Patents by Inventor Chin Cheng Hsu
Chin Cheng Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240153840Abstract: A method for forming a package structure is provided. The method includes disposing a semiconductor die over a carrier substrate, wherein a removable film is formed over the semiconductor die, disposing a first stacked die package structure over the carrier substrate, wherein a top surface of the removable film is higher than a top surface of the first stacked die package structure, and removing the removable film to expose a top surface of the semiconductor die, wherein a top surface of the semiconductor die is lower than the top surface of the first stacked die package structure.Type: ApplicationFiled: January 18, 2024Publication date: May 9, 2024Inventors: Shin-Puu JENG, Po-Yao LIN, Feng-Cheng HSU, Shuo-Mao CHEN, Chin-Hua WANG
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Publication number: 20240096731Abstract: A semiconductor package is provided, which includes a first chip disposed over a first package substrate, a molding compound surrounding the first chip, a first thermal interface material disposed over the first chip and the molding compound, a heat spreader disposed over the thermal interface material, and a second thermal interface material disposed over the heat spreader. The first thermal interface material and the second thermal interface material have an identical width.Type: ApplicationFiled: November 29, 2023Publication date: March 21, 2024Inventors: Chin-Hua WANG, Po-Yao LIN, Feng-Cheng HSU, Shin-Puu JENG, Wen-Yi LIN, Shu-Shen YEH
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Publication number: 20240094626Abstract: A pellicle for an extreme ultraviolet (EUV) photomask includes a pellicle frame and a main membrane attached to the pellicle frame. The main membrane includes a plurality of nanotubes, and each of the plurality of nanotubes is covered by a coating layer containing Si and one or more metal elements.Type: ApplicationFiled: April 12, 2023Publication date: March 21, 2024Inventors: Pei-Cheng HSU, Wei-Hao LEE, Huan-Ling LEE, Hsin-Chang LEE, Chin-Hsiang LIN
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Publication number: 20240084447Abstract: A sealing article includes a body and a coating layer disposed on at least one surface of the body. The body comprises a polymeric elastomer such as perfluoroelastomer or fluoroelastomer. The coating layer comprises at least one metal. The sealing article may be a seal, a gasket, an O-ring, a T-ring or any other suitable product. The sealing article is resistant to ultra-violet (UV) light and plasma, and may be used for sealing a semiconductor processing chamber.Type: ApplicationFiled: November 17, 2023Publication date: March 14, 2024Inventors: Peng-Cheng Hong, Jun-Liang Pu, W.L. Hsu, Chung-Hao Kao, Chia-Chun Hung, Cheng-Yi Wu, Chin-Szu Lee
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Patent number: 11920238Abstract: A method of making a sealing article that includes a body and a coating layer disposed on at least one surface of the body. The body comprises a polymeric elastomer such as perfluoroelastomer or fluoroelastomer. The coating layer comprises at least one metal. The sealing article may be a seal, a gasket, an O-ring, a T-ring or any other suitable product. The sealing article is resistant to ultra-violet (UV) light and plasma, and may be used for sealing a semiconductor processing chamber.Type: GrantFiled: July 22, 2022Date of Patent: March 5, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Peng-Cheng Hong, Jun-Liang Pu, W. L. Hsu, Chung-Hao Kao, Chia-Chun Hung, Cheng-Yi Wu, Chin-Szu Lee
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Patent number: 11915992Abstract: A method for forming a package structure is provided, including forming an interconnect structure over a carrier substrate and forming a semiconductor die over a first side of the interconnect structure. A removable film is formed over the semiconductor die. The method includes forming a first stacked die package structure over the first side of the interconnect structure. A top surface of the removable film is higher than a top surface of the first stacked die package structure. The method includes forming a package layer, removing a portion of the package layer to expose a portion of the removable film, removing the removable film to form a recess, forming a lid structure over the semiconductor die and the first stacked die package structure. The lid structure has a main portion and a protruding portion disposed in the recess and extending from the main portion.Type: GrantFiled: February 24, 2022Date of Patent: February 27, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Shin-Puu Jeng, Po-Yao Lin, Feng-Cheng Hsu, Shuo-Mao Chen, Chin-Hua Wang
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Patent number: 10309578Abstract: A quick release pivot module is provided for connecting with a display and a supporting frame. The supporting frame includes a first joint, whereas the quick release pivot module includes a pivot structure and a quick release structure. A second joint and a first connector are pivotally assembled in the pivot structure, so that the first connector can pivot with respect to the second joint. The quick release structure has a first engaging portion and a second engaging portion connected with the first joint and the second joint, respectively. When the second engaging portion is engaged with the first engaging portion, the second joint of the quick release pivot module is fastened to and the first joint of the supporting frame. On the contrary, when the second engaging portion is disengaged with the first engaging portion, the second joint is adapted to being detachable from the first joint.Type: GrantFiled: August 23, 2017Date of Patent: June 4, 2019Assignee: SYNCMOLD ENTERPRISE CORP.Inventors: Ching-Hui Yen, Chin-Cheng Hsu, Jen-Yi Lee
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Publication number: 20180187822Abstract: A quick release pivot module is provided for connecting with a display and a supporting frame. The supporting frame includes a first joint, whereas the quick release pivot module includes a pivot structure and a quick release structure. A second joint and a first connector are pivotally assembled in the pivot structure, so that the first connector can pivot with respect to the second joint. The quick release structure has a first engaging portion and a second engaging portion connected with the first joint and the second joint, respectively. When the second engaging portion is engaged with the first engaging portion, the second joint of the quick release pivot module is fastened to and the first joint of the supporting frame. On the contrary, when the second engaging portion is disengaged with the first engaging portion, the second joint is adapted to being detachable from the first joint.Type: ApplicationFiled: August 23, 2017Publication date: July 5, 2018Inventors: Ching-Hui YEN, Chin-Cheng HSU, Jen-Yi LEE
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Patent number: 9865251Abstract: A text-to-speech method and a multi-lingual speech synthesizer using the method are disclosed. The multi-lingual speech synthesizer and the method executed by a processor are applied for processing a multi-lingual text message in a mixture of a first language and a second language into a multi-lingual voice message. The multi-lingual speech synthesizer comprises a storage device configured to store a first language model database, a second language model database, a broadcasting device configured to broadcast the multi-lingual voice message, and a processor, connected to the storage device and the broadcasting device, configured to execute the method disclosed herein.Type: GrantFiled: December 2, 2015Date of Patent: January 9, 2018Assignee: ASUSTeK COMPUTER INC.Inventors: Hsun-Fu Liu, Abhishek Pandey, Chin-Cheng Hsu
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Publication number: 20170047060Abstract: A text to-speech method and a multi-lingual speech synthesizer using the method are disclosed. The multi-lingual speech synthesizer and the method executed by processor are applied for processing a multi-lingual text message in a mixture of a first language and a second language into a multi-lingual voice message. The multi-lingual speech synthesizer comprises a storage device configured to store a first language model database, second language model database a broadcasting device configured to broadcast the multi-lingual voice message, and a processor, connected to the storage de ice and the broadcasting device, configured to ex cute the method disclosed herein.Type: ApplicationFiled: December 2, 2015Publication date: February 16, 2017Inventors: Hsun-Fu LIU, Abhishek Pandey, Chin-Cheng HSU
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Patent number: 9080718Abstract: A display lifting device includes: a body; an adjusting unit having big and small wheels coaxially disposed on the body, a shaft fixed to the body, and a rock arm pivotally fixed to the shaft and having first and second arms; a spring having one end fixed to the body; a first rope member wound on the small wheel and having two ends connected to the first arm and the other end of the spring, respectively; and a second rope member wound on the small and big wheels and having one end connected to the second arm, and a sliding unit for carrying a display such that the display is movable between a first position and a second position. Since the sum of torques produced on the first and second arms is kept equal to zero, the display can stop at any position between the first and second positions.Type: GrantFiled: November 22, 2013Date of Patent: July 14, 2015Assignee: SYNCMOLD ENTERPRISE CORP.Inventors: Chin-Hsing Kuo, Wei-Hsiang Hsiu, Fong-Ci Syu, Cheng-Yu Huang, Lung-Yu Chang, Chin-Cheng Hsu
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Publication number: 20150053830Abstract: A display lifting device includes: a body; an adjusting unit having big and small wheels coaxially disposed on the body, a shaft fixed to the body, and a rock arm pivotally fixed to the shaft and having first and second arms; a spring having one end fixed to the body; a first rope member wound on the small wheel and having two ends connected to the first arm and the other end of the spring, respectively; and a second rope member wound on the small and big wheels and having one end connected to the second arm, and a sliding unit for carrying a display such that the display is movable between a first position and a second position. Since the sum of torques produced on the first and second arms is kept equal to zero, the display can stop at any position between the first and second positions.Type: ApplicationFiled: November 22, 2013Publication date: February 26, 2015Applicant: SYNCMOLD ENTERPRISE CORP.Inventors: Chin-Hsing KUO, Wei-Hsiang HSIU, Fong-Ci SYU, Cheng-Yu HUANG, Lung-Yu CHANG, Chin-Cheng HSU
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Publication number: 20030066193Abstract: A gel composition that displays changes in temperature through color changes, characterized in that the gel composition can show changes in temperature by changing its color and the entire color of the composition will change when there is a 2 degree centigrade change in its immediate environment. The method of manufacturing the gel composition includes the steps of: mixing 75% of water by weight with 25% of vinyl alcohol by weight and stirring well the mixture of water and vinyl alcohol, heating the mixture to 70 degrees centigrade to form a gel material, adding temperature sensitive colorant into the gel material and completely dissolving the colorant into the gel material, and filing the gel material into a transparent pocket made of TPU/PVC/EVA film and sealing the pocket.Type: ApplicationFiled: October 5, 2001Publication date: April 10, 2003Inventor: Chin Cheng Hsu