Abstract: An eardrum incision device includes a main body, a replaceable inserting portion and a display device. The replaceable inserting portion is detachably connected to the main body. The replaceable inserting portion has an insertion end located on a side far away from the main body and adapted to be inserted into an ear canal of a user. The replaceable inserting portion includes an image-capturing device, a mounting hole and a replaceable incision component. The image-capturing device is disposed at the insertion end. The mounting hole extends in a direction from the insertion end toward the main body. The replaceable incision component is removably disposed in the mounting hole and adapted to pierce out of the mounting hole in a direction toward the insertion end, so as to incise the eardrum of the user. The display device is disposed on the main body and electrically connected to the image-capturing device.

Abstract: In an electric toaster, a power switch unit is switched by a actuator provided on a support seat, which is movable together with a carriage, from an OFF-mode, where power to an electric heating unit is cut-off, to an ON-mode, where power is supplied to the heating unit, when the carriage is moved from an upper limit position to a lower limit position. A control unit energizes an electromagnet when the switch unit is switched to the ON-mode to attract a magnetically-attracted plate on the seat so that, once a force to move the carriage to the lower limit position is relieved, a biasing device biases the carriage to move from the lower limit position to a toasting position, thereby holding the seat in a lower retaining position against biasing action of a biasing member and thereby holding the carriage in the toasting position.

Abstract: A new method of preparing for inspection a wafer having multilayer interconnections is described. Semiconductor device structures having multilayer interconnections are provided in and on a semiconductor substrate wherein the multilayer interconnections comprise alternating layers of oxide interlevel dielectric layers and conducting layers and wherein interconnections are made between the conducting layers through the interlevel dielectric layers and wherein a non-oxide passivation layer overlies the topmost dielectric layer. The non-oxide passivation layer is removed and an oxide passivation layer is deposited overlying the topmost dielectric layer. The oxide passivation layer and interlevel dielectric layers and conducting layers are cut through to expose a sidewall to reveal the multilayer interconnections.