Patents by Inventor Chin-Cheng Lo

Chin-Cheng Lo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Optical sensor chip package
    Patent number: 7405456
    Abstract: The present invention relates to an optical sensor chip package in a cavity of forming frame thereof and has a gap between protection layer and optical sensor chip. The optical sensor chip avoids accepting the pressure from protection layer that damage the reliability between pads and metallic traces when protection layer lay on the forming frame. It improves drawbacks of the glue pass trough the gap between optical sensor chip and pads into the optical sensor area of optical sensor chip. It improves the high process yield and reduces the height of optical sensor chip package to achieve lightly and thinly.
    Type: Grant
    Filed: September 14, 2005
    Date of Patent: July 29, 2008
    Assignee: Sigurd Microelectronics Corp.
    Inventors: Po-Hung Chen, Chin-Cheng Lo, Mao-Jung Chen
  • Optical sensor chip package
    Publication number: 20070090504
    Abstract: The present invention relates to an optical sensor chip package in a cavity of forming frame thereof and has a gap between protection layer and optical sensor chip. The optical sensor chip avoids accepting the pressure from protection layer that damage the reliability between pads and metallic traces when protection layer lay on the forming frame. It improves drawbacks of the glue pass trough the gap between optical sensor chip and pads into the optical sensor area of optical sensor chip. It improves the high process yield and reduces the height of optical sensor chip package to achieve lightly and thinly.
    Type: Application
    Filed: September 14, 2005
    Publication date: April 26, 2007
    Inventors: Po-Hung Chen, Chin-Cheng Lo, Mao-Jung Chen