Patents by Inventor Chin-Cheng Wang

Chin-Cheng Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11962847
    Abstract: A channel hiatus correction method for an HDMI device is provided. A recovery code from scrambled data of the stream is obtained. A liner feedback shift register (LFSR) value of channels of the HDMI port is obtained based on the recovery code and the scrambled data of the stream. The stream is de-scrambled according to the LFSR value of the channels of the HDMI port. Video data is displayed according to the de-scrambled stream.
    Type: Grant
    Filed: November 9, 2022
    Date of Patent: April 16, 2024
    Assignee: MEDIATEK INC.
    Inventors: Chia-Hao Chang, You-Tsai Jeng, Kai-Wen Yeh, Yi-Cheng Chen, Te-Chuan Wang, Kai-Wen Cheng, Chin-Lung Lin, Tai-Lai Tung, Ko-Yin Lai
  • Patent number: 11957064
    Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a spacer adjacent to the MTJ, a liner adjacent to the spacer, and a first metal interconnection on the MTJ. Preferably, the first metal interconnection includes protrusions adjacent to two sides of the MTJ and a bottom surface of the protrusions contact the liner directly.
    Type: Grant
    Filed: October 18, 2022
    Date of Patent: April 9, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Chen-Yi Weng, Yi-Wei Tseng, Chin-Yang Hsieh, Jing-Yin Jhang, Yi-Hui Lee, Ying-Cheng Liu, Yi-An Shih, I-Ming Tseng, Yu-Ping Wang
  • Publication number: 20240113199
    Abstract: A method of manufacturing a semiconductor device includes forming a gate electrode structure over a channel region, wherein the gate electrode structure includes a gate dielectric layer disposed over the first channel region, a gate electrode disposed over the gate dielectric layer, and insulating spacers disposed over opposing sidewalls of the gate electrode, wherein the gate dielectric layer is disposed over opposing sidewalls of the gate electrode. An interlayer dielectric layer is formed over opposing sidewalls of the insulating spacers. The insulating spacers are removed from an upper portion of the opposing sidewalls of the gate electrode to form trenches between the opposing sidewalls of the upper portion of the gate electrode and the interlayer dielectric layer, and the trenches are filled with an insulating material.
    Type: Application
    Filed: February 7, 2023
    Publication date: April 4, 2024
    Inventors: Jia-Chuan YOU, Chia-Hao Chang, Kuo-Cheng Chiang, Chin-Hao Wang
  • Publication number: 20240096731
    Abstract: A semiconductor package is provided, which includes a first chip disposed over a first package substrate, a molding compound surrounding the first chip, a first thermal interface material disposed over the first chip and the molding compound, a heat spreader disposed over the thermal interface material, and a second thermal interface material disposed over the heat spreader. The first thermal interface material and the second thermal interface material have an identical width.
    Type: Application
    Filed: November 29, 2023
    Publication date: March 21, 2024
    Inventors: Chin-Hua WANG, Po-Yao LIN, Feng-Cheng HSU, Shin-Puu JENG, Wen-Yi LIN, Shu-Shen YEH
  • Publication number: 20240081157
    Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a first spacer on one side of the of the MTJ, a second spacer on another side of the MTJ, a first metal interconnection on the MTJ, and a liner adjacent to the first spacer, the second spacer, and the first metal interconnection. Preferably, each of a top surface of the MTJ and a bottom surface of the first metal interconnection includes a planar surface and two sidewalls of the first metal interconnection are aligned with two sidewalls of the MTJ.
    Type: Application
    Filed: November 6, 2023
    Publication date: March 7, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Chen-Yi Weng, Yi-Wei Tseng, Chin-Yang Hsieh, Jing-Yin Jhang, Yi-Hui Lee, Ying-Cheng Liu, Yi-An Shih, I-Ming Tseng, Yu-Ping Wang
  • Publication number: 20240074328
    Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a first spacer on one side of the of the MTJ, a second spacer on another side of the MTJ, a first metal interconnection on the MTJ, and a liner adjacent to the first spacer, the second spacer, and the first metal interconnection. Preferably, each of a top surface of the MTJ and a bottom surface of the first metal interconnection includes a planar surface and two sidewalls of the first metal interconnection are aligned with two sidewalls of the MTJ.
    Type: Application
    Filed: November 6, 2023
    Publication date: February 29, 2024
    Applicant: United Microelectronics Corp.
    Inventors: Hui-Lin Wang, Chen-Yi Weng, Yi-Wei Tseng, Chin-Yang Hsieh, Jing-Yin Jhang, Yi-Hui Lee, Ying-Cheng Liu, Yi-An Shih, I-Ming Tseng, Yu-Ping Wang
  • Patent number: 11915992
    Abstract: A method for forming a package structure is provided, including forming an interconnect structure over a carrier substrate and forming a semiconductor die over a first side of the interconnect structure. A removable film is formed over the semiconductor die. The method includes forming a first stacked die package structure over the first side of the interconnect structure. A top surface of the removable film is higher than a top surface of the first stacked die package structure. The method includes forming a package layer, removing a portion of the package layer to expose a portion of the removable film, removing the removable film to form a recess, forming a lid structure over the semiconductor die and the first stacked die package structure. The lid structure has a main portion and a protruding portion disposed in the recess and extending from the main portion.
    Type: Grant
    Filed: February 24, 2022
    Date of Patent: February 27, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shin-Puu Jeng, Po-Yao Lin, Feng-Cheng Hsu, Shuo-Mao Chen, Chin-Hua Wang
  • Patent number: 11739642
    Abstract: The disclosed embodiment is related to a manufacturing method of a die-formed 3-dimensional plastic impeller of a centrifugal pump and the impeller manufactured thereby, including a mold for twisted blade and a mold for impeller outlet, the mold for twisted blade is configured to form a twisted blade portion of each blade of the impeller, the mold for impeller outlet is configured to form a rear portion of each blade, a hub rim part of the impeller, and a shroud rim part of the impeller so that the hub rim part, the shroud rim part, and the blades are formed in a single piece at the same molding process.
    Type: Grant
    Filed: September 25, 2019
    Date of Patent: August 29, 2023
    Assignee: ASSOMA INC.
    Inventors: Chih-Hsien Shih, Chih-Kuan Shih, Huan-Jan Chien, Shu-Yen Chien, Chin-Cheng Wang, Yuan Hung Lin, Peng-Hsiang Chen
  • Patent number: 11586948
    Abstract: An IoT system includes a computing module for controlling an integral function of the system and including an analysis unit and a machine learning unit. The analysis unit is capable of operational analysis and creating a predictive model and creating a predictive model according to the data analyzed. The machine learning unit has an algorithm function to create a corresponding learning model. An IoT module is electrically connected to the computing module to serve as an intermediate role. At least one detection unit is electrically connected to the IoT module and disposed in soil to detect data of environmental and soil conditions and sends the data detected to the computing module for subsequent analysis.
    Type: Grant
    Filed: October 20, 2019
    Date of Patent: February 21, 2023
    Assignee: National Yang Ming Chiao Tung University
    Inventors: Wen-Liang Chen, Lung-Chieh Chen, Szu-Chia Chen, Wei-Han Chen, Chun-Yu Chu, Yu-Chi Shih, Yu-Ci Chang, Tzu-I Hsieh, Yen-Ling Chen, Li-Chi Peng, Meng-Zhan Lee, Jui-Yu Ho, Chi-Yao Ku, Nian-Ruei Deng, Yuan-Yao Chan, Erick Wang, Tai-Hsiang Yen, Shao-Yu Chiu, Jiun-Yi Lin, Yun-Wei Lin, Fung Ling Ng, Yi-Bing Lin, Chin-Cheng Wang
  • Publication number: 20220213897
    Abstract: The disclosed embodiment is related to a manufacturing method of a die-formed 3-dimensional plastic impeller of a centrifugal pump and the impeller manufactured thereby, including a mold for twisted blade and a mold for impeller outlet, the mold for twisted blade is configured to form a twisted blade portion of each blade of the impeller, the mold for impeller outlet is configured to form a rear portion of each blade, a hub rim part of the impeller, and a shroud rim part of the impeller so that the hub rim part, the shroud rim part, and the blades are formed in a single piece at the same molding process.
    Type: Application
    Filed: September 25, 2019
    Publication date: July 7, 2022
    Inventors: Chih-Hsien SHIH, Chih-Kuan SHIH, Huan-Jan CHIEN, Shu-Yen CHIEN, Chin-Cheng WANG, Yuan Hung Lin, PENG-HSIANG CHEN
  • Publication number: 20210004694
    Abstract: An IoT system includes a computing module for controlling an integral function of the system and including an analysis unit and a machine learning unit. The analysis unit is capable of operational analysis and creating a predictive model and creating a predictive model according to the data analyzed. The machine learning unit has an algorithm function to create a corresponding learning model. An IoT module is electrically connected to the computing module to serve as an intermediate role. At least one detection unit is electrically connected to the IoT module and disposed in soil to detect data of environmental and soil conditions and sends the data detected to the computing module for subsequent analysis.
    Type: Application
    Filed: October 20, 2019
    Publication date: January 7, 2021
    Applicant: NATIONAL CHIAO TUNG UNIVERSITY
    Inventors: Wen-Liang Chen, Lung-Chieh Chen, Szu-Chia Chen, Wei-Han Chen, Chun-Yu Chu, Yu-Chi Shih, Yu-Ci Chang, Tzu-I Hsieh, Yen-Ling Chen, Li-Chi Peng, Meng-Zhan Lee, Jui-Yu Ho, Chi-Yao Ku, Nian-Ruei Deng, Yuan-Yao Chan, Erick Wang, Tai-Hsiang Yen, Shao-Yu Chiu, Jiun-Yi Lin, Yun-Wei Lin, Fung Ling Ng, Yi-Bing Lin, Chin-Cheng Wang
  • Patent number: 10267327
    Abstract: A sealless magnetic drive pump features in improving the stiffness of a stationary shaft. More particularly, the metal magnetic drive pump has an anti-corrosion casing liner. The magnetic drive pump is used in manufacture processes related to corrosive fluid. The pump is especially used in a highly corrosive and high-temperature (up to 200° C.) condition to improve the stiffness of a front support. The stationary shaft includes a metal front support integrated with the pump casing at a pump inlet and encapsulated with a resin enclosure made of a fluoropolymer; a rear shaft seat positioned on a sealed bottom side of a containment shell for offering auxiliary support for the stationary shaft; an impeller including a channel for reducing an inlet flow velocity to offer a low NPSHr.
    Type: Grant
    Filed: April 30, 2017
    Date of Patent: April 23, 2019
    Assignee: ASSOMA INC.
    Inventors: Huan-Jan Chien, Chin-Cheng Wang, Chih-Hsien Shih, Chih-Kuan Shih
  • Patent number: 10190593
    Abstract: A sealless magnetic drive pump features in improving the stiffness of a stationary shaft. More particularly, the metal magnetic drive pump has an anti-corrosion casing liner. The magnetic drive pump is used in manufacture processes related to corrosive fluid. The pump is especially used in a highly corrosive and high-temperature (up to 200° C.) condition to improve the stiffness of a front support. The stationary shaft includes a metal front support integrated with the pump casing at a pump inlet and encapsulated with a resin enclosure made of a fluoropolymer; a rear shaft seat positioned on a sealed bottom side of a containment shell for offering auxiliary support for the stationary shaft; an impeller including a channel for reducing an inlet flow velocity to offer a low NPSHr.
    Type: Grant
    Filed: April 30, 2017
    Date of Patent: January 29, 2019
    Assignee: ASSOMA INC.
    Inventors: Huan-Jan Chien, Chin-Cheng Wang, Chih-Hsien Shih, Chih-Kuan Shih
  • Patent number: 9951778
    Abstract: A structural improvement of the canned pump is to improve the stiffness of a stationary shaft and, according to requirement, to dispose a monitor device. The method for improving the stiffness of the stationary shaft includes axially inserting a shaft metal rear support of the metal structural of a motor rear casing of a canned motor into the inner side of a rotor yoke of an inner rotor of the canned motor, tightly attaching the shaft metal rear support to a rear shaft seat for improving the stiffness of the stationary shaft by longer hold length, and for shortening an arm length of the composite force. The monitor device, used for detecting the wear of a bearing for enhancing the reliability and satisfying the driving requirement, is installed in the ring slot to be protected by the rear shaft seat.
    Type: Grant
    Filed: August 12, 2016
    Date of Patent: April 24, 2018
    Assignee: ASSOMA INC.
    Inventors: Huan-Jan Chien, Chin-Cheng Wang, Chih-Hsien Shih
  • Patent number: 9897102
    Abstract: A structure improvement of a pump casing with a Polyfluoroalkoxy (PFA) liner which improves manufacturing efficiency, reduces manufacturing cost and improves yield strength, more particular to keep the stiffness of the shaft support and improve yield of the pump casing. The metal pump casing with the PFA liner used for handling corrosive liquids includes a suction casing with PFA liner, and a volute casing with PFA liner for accommodating an impeller. The volute casing also collects and then ejects the liquid through a discharge. The suction casing with the PFA liner and the volute casing with the PFA liner are separately formed as two workpieces by injection molding process and then assembled to form the pump casing so as to reduce the residual stress applied in the PFA liner.
    Type: Grant
    Filed: November 23, 2015
    Date of Patent: February 20, 2018
    Assignee: ASSOMA INC.
    Inventors: Chin-Cheng Wang, Chih-Hsien Shih, Chih-Kuan Shih, Yu-Lun Jhang, Huan-Jan Chien, Shu-Yen Chien
  • Publication number: 20170234326
    Abstract: A sealless magnetic drive pump features in improving the stiffness of a stationary shaft. More particularly, the metal magnetic drive pump has an anti-corrosion casing liner. The magnetic drive pump is used in manufacture processes related to corrosive fluid. The pump is especially used in a highly corrosive and high-temperature (up to 200° C.) condition to improve the stiffness of a front support. The stationary shaft includes a metal front support integrated with the pump casing at a pump inlet and encapsulated with a resin enclosure made of a fluoropolymer; a rear shaft seat positioned on a sealed bottom side of a containment shell for offering auxiliary support for the stationary shaft; an impeller including a channel for reducing an inlet flow velocity to offer a low NPSHr.
    Type: Application
    Filed: April 30, 2017
    Publication date: August 17, 2017
    Applicant: ASSOMA INC.
    Inventors: Huan-Jan CHIEN, Chin-Cheng WANG, Chih-Hsien SHIH, Chih-Kuan SHIH
  • Publication number: 20170234327
    Abstract: A sealless magnetic drive pump features in improving the stiffness of a stationary shaft. More particularly, the metal magnetic drive pump has an anti-corrosion casing liner. The magnetic drive pump is used in manufacture processes related to corrosive fluid. The pump is especially used in a highly corrosive and high-temperature (up to 200° C.) condition to improve the stiffness of a front support. The stationary shaft includes a metal front support integrated with the pump casing at a pump inlet and encapsulated with a resin enclosure made of a fluoropolymer; a rear shaft seat positioned on a sealed bottom side of a containment shell for offering auxiliary support for the stationary shaft; an impeller including a channel for reducing an inlet flow velocity to offer a low NPSHr.
    Type: Application
    Filed: April 30, 2017
    Publication date: August 17, 2017
    Applicant: ASSOMA INC.
    Inventors: Huan-Jan CHIEN, Chin-Cheng WANG, Chih-Hsien SHIH, Chih-Kuan SHIH
  • Patent number: 9702364
    Abstract: A structural improvement of the canned pump is to improve the stiffness of a stationary shaft and, according to requirement, to dispose a monitor device. The method for improving the stiffness of the stationary shaft includes axially inserting a shaft metal rear support of the metal structural of a motor rear casing of a canned motor into the inner side of a rotor yoke of an inner rotor of the canned motor, tightly attaching the shaft metal rear support to a rear shaft seat for improving the stiffness of the stationary shaft by longer hold length, and for shortening an arm length of the composite force. The monitor device, used for detecting the wear of a bearing for enhancing the reliability and satisfying the driving requirement, is installed in the ring slot to be protected by the rear shaft seat.
    Type: Grant
    Filed: August 12, 2016
    Date of Patent: July 11, 2017
    Assignee: ASSOMA INC.
    Inventors: Huan-Jan Chien, Chin-Cheng Wang, Chih-Hsien Shih
  • Patent number: 9670934
    Abstract: A sealless magnetic drive pump features in improving the stiffness of a stationary shaft. More particularly, the metal magnetic drive pump has an anti-corrosion casing liner. The magnetic drive pump is used in manufacture processes related to corrosive fluid. The pump is especially used in a highly corrosive and high-temperature (up to 200° C.) condition to improve the stiffness of a front support. The stationary shaft includes a metal front support integrated with the pump casing at a pump inlet and encapsulated with a resin enclosure made of a fluoropolymer; a rear shaft seat positioned on a sealed bottom side of a containment shell for offering auxiliary support for the stationary shaft; an impeller including a channel for reducing an inlet flow velocity to offer a low NPSHr.
    Type: Grant
    Filed: October 22, 2012
    Date of Patent: June 6, 2017
    Assignee: ASSOMA INC.
    Inventors: Huan-Jan Chien, Chin-Cheng Wang, Chih-Hsien Shih, Chih-Kuan Shih
  • Patent number: 9599113
    Abstract: A structural improvement of the canned pump is to improve the stiffness of a stationary shaft and, according to requirement, to dispose a monitor device. The method for improving the stiffness of the stationary shaft includes axially inserting a shaft metal rear support of the metal structural of a motor rear casing of a canned motor into the inner side of a rotor yoke of an inner rotor of the canned motor, tightly attaching the shaft metal rear support to a rear shaft seat for improving the stiffness of the stationary shaft by longer hold length, and for shortening an arm length of the composite force. The monitor device, used for detecting the wear of a bearing for enhancing the reliability and satisfying the driving requirement, is installed in the ring slot to be protected by the rear shaft seat.
    Type: Grant
    Filed: October 22, 2012
    Date of Patent: March 21, 2017
    Assignee: ASSOMA INC.
    Inventors: Huan-Jan Chien, Chin-Cheng Wang, Chih-Hsien Shih