Patents by Inventor Chin-Chih Lai

Chin-Chih Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250070050
    Abstract: A package structure is provided. The package structure includes a redistribution structure on a substrate, a semiconductor die on the redistribution structure and electrically connected to the substrate, a wall structure on the redistribution structure and electrically isolated from the substrate. The semiconductor die includes a first sidewall, a second sidewall connected to the first sidewall, and a third sidewall connected to the second sidewall. The wall structure includes a first partition, a second partition and a third partition respectively immediately adjacent to the first sidewall, the second sidewall, and the third sidewall of the semiconductor die. The first partition is located immediately adjacent to and spaced apart from the second partition by a first distance, the second partition is located immediately adjacent to and spaced apart from the third partition by a second distance, and the first distance is substantially equal to the second distance.
    Type: Application
    Filed: November 8, 2024
    Publication date: February 27, 2025
    Inventors: Po-Chen LAI, Chin-Hua WANG, Ming-Chih YEW, Li-Ling LIAO, Tsung-Yen LEE, Po-Yao LIN, Shin-Puu JENG
  • Patent number: 12237276
    Abstract: A package structure is provided. The package structure includes a semiconductor die over a redistribution structure, bonding elements below the redistribution structure, and an underfill layer surrounding the bonding elements and the redistribution structure. The semiconductor die has a rectangular profile in a plan view. A pitch of the bonding elements is defined as the sum of a diameter of the bonding elements and a spacing between neighboring two of the bonding elements. A first circular area of the redistribution structure is entirely covered and in direct contact with the underfill layer. The center of the first circular area is aligned with a first corner of the rectangular profile of the semiconductor die. A diameter of the first circular area is greater than twice the pitch of the bonding elements.
    Type: Grant
    Filed: June 16, 2023
    Date of Patent: February 25, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Po-Chen Lai, Chin-Hua Wang, Ming-Chih Yew, Che-Chia Yang, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng
  • Patent number: 10674584
    Abstract: A lighting system and a driving circuit thereof are provided. The driving circuit is configured to drive a light emitting device. The driving circuit includes a bulk voltage converter. The bulk voltage converter receives an input voltage and converts the input voltage to generate a driving voltage. The bulk voltage converter includes a snubber circuit, a power switch, and an inductor. The snubber circuit receives the input voltage through a first node and generates a snubber voltage at a second node according to the input voltage. The power switch is turned on or off according to a control signal. The inductor is coupled between the first node and a third node. The driving circuit is coupled to the light emitting device through the first node and the third node and provides the driving voltage to the light emitting device.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: June 2, 2020
    Assignee: I-SHOU UNIVERSITY
    Inventors: Chun-An Cheng, Chin-Chih Lai, Yi-Ling Chen, Pei-Jung Hsieh
  • Patent number: 10608527
    Abstract: A power supply apparatus for driving a light emitting apparatus is provided. The power supply apparatus includes a lossless snubber circuit and a power converting circuit. The lossless snubber circuit has a first diode, a first inductor and a second diode coupled in series between an input end and a first reference end, and has a first capacitor coupled between the first diode and a second reference end. The power converting circuit has a switch, a transformer and a second indictor. The switch is coupled between the first and second reference ends, and is turned on or off according to a control signal. The second inductor is coupled to a first side of the transformer in parallel.
    Type: Grant
    Filed: June 1, 2018
    Date of Patent: March 31, 2020
    Assignee: I-SHOU UNIVERSITY
    Inventors: Chun-An Cheng, Er-Yun Chang, Chin-Chih Lai, Man-Tang Chang
  • Publication number: 20190380179
    Abstract: A lighting system and a driving circuit thereof are provided. The driving circuit is configured to drive a light emitting device. The driving circuit includes a bulk voltage converter. The bulk voltage converter receives an input voltage and converts the input voltage to generate a driving voltage. The bulk voltage converter includes a snubber circuit, a power switch, and an inductor. The snubber circuit receives the input voltage through a first node and generates a snubber voltage at a second node according to the input voltage. The power switch is turned on or off according to a control signal. The inductor is coupled between the first node and a third node. The driving circuit is coupled to the light emitting device through the first node and the third node and provides the driving voltage to the light emitting device.
    Type: Application
    Filed: September 28, 2018
    Publication date: December 12, 2019
    Applicant: I-SHOU UNIVERSITY
    Inventors: Chun-An Cheng, Chin-Chih Lai, Yi-Ling Chen, Pei-Jung Hsieh
  • Publication number: 20190372455
    Abstract: A power supply apparatus for driving a light emitting apparatus is provided. The power supply apparatus includes a lossless snubber circuit and a power converting circuit. The lossless snubber circuit has a first diode, a first inductor and a second diode coupled in series between an input end and a first reference end, and has a first capacitor coupled between the first diode and a second reference end. The power converting circuit has a switch, a transformer and a second indictor. The switch is coupled between the first and second reference ends, and is turned on or off according to a control signal. The second inductor is coupled to a first side of the transformer in parallel.
    Type: Application
    Filed: June 1, 2018
    Publication date: December 5, 2019
    Applicant: I-SHOU UNIVERSITY
    Inventors: Chun-An Cheng, Er-Yun Chang, Chin-Chih Lai, Man-Tang Chang