Abstract: A method for forming a chip package structure. The method includes bonding first connectors over a front surface of a semiconductor wafer. The method also includes dicing the semiconductor wafer from a rear surface of the semiconductor wafer to form semiconductor dies and mounting first and second semiconductor dies in the semiconductor dies over a top surface of the interposer substrate. The method further forming an encapsulating layer over the top surface of the interposer substrate to cover the first semiconductor die and the second semiconductor die. A first sidewall of the first semiconductor die faces a second sidewall of the second semiconductor die, and upper portions of the first sidewall and the second sidewall have a tapered contour, to define a top die-to-die distance and a bottom die-to-die distance that is less than the top die-to-die distance.

Abstract: A lighting system and a driving circuit thereof are provided. The driving circuit is configured to drive a light emitting device. The driving circuit includes a bulk voltage converter. The bulk voltage converter receives an input voltage and converts the input voltage to generate a driving voltage. The bulk voltage converter includes a snubber circuit, a power switch, and an inductor. The snubber circuit receives the input voltage through a first node and generates a snubber voltage at a second node according to the input voltage. The power switch is turned on or off according to a control signal. The inductor is coupled between the first node and a third node. The driving circuit is coupled to the light emitting device through the first node and the third node and provides the driving voltage to the light emitting device.

Abstract: A power supply apparatus for driving a light emitting apparatus is provided. The power supply apparatus includes a lossless snubber circuit and a power converting circuit. The lossless snubber circuit has a first diode, a first inductor and a second diode coupled in series between an input end and a first reference end, and has a first capacitor coupled between the first diode and a second reference end. The power converting circuit has a switch, a transformer and a second indictor. The switch is coupled between the first and second reference ends, and is turned on or off according to a control signal. The second inductor is coupled to a first side of the transformer in parallel.

Abstract: A lighting system and a driving circuit thereof are provided. The driving circuit is configured to drive a light emitting device. The driving circuit includes a bulk voltage converter. The bulk voltage converter receives an input voltage and converts the input voltage to generate a driving voltage. The bulk voltage converter includes a snubber circuit, a power switch, and an inductor. The snubber circuit receives the input voltage through a first node and generates a snubber voltage at a second node according to the input voltage. The power switch is turned on or off according to a control signal. The inductor is coupled between the first node and a third node. The driving circuit is coupled to the light emitting device through the first node and the third node and provides the driving voltage to the light emitting device.

Abstract: A power supply apparatus for driving a light emitting apparatus is provided. The power supply apparatus includes a lossless snubber circuit and a power converting circuit. The lossless snubber circuit has a first diode, a first inductor and a second diode coupled in series between an input end and a first reference end, and has a first capacitor coupled between the first diode and a second reference end. The power converting circuit has a switch, a transformer and a second indictor. The switch is coupled between the first and second reference ends, and is turned on or off according to a control signal. The second inductor is coupled to a first side of the transformer in parallel.