Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a spacer adjacent to the MTJ, a liner adjacent to the spacer, and a first metal interconnection on the MTJ. Preferably, the first metal interconnection includes protrusions adjacent to two sides of the MTJ and a bottom surface of the protrusions contact the liner directly.

Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a first spacer on one side of the of the MTJ, a second spacer on another side of the MTJ, a first metal interconnection on the MTJ, and a liner adjacent to the first spacer, the second spacer, and the first metal interconnection. Preferably, each of a top surface of the MTJ and a bottom surface of the first metal interconnection includes a planar surface and two sidewalls of the first metal interconnection are aligned with two sidewalls of the MTJ.

Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a first spacer on one side of the of the MTJ, a second spacer on another side of the MTJ, a first metal interconnection on the MTJ, and a liner adjacent to the first spacer, the second spacer, and the first metal interconnection. Preferably, each of a top surface of the MTJ and a bottom surface of the first metal interconnection includes a planar surface and two sidewalls of the first metal interconnection are aligned with two sidewalls of the MTJ.

Abstract: A frame assembly includes a carrier and a frame. The carrier includes a bottom wall, and inner and outer side walls. The bottom wall is formed with an opening. The inner side wall is located in the opening. The inner and outer side walls extend from the bottom wall along an upright direction. The inner and outer side walls respectively include first inner and outer engaging structures. The outer side wall is spaced from the inner side wall. The frame includes a frame body, and inner and outer lateral walls. The inner and outer lateral walls extend from the frame body and respectively include second inner and outer engaging structures. The outer lateral wall is spaced from the inner lateral wall. The first and second inner engaging structures are engaged with each other, and the first and second outer engaging structures are engaged with each other.

Abstract: A frame assembly includes a carrier and a frame. The carrier includes a bottom wall, and inner and outer side walls. The bottom wall is formed with an opening. The inner side wall is located in the opening. The inner and outer side walls extend from the bottom wall along an upright direction. The inner and outer side walls respectively include first inner and outer engaging structures. The outer side wall is spaced from the inner side wall. The frame includes a frame body, and inner and outer lateral walls. The inner and outer lateral walls extend from the frame body and respectively include second inner and outer engaging structures. The outer lateral wall is spaced from the inner lateral wall. The first and second inner engaging structures are engaged with each other, and the first and second outer engaging structures are engaged with each other.

Abstract: An incision fixation device for single site laparoscopy is coupled with a sleeve to be positioned on a surgical incision. The sleeve has one isolation portion containing a passage. The fixation device includes a bracing member located in the passage, a compact member coupled to the isolation portion, and an upper lid containing a plurality of guiding portions and a second engaging portion. The bracing member has an anchor end and a first engaging portion. The compact member has at least one holding portion to hold the anchor end with the isolation portion interposed therebetween. The second engaging portion is releasably engaged with the first engaging portion. Each guiding portion has an instrument passage to guide a surgical instrument to pass through the surgical incision. The compact member has a first and a second fastening mechanisms that are movable against each other to press the anchor end and isolation portion.

Abstract: This invention provides a trocar cannula adapted to form a seal around a surgical instrument, the trocar cannula comprising: a housing for receiving the surgical instrument; an elastomeric septum seal disposed in the housing, the elastomeric septum seal comprising a septum seal defining an orifice having a diameter substantially no greater than the diameter of the surgical instrument so that during insertion of the surgical instrument, the septum seal forms a seal with the surgical instrument; a cannula tube connected to the housing; a zero closure valve disposed between the cannula tube and the housing; and an elastic ring disposed surrounding the elastomeric septum seal, the elastic ring being capable of changing its shape in accordance with the movement of the elastomeric septum seal so as to enable the septum seal to maintain a tight seal around the surgical instrument when the surgical instrument is moved.

Abstract: Disclosed is an improved tetraethylorthosilicate (TEOS) deposition apparatus for semiconductor manufacture processes, in which the apparatus comprises a furnace chamber for performing TEOS deposition and an exhaust pipe line connected with the furnace chamber for discharging a gas from the furnace chamber, and the exhaust pipe line is connected with a main valve, an automatic pressure control (APC) valve and a pump in sequence. The improvement is characterized in that the exhaust pipe line further connects a disc trap between the main valve and APC valve for filtering the gas in the exhaust pipe line. With the insertion of the disc trap in the exhaust pipe line to collect and filter TEOS deposition from the gas in the exhaust pipe line, failure and wearing of the APC valve caused by TEOS due to temperature variations are prevented, thereby increasing the lifetime of the APC valve and reducing the failure possibility.