Patents by Inventor Chin-Chih Chen
Chin-Chih Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240113032Abstract: Interconnect structure packages (e.g., through silicon vias (TSV) packages, through interlayer via (TIV) packages) may be pre-manufactured as opposed to forming TIVs directly on a carrier substrate during a manufacturing process for a semiconductor die package at backend packaging facility. The interconnect structure packages may be placed onto a carrier substrate during manufacturing of a semiconductor device package, and a semiconductor die package may be placed on the carrier substrate adjacent to the interconnect structure packages. A molding compound layer may be formed around and in between the interconnect structure packages and the semiconductor die package.Type: ApplicationFiled: April 25, 2023Publication date: April 4, 2024Inventors: Kai-Fung CHANG, Chin-Wei LIANG, Sheng-Feng WENG, Ming-Yu YEN, Cheyu LIU, Hung-Chih CHEN, Yi-Yang LEI, Ching-Hua HSIEH
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Publication number: 20220023998Abstract: A polishing pad is provided. The polishing pad, suitable for a polishing process, includes a polishing layer, an adhesive layer and at least one heat storage material. The polishing layer has a polishing surface and a back surface opposite to each other. The adhesive layer is disposed on the back surface of the polishing layer. A region where the at least one heat storage material is disposed is located above the adhesive layer.Type: ApplicationFiled: October 6, 2021Publication date: January 27, 2022Applicant: IV Technologies CO., Ltd.Inventors: Chin-Chih Chen, I-Ping Chen
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Patent number: 10239182Abstract: A polishing pad is provided. The polishing pad includes a polishing layer and a detection window. The detection window is disposed in the polishing layer. The modulus of the detection window is larger than the modulus of the polishing layer at 30° C., and the modulus of the detection window is smaller than the modulus of the polishing layer at 50° C.Type: GrantFiled: June 1, 2017Date of Patent: March 26, 2019Assignee: IV Technologies CO., Ltd.Inventors: Yi Jian, Wen-Chang Shih, Kun-Che Pai, Chin-Chih Chen
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Publication number: 20180281154Abstract: A polishing pad is provided. The polishing pad, suitable for a polishing process, includes a polishing layer, an adhesive layer and at least one heat storage material. The polishing layer has a polishing surface and a back surface opposite to each other. The adhesive layer is disposed on the back surface of the polishing layer. A region where the at least one heat storage material is disposed is located above the adhesive layer.Type: ApplicationFiled: March 28, 2018Publication date: October 4, 2018Applicant: IV Technologies CO., Ltd.Inventors: Chin-Chih Chen, I-Ping Chen
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Publication number: 20170355061Abstract: A polishing pad is provided. The polishing pad includes a polishing layer and a detection window. The detection window is disposed in the polishing layer. The modulus of the detection window is larger than the modulus of the polishing layer at 30° C., and the modulus of the detection window is smaller than the modulus of the polishing layer at 50° C.Type: ApplicationFiled: June 1, 2017Publication date: December 14, 2017Applicant: IV Technologies CO., Ltd.Inventors: Yi Jian, Wen-Chang Shih, Kun-Che Pai, Chin-Chih Chen
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Publication number: 20140193544Abstract: A biscuit structure contains a body formed in a circular column shape or a flatly elongated block shape, and a mixing ingredient of the body includes corns, rice, brown rice, egg yolk powders, sugars, salts, palm oil, soy flour (mixed from soybeans, wheat, salts and sugars), and maltodextrin. The body is molded and baked, and then a sticky ingredient is applied on the body, thereafter a crushed nut ingredient is sprayed on the sticky ingredient of the body. The sticky ingredient is chocolate sauce or maltose syrup, and the crushed nut ingredient is crushed almonds or crushed peanuts. Thereby, the body of the biscuit structure is crispy and has a rich flavor after eating the sticky ingredient and the crushed nut ingredient.Type: ApplicationFiled: December 4, 2013Publication date: July 10, 2014Inventor: Chin-Chih Chen
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Patent number: 7180227Abstract: An o-ring sealing device, molded with an imbedded piezoelectric element, for use in vacuum systems. The imbedded element, of a circumferential length, has an oblong cross-sectional shape, the oblong shape having a pair of ends for externally connecting to a signal processor. The piezoelectric element is concentrically disposed and centrally placed within a mold cavity of a predetermined diameter. The cavity is filled with an elastic material fully encapsulating and insulating the piezoelectric element.Type: GrantFiled: January 16, 2004Date of Patent: February 20, 2007Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Ming-Hung Tseng, Chin-Chih Chen, Tzu-Chan Wang, Wei-Shin Tien
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Patent number: 7117058Abstract: A system and method for automatic SPC chart generation including a storage device and a data acquisition module. The storage device stores a chamber management tree, a recipe window management tree, a parameter configuration table and multiple chart profile records. The data acquisition module, which resides in a memory, acquires multiple process events and parameter values corresponding to the process events and a process parameter, selects a relevant statistical algorithm, calculates a statistical value by applying the statistical algorithm to the parameter values, creates a new chart profile record and a parameter statistics record therein if the chart profile record is absent, and stores the statistical values and measured time in the parameter statistics record.Type: GrantFiled: June 24, 2004Date of Patent: October 3, 2006Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Mu-Tsang Lin, Tien-Wen Wang, Joseph W. L. Fang, Ie-Fun Lai, Chon-Hwa Chu, Jian-Hong Chen, Chin-Chih Chen, Yu-Yi Wu, Yao-Wen Wu, Wen-Sheng Chien
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Publication number: 20050288810Abstract: A system and method for automatic SPC chart generation including a storage device and a data acquisition module. The storage device stores a chamber management tree, a recipe window management tree, a parameter configuration table and multiple chart profile records. The data acquisition module, which resides in a memory, acquires multiple process events and parameter values corresponding to the process events and a process parameter, selects a relevant statistical algorithm, calculates a statistical value by applying the statistical algorithm to the parameter values, creates a new chart profile record and a parameter statistics record therein if the chart profile record is absent, and stores the statistical values and measured time in the parameter statistics record.Type: ApplicationFiled: June 24, 2004Publication date: December 29, 2005Inventors: Mu-Tsang Lin, Tien-Wen Wang, Joseph Fang, Ie-Fun Lai, Chon-Hwa Chu, Jian-Hong Chen, Chin-Chih Chen, Yu-Yi Wu, Yao-Wen Wu, Wen-Sheng Chien
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Publication number: 20050156487Abstract: An o-ring sealing device, molded with an imbedded piezoelectric element, for use in vacuum systems. The imbedded element, of a circumferential length, has an oblong cross-sectional shape, the oblong shape having a pair of ends for externally connecting to a signal processor. The piezoelectric element is concentrically disposed and centrally placed within a mold cavity of a predetermined diameter. The cavity is filled with an elastic material fully encapsulating and insulating the piezoelectric element.Type: ApplicationFiled: January 16, 2004Publication date: July 21, 2005Inventors: Ming-Hung Tseng, Chin-Chih Chen, Tzu-Chan Wang, Wei-Shin Tien
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Patent number: 6286613Abstract: A point-contact impact method used in the Standard Penetration Test (SPT) is disclosed. The method aims firstly to have the impact between the drop hammer and the anvil in the form of point contact and secondly to center the impact contact on the anvil face, such that the efficiency and the consistency of the energy transmission in the SPT greatly increase. With such a method, the ground condition of a specific site investigated by the SPT is able to be better determined. A device of the present method used in the Standard Penetration Test is a specially shaped anvil mounted on top of a rod, and the drop hammer is movably in contact with the anvil. The contact area of the anvil struck by the hammer is then limited and concentrated at the center. The impact between the hammer and the anvil is thus focused at or very near the center of the anvil, which reduces the energy loss during energy transfer from the hammer to the anvil.Type: GrantFiled: January 12, 2000Date of Patent: September 11, 2001Inventors: Jiin-Song Tsai, Chin-Chih Chen, Lee-Der Jou, Ke-Lon Chen