Abstract: The disclosure provides an electronic device, including a circuit board, multiple semiconductor components, a first light reflecting structure, and a second light reflecting structure. The circuit board includes a substrate, and the substrate may have a first surface and at least one side surface. The multiple semiconductor components are disposed on the first surface. The first light reflecting structure is disposed on the first surface. The second light reflecting structure is disposed on the first surface and the at least one side surface.

Abstract: A circuit structure includes a light-transmissive insulation layer, a patterned conductive layer and an electronic component. The patterned conductive layer is disposed on the light-transmissive insulation layer. The electronic component is disposed on the patterned conductive layer and electrically connected to the patterned conductive layer.

Abstract: A circuit structure includes a light-transmissive insulation layer, a patterned conductive layer and an electronic component. The patterned conductive layer is disposed on the light-transmissive insulation layer. The electronic component is disposed on the patterned conductive layer and electrically connected to the patterned conductive layer.

Abstract: An illuminated keyboard including a backlight module and a key structure is provided. The backlight module includes a reflector, a light guide plate, a light source, and a light shielding plate. The light guide plate is disposed on the reflector, and a surface of the light guide plate facing the reflector has multiple microstructures. The light source is located on a light incident surface side of the light guide plate. The light shielding plate is disposed on the light guide plate. The light shielding plate has a shielding area and a light transmissive area, and the microstructures are correspondingly disposed in the light transmissive area. The key structure has multiple keycaps. In the microstructures correspondingly disposed under one single keycap, peaks of any two microstructures adjacent to each other keep different distances from the surface of the light guide plate facing the reflector.

Abstract: A circuit structure includes a light-transmissive insulation layer, a patterned conductive layer and an electronic component. The patterned conductive layer is disposed on the light-transmissive insulation layer. The electronic component is disposed on the patterned conductive layer and electrically connected to the patterned conductive layer.

Abstract: A circuit structure includes a light-transmissive insulation layer, a patterned conductive layer and an electronic component. The patterned conductive layer is disposed on the light-transmissive insulation layer. The electronic component is disposed on the patterned conductive layer and electrically connected to the patterned conductive layer.

Abstract: An illuminated keyboard including a backlight module and a key structure is provided. The backlight module includes a reflector, a light guide plate, a light source, and a light shielding plate. The light guide plate is disposed on the reflector, and a surface of the light guide plate facing the reflector has multiple microstructures. The light source is located on a light incident surface side of the light guide plate. The light shielding plate is disposed on the light guide plate. The light shielding plate has a shielding area and a light transmissive area, and the microstructures are correspondingly disposed in the light transmissive area. The key structure has multiple keycaps. In the microstructures correspondingly disposed under one single keycap, peaks of any two microstructures adjacent to each other keep different distances from the surface of the light guide plate facing the reflector.

Abstract: A circuit structure includes a light-transmissive insulation layer, a patterned conductive layer and an electronic component. The patterned conductive layer is disposed on the light-transmissive insulation layer. The electronic component is disposed on the patterned conductive layer and electrically connected to the patterned conductive layer.

Abstract: A tilt sensor comprises a multi-layer circuit board, a holder, a first light-sensing component, a second light-sensing component, a light-emitting component, and a movable component. The multi-layer circuit board comprises a first layer board and a second layer board disposed on the first layer board. The second layer board comprises first, second, and third holding spaces each of which exposing a respective portion of the first layer board. The holder is disposed on the second layer board and has a containing recess connecting the first, second, and third holding spaces. A bottom surface of the containing recess is reflective. The first and second light-sensing components and the light-emitting component are disposed on the first layer board and in the first, second, and third holding spaces, respectively. The light-emitting component emits a light beam toward the bottom surface of the containing recess. The movable component is disposed in the containing recess.

Abstract: A tilt sensor comprises a multi-layer circuit board, a holder, a first light-sensing component, a second light-sensing component, a light-emitting component, and a movable component. The multi-layer circuit board comprises a first layer board and a second layer board disposed on the first layer board. The second layer board comprises first, second, and third holding spaces each of which exposing a respective portion of the first layer board. The holder is disposed on the second layer board and has a containing recess connecting the first, second, and third holding spaces. A bottom surface of the containing recess is reflective. The first and second light-sensing components and the light-emitting component are disposed on the first layer board and in the first, second, and third holding spaces, respectively. The light-emitting component emits a light beam toward the bottom surface of the containing recess. The movable component is disposed in the containing recess.

Abstract: A structure of a lead-frame matrix of photoelectron devices is provided. The lead-frame matrix is used to fabricate a first lead-frame array and a second lead-frame array. In the structure of the lead-frame matrix of the photoelectron devices, pins of the first lead-frame array and pins of the second lead-frame array are alternatively inserted.

Abstract: A structure of a lead-frame matrix of photoelectron devices is provided. The lead-frame matrix is used to fabricate a first lead-frame array and a second lead-frame array. In the structure of the lead-frame matrix of the photoelectron devices, pins of the first lead-frame array and pins of the second lead-frame array are alternatively inserted.

Abstract: A structure of a lead-frame matrix of photoelectron devices is provided. The lead-frame matrix is used to fabricate a first lead-frame array and a second lead-frame array. In the structure of the lead-frame matrix of the photoelectron devices, pins of the first lead-frame array and pins of the second lead-frame array are alternatively inserted.

Abstract: A structure of a lead-frame matrix of photoelectron devices is provided. The lead-frame matrix is used to fabricate a first lead-frame array and a second lead-frame array. In the structure of the lead-frame matrix of the photoelectron devices, pins of the first lead-frame array and pins of the second lead-frame array are alternatively inserted.