efficient and accurate, and the generation efficiency of patterned optical coating is enhanced.

Abstract: A multi-functional hybrid filter comprises a transparent substrate having a hybrid light filtering portion and an infrared light filtering portion; wherein, said hybrid light filtering portion is constructed by an infrared light absorbing material layer and a reflective interference type infrared cut filtering layer (IRCF) formed on the surface of said transparent substrate.

Abstract: Disclosed is a composite multi-layer circuit board and the manufacturing method thereof, on which at least two sets of circuits are formed on a ceramic substrate for supplying power to two groups of different color temperature LEDs respectively; specifically, the two sets of circuits are intertwined with each other, so that the first color temperature LED and the second color temperature LED are disposed adjacently. Also, one of the circuits is embedded in the surface of the ceramic substrate.

Abstract: A method is provided for processing a substrate. The substrate has at least one filter region, a plurality of bond pads, and a plurality of scribe lines arranged around the filter region and bond pads. A first planarization layer is formed above the substrate. The planarization layer has a substantially flat top surface overlying the filter region, the bond pads and the scribe lines. At least one color resist layer is formed over the first planarization layer and within the filter region while the first planarization layer covers the bond pads and the scribe lines.

Abstract: The present invention provides an image sensor which comprises improved microlenses to cope with different optical requirements for oblique incident light or different components of light. In one embodiment, the image sensor comprises at least two microlenses having different radii of curvature. In another embodiment, the image sensor comprises at least one asymmetrical microlens.

Abstract: A method is provided for processing a substrate. The substrate has at least one filter region, a plurality of bond pads, and a plurality of scribe lines arranged around the filter region and bond pads. A first planarization layer is formed above the substrate. The planarization layer has a substantially flat top surface overlying the filter region, the bond pads and the scribe lines. At least one color resist layer is formed over the first planarization layer and within the filter region while the first planarization layer covers the bond pads and the scribe lines.

Abstract: The present invention provides an image sensor which comprises improved microlenses to cope with different optical requirements for oblique incident light or different components of light. In one embodiment, the image sensor comprises at least two microlenses having different radii of curvature. In another embodiment, the image sensor comprises at least one asymmetrical microlens.

Abstract: A method is provided for processing a substrate. The substrate has at least one filter region, a plurality of bond pads, and a plurality of scribe lines arranged around the filter region and bond pads. A first planarization layer is formed above the substrate. The planarization layer has a substantially flat top surface overlying the filter region, the bond pads and the scribe lines. At least one color resist layer is formed over the first planarization layer and within the filter region while the first planarization layer covers the bond pads and the scribe lines.

Abstract: A method of manufacturing a microlens device by depositing a microlens material layer over a substrate that includes photo-sensors. The microlens material layer is then exposed and developed to define microlens material elements, including first microlens material elements and second microlens material elements. Each second microlens material element is substantially greater in thickness relative to each first microlens material element. The microlens material elements are then heated to form a microlens array that includes first microlens array elements, each corresponding to a first microlens material element, and second microlens array elements, each corresponding to a second microlens material element. Each first microlens array element has a substantially greater focal length relative to each second microlens array element. For example, each second microlens array element is substantially greater in thickness relative to each first microlens array element.

Abstract: An image sensor device and method for forming said device are described. The image sensor structure comprises a substrate with photodiodes, an interconnect structure formed on the substrate, a color filter layer above the interconnect structure, a first microlens array, an overcoat layer, and a second microlens array. A key feature is that a second microlens has a larger radius of curvature than a first microlens. Additionally, each first microlens and second microlens is a flat convex lens. Thus, a thicker second microlens with a short focal length is aligned above a thinner first microlens having a long focal length. A light column that includes a first microlens, a second microlens and a color filter region is formed above each photodiode. A second embodiment involves replacing a second microlens in each light column with a plurality of smaller second microlenses that focus light onto a first microlens.

Abstract: The present invention provides an image sensor which comprises improved microlenses to cope with different optical requirements for oblique incident light or different components of light. In one embodiment, the image sensor comprises at least two microlenses having different radii of curvature. In another embodiment, the image sensor comprises at least one asymmetrical microlens.

Abstract: A method of manufacturing a microlens device by depositing a microlens material layer over a substrate that includes photo-sensors. The microlens material layer is then exposed and developed to define microlens material elements, including first microlens material elements and second microlens material elements. Each second microlens material element is substantially greater in thickness relative to each first microlens material element. The microlens material elements are then heated to form a microlens array that includes first microlens array elements, each corresponding to a first microlens material element, and second microlens array elements, each corresponding to a second microlens material element. Each first microlens array element has a substantially greater focal length relative to each second microlens array element. For example, each second microlens array element is substantially greater in thickness relative to each first microlens array element.

Abstract: A method of manufacturing a plurality of microlenses on a substrate comprises forming a grid having raised ridges defining a plurality of openings on the substrate and forming a plurality of patterned photoresist features each disposed within one of the plurality of openings. The plurality of patterned photoresist features can then be reflowed inside the grid.

Abstract: A data duplication method and system used between USB devices is exploited to control data transmission between a source USB device and at least a target USB device without any assistance from a computer. The duplication system comprises at least a serial interface engine circuit, a CPU, and a data buffer unit. The CPU is connected to the source USB device and these target USB devices via these serial interface engine circuits. The CPU controls these serial interface engine circuits to transmit digital data in the source USB device to these target USB devices. The data buffer unit is connected to these serial interface engine circuits and the CPU, and is used to provide memory buffer space required during the digital data duplication process.