Patents by Inventor Chin Cheng Hsu

Chin Cheng Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240153840
    Abstract: A method for forming a package structure is provided. The method includes disposing a semiconductor die over a carrier substrate, wherein a removable film is formed over the semiconductor die, disposing a first stacked die package structure over the carrier substrate, wherein a top surface of the removable film is higher than a top surface of the first stacked die package structure, and removing the removable film to expose a top surface of the semiconductor die, wherein a top surface of the semiconductor die is lower than the top surface of the first stacked die package structure.
    Type: Application
    Filed: January 18, 2024
    Publication date: May 9, 2024
    Inventors: Shin-Puu JENG, Po-Yao LIN, Feng-Cheng HSU, Shuo-Mao CHEN, Chin-Hua WANG
  • Publication number: 20240096731
    Abstract: A semiconductor package is provided, which includes a first chip disposed over a first package substrate, a molding compound surrounding the first chip, a first thermal interface material disposed over the first chip and the molding compound, a heat spreader disposed over the thermal interface material, and a second thermal interface material disposed over the heat spreader. The first thermal interface material and the second thermal interface material have an identical width.
    Type: Application
    Filed: November 29, 2023
    Publication date: March 21, 2024
    Inventors: Chin-Hua WANG, Po-Yao LIN, Feng-Cheng HSU, Shin-Puu JENG, Wen-Yi LIN, Shu-Shen YEH
  • Publication number: 20240094626
    Abstract: A pellicle for an extreme ultraviolet (EUV) photomask includes a pellicle frame and a main membrane attached to the pellicle frame. The main membrane includes a plurality of nanotubes, and each of the plurality of nanotubes is covered by a coating layer containing Si and one or more metal elements.
    Type: Application
    Filed: April 12, 2023
    Publication date: March 21, 2024
    Inventors: Pei-Cheng HSU, Wei-Hao LEE, Huan-Ling LEE, Hsin-Chang LEE, Chin-Hsiang LIN
  • Publication number: 20240084447
    Abstract: A sealing article includes a body and a coating layer disposed on at least one surface of the body. The body comprises a polymeric elastomer such as perfluoroelastomer or fluoroelastomer. The coating layer comprises at least one metal. The sealing article may be a seal, a gasket, an O-ring, a T-ring or any other suitable product. The sealing article is resistant to ultra-violet (UV) light and plasma, and may be used for sealing a semiconductor processing chamber.
    Type: Application
    Filed: November 17, 2023
    Publication date: March 14, 2024
    Inventors: Peng-Cheng Hong, Jun-Liang Pu, W.L. Hsu, Chung-Hao Kao, Chia-Chun Hung, Cheng-Yi Wu, Chin-Szu Lee
  • Patent number: 11920238
    Abstract: A method of making a sealing article that includes a body and a coating layer disposed on at least one surface of the body. The body comprises a polymeric elastomer such as perfluoroelastomer or fluoroelastomer. The coating layer comprises at least one metal. The sealing article may be a seal, a gasket, an O-ring, a T-ring or any other suitable product. The sealing article is resistant to ultra-violet (UV) light and plasma, and may be used for sealing a semiconductor processing chamber.
    Type: Grant
    Filed: July 22, 2022
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Peng-Cheng Hong, Jun-Liang Pu, W. L. Hsu, Chung-Hao Kao, Chia-Chun Hung, Cheng-Yi Wu, Chin-Szu Lee
  • Patent number: 11915992
    Abstract: A method for forming a package structure is provided, including forming an interconnect structure over a carrier substrate and forming a semiconductor die over a first side of the interconnect structure. A removable film is formed over the semiconductor die. The method includes forming a first stacked die package structure over the first side of the interconnect structure. A top surface of the removable film is higher than a top surface of the first stacked die package structure. The method includes forming a package layer, removing a portion of the package layer to expose a portion of the removable film, removing the removable film to form a recess, forming a lid structure over the semiconductor die and the first stacked die package structure. The lid structure has a main portion and a protruding portion disposed in the recess and extending from the main portion.
    Type: Grant
    Filed: February 24, 2022
    Date of Patent: February 27, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shin-Puu Jeng, Po-Yao Lin, Feng-Cheng Hsu, Shuo-Mao Chen, Chin-Hua Wang
  • Patent number: 10309578
    Abstract: A quick release pivot module is provided for connecting with a display and a supporting frame. The supporting frame includes a first joint, whereas the quick release pivot module includes a pivot structure and a quick release structure. A second joint and a first connector are pivotally assembled in the pivot structure, so that the first connector can pivot with respect to the second joint. The quick release structure has a first engaging portion and a second engaging portion connected with the first joint and the second joint, respectively. When the second engaging portion is engaged with the first engaging portion, the second joint of the quick release pivot module is fastened to and the first joint of the supporting frame. On the contrary, when the second engaging portion is disengaged with the first engaging portion, the second joint is adapted to being detachable from the first joint.
    Type: Grant
    Filed: August 23, 2017
    Date of Patent: June 4, 2019
    Assignee: SYNCMOLD ENTERPRISE CORP.
    Inventors: Ching-Hui Yen, Chin-Cheng Hsu, Jen-Yi Lee
  • Publication number: 20180187822
    Abstract: A quick release pivot module is provided for connecting with a display and a supporting frame. The supporting frame includes a first joint, whereas the quick release pivot module includes a pivot structure and a quick release structure. A second joint and a first connector are pivotally assembled in the pivot structure, so that the first connector can pivot with respect to the second joint. The quick release structure has a first engaging portion and a second engaging portion connected with the first joint and the second joint, respectively. When the second engaging portion is engaged with the first engaging portion, the second joint of the quick release pivot module is fastened to and the first joint of the supporting frame. On the contrary, when the second engaging portion is disengaged with the first engaging portion, the second joint is adapted to being detachable from the first joint.
    Type: Application
    Filed: August 23, 2017
    Publication date: July 5, 2018
    Inventors: Ching-Hui YEN, Chin-Cheng HSU, Jen-Yi LEE
  • Patent number: 9865251
    Abstract: A text-to-speech method and a multi-lingual speech synthesizer using the method are disclosed. The multi-lingual speech synthesizer and the method executed by a processor are applied for processing a multi-lingual text message in a mixture of a first language and a second language into a multi-lingual voice message. The multi-lingual speech synthesizer comprises a storage device configured to store a first language model database, a second language model database, a broadcasting device configured to broadcast the multi-lingual voice message, and a processor, connected to the storage device and the broadcasting device, configured to execute the method disclosed herein.
    Type: Grant
    Filed: December 2, 2015
    Date of Patent: January 9, 2018
    Assignee: ASUSTeK COMPUTER INC.
    Inventors: Hsun-Fu Liu, Abhishek Pandey, Chin-Cheng Hsu
  • Publication number: 20170047060
    Abstract: A text to-speech method and a multi-lingual speech synthesizer using the method are disclosed. The multi-lingual speech synthesizer and the method executed by processor are applied for processing a multi-lingual text message in a mixture of a first language and a second language into a multi-lingual voice message. The multi-lingual speech synthesizer comprises a storage device configured to store a first language model database, second language model database a broadcasting device configured to broadcast the multi-lingual voice message, and a processor, connected to the storage de ice and the broadcasting device, configured to ex cute the method disclosed herein.
    Type: Application
    Filed: December 2, 2015
    Publication date: February 16, 2017
    Inventors: Hsun-Fu LIU, Abhishek Pandey, Chin-Cheng HSU
  • Patent number: 9080718
    Abstract: A display lifting device includes: a body; an adjusting unit having big and small wheels coaxially disposed on the body, a shaft fixed to the body, and a rock arm pivotally fixed to the shaft and having first and second arms; a spring having one end fixed to the body; a first rope member wound on the small wheel and having two ends connected to the first arm and the other end of the spring, respectively; and a second rope member wound on the small and big wheels and having one end connected to the second arm, and a sliding unit for carrying a display such that the display is movable between a first position and a second position. Since the sum of torques produced on the first and second arms is kept equal to zero, the display can stop at any position between the first and second positions.
    Type: Grant
    Filed: November 22, 2013
    Date of Patent: July 14, 2015
    Assignee: SYNCMOLD ENTERPRISE CORP.
    Inventors: Chin-Hsing Kuo, Wei-Hsiang Hsiu, Fong-Ci Syu, Cheng-Yu Huang, Lung-Yu Chang, Chin-Cheng Hsu
  • Publication number: 20150053830
    Abstract: A display lifting device includes: a body; an adjusting unit having big and small wheels coaxially disposed on the body, a shaft fixed to the body, and a rock arm pivotally fixed to the shaft and having first and second arms; a spring having one end fixed to the body; a first rope member wound on the small wheel and having two ends connected to the first arm and the other end of the spring, respectively; and a second rope member wound on the small and big wheels and having one end connected to the second arm, and a sliding unit for carrying a display such that the display is movable between a first position and a second position. Since the sum of torques produced on the first and second arms is kept equal to zero, the display can stop at any position between the first and second positions.
    Type: Application
    Filed: November 22, 2013
    Publication date: February 26, 2015
    Applicant: SYNCMOLD ENTERPRISE CORP.
    Inventors: Chin-Hsing KUO, Wei-Hsiang HSIU, Fong-Ci SYU, Cheng-Yu HUANG, Lung-Yu CHANG, Chin-Cheng HSU
  • Publication number: 20030066193
    Abstract: A gel composition that displays changes in temperature through color changes, characterized in that the gel composition can show changes in temperature by changing its color and the entire color of the composition will change when there is a 2 degree centigrade change in its immediate environment. The method of manufacturing the gel composition includes the steps of: mixing 75% of water by weight with 25% of vinyl alcohol by weight and stirring well the mixture of water and vinyl alcohol, heating the mixture to 70 degrees centigrade to form a gel material, adding temperature sensitive colorant into the gel material and completely dissolving the colorant into the gel material, and filing the gel material into a transparent pocket made of TPU/PVC/EVA film and sealing the pocket.
    Type: Application
    Filed: October 5, 2001
    Publication date: April 10, 2003
    Inventor: Chin Cheng Hsu