Patents by Inventor CHIN-CHEN LIU

CHIN-CHEN LIU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11966170
    Abstract: A method includes receiving a wafer, measuring a surface topography of the wafer; calculating a topographical variation based on the surface topography measurement performing a single-zone alignment compensation when the topographical variation is less than a predetermined value or performing a multi-zone alignment compensation when the topographical variation is greater than the predetermined value; and performing a wafer alignment according to the single-zone alignment compensation or the multi-zone alignment compensation.
    Type: Grant
    Filed: October 27, 2020
    Date of Patent: April 23, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Ai-Jen Hung, Yung-Yao Lee, Heng-Hsin Liu, Chin-Chen Wang, Ying Ying Wang
  • Patent number: 11935894
    Abstract: An integrated circuit device includes a device layer having devices spaced in accordance with a predetermined device pitch, a first metal interconnection layer disposed above the device layer and coupled to the device layer, and a second metal interconnection layer disposed above the first metal interconnection layer and coupled to the first metal interconnection layer through a first via layer. The second metal interconnection layer has metal lines spaced in accordance with a predetermined metal line pitch, and a ratio of the predetermined metal line pitch to predetermined device pitch is less than 1.
    Type: Grant
    Filed: November 4, 2022
    Date of Patent: March 19, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Fong-yuan Chang, Chun-Chen Chen, Po-Hsiang Huang, Lee-Chung Lu, Chung-Te Lin, Jerry Chang Jui Kao, Sheng-Hsiung Chen, Chin-Chou Liu
  • Publication number: 20230084973
    Abstract: A method of manufacturing liquid crystal panels with special dimensions is introduced and includes providing a standard liquid crystal panel having standard dimensions and having a plurality of pixel scan driving circuits, with the pixel scan driving circuits each including a first pixel scan driving circuit directly electrically connected to an initiating pulse circuit; and executing a laser beam mending process, such that at least one initiating pixel scan driving circuit in the pixel scan driving circuits starts later than the first pixel scan driving circuits and is bridged to the initiating pulse circuit to define a partition display area on the standard liquid crystal panel; and cutting the standard liquid crystal panel to cut the standard liquid crystal panel with standard dimensions to form a liquid crystal panel with special dimensions according to the partition display area. A liquid crystal panel with special dimensions is further introduced.
    Type: Application
    Filed: September 16, 2021
    Publication date: March 16, 2023
    Inventors: CHIN-CHEN LIU, JUNG-CHI LO
  • Publication number: 20210109279
    Abstract: An advertising display device includes a base body, a light-guiding unit, a light-emitting unit and an audio and video output unit. Therefore, the audio and video output unit plays the advertising film, and the light-emitting unit carries out the demonstration of the light source in conjunction with the light-guiding unit at the time of playing the advertising film to increase visual effects and attract the attention of consumers for achieving a better advertising effectiveness.
    Type: Application
    Filed: November 12, 2019
    Publication date: April 15, 2021
    Inventors: Chun-Hung Chen, Chin-Chen Liu, Shang-Wei Liu
  • Publication number: 20160334666
    Abstract: A LCD heating control system and method enable a backlight module in a LCD to heat a LCD panel in the LCD. The LCD heating control system includes a heat-conducting element and a micro control temperature sensing circuit. The micro control temperature sensing circuit determines whether the sensed LCD temperature meets a heating requirement and, when the determination is affirmative, enables the backlight module to operate at a high power mode and heat to be transferred from the backlight module to the LCD panel through the heat-conducting element.
    Type: Application
    Filed: May 15, 2015
    Publication date: November 17, 2016
    Inventor: CHIN-CHEN LIU