Patents by Inventor Chin Chih Li

Chin Chih Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10669392
    Abstract: A method of preparing aerogels/nonwoven composites fireproof and heat-insulating materials with a hydrophobic or hydrophilic surfaces and includes steps as follows. A mixture solution in which alkoxysilane, silicones and silane coupling agents are mixed and stirred is instilled by acidic catalysts for a hydrolysis reaction during which a silane coupling agent solution is added for continuous stirring; a hydrous alkali catalytic (anhydrous alkali catalytic) organic solution is added in the mixture solution for a condensation reaction and development of a “silicones-silica aerogels-silane coupling agents” aerogel mixture solution; a non-woven felt is impregnated with the mixture solution for development of soft hydrophobic (hydrophilic) aerogels/nonwoven composites fireproof and heat-insulating materials after curing and natural drying.
    Type: Grant
    Filed: January 17, 2018
    Date of Patent: June 2, 2020
    Assignee: KUN SHAN UNIVERSITY
    Inventors: Jean-Hong Chen, Shiu-Shiu Chen, Chih-Shun Chang, Chin-Chih Li
  • Publication number: 20190055374
    Abstract: A method of preparing aerogels/nonwoven composites fireproof and heat-insulating materials with a hydrophobic or hydrophilic surfaces and includes steps as follows. A mixture solution in which alkoxysilane, silicones and silane coupling agents are mixed and stirred is instilled by acidic catalysts for a hydrolysis reaction during which a silane coupling agent solution is added for continuous stirring; a hydrous alkali catalytic (anhydrous alkali catalytic) organic solution is added in the mixture solution for a condensation reaction and development of a “silicones-silica aerogels-silane coupling agents” aerogel mixture solution; a non-woven felt is impregnated with the mixture solution for development of soft hydrophobic (hydrophilic) aerogels/nonwoven composites fireproof and heat-insulating materials after curing and natural drying.
    Type: Application
    Filed: January 17, 2018
    Publication date: February 21, 2019
    Inventors: Jean-Hong Chen, Shiu-Shiu Chen, Chih-Shun Chang, Chin-Chih Li
  • Patent number: 7367824
    Abstract: A memory card ejection mechanism for use in a memory card connector and controllable to eject the inserted memory card is disclosed, in which the hook of the memory card ejection mechanism has a curved spring arm for engaging a retaining notch of the inserted memory card to hold the inserted memory card in place, and a positioning tip pressed against a wall inside a mounting groove of the slide of the memory card ejection mechanism for producing a reaction force against impact of the memory card to prohibit the memory card from jumping away as it is ejected out of the memory card connector.
    Type: Grant
    Filed: July 18, 2007
    Date of Patent: May 6, 2008
    Assignee: Chant Sincere Co., Ltd.
    Inventors: Ming Hui Yen, Chin Chih Li, Chun Ming Lai
  • Publication number: 20020118528
    Abstract: The invention provides a substrate layout method and structure of a ball grid array to reduce cross talk of adjacent signals. The substrate comprises a plurality of signal pads formed on a die, a ring around the die, and a plurality of signal fingers around the ring. The substrate layout method for reducing cross talk of adjacent signals is as follows: First, forming a guard pad between two adjacent signal pads. Second, forming a guard finger between two adjacent signal fingers. Next, forming a bonding wire to connect the guard pad to the ring. Then, forming another bonding wire to connect the ring to the guard finger. Subsequently, forming a guard trace to connect the guard finger to a via at the edge of the substrate, and connecting the guard trace to a short-circuiting place through the via.
    Type: Application
    Filed: March 19, 2001
    Publication date: August 29, 2002
    Inventors: Bor-Ray Su, Chin-Chih Li
  • Publication number: 20020074162
    Abstract: The invention provides a substrate layout method and structure of a ball grid array to reduce cross talk of adjacent signals. The substrate comprises a plurality of signal pads formed on a die, a ring around the die, and a plurality of signal fingers around the ring. The substrate layout method for reducing cross talk of adjacent signals is as follows: First, forming a guard pad between two adjacent signal pads. Second, forming a guard finger between two adjacent signal fingers. Next, forming a bonding wire to connect the guard pad to the ring. Then, forming another bonding wire to connect the ring to the guard finger. Subsequently, forming a guard trace to connect the guard finger to a via at the edge of the substrate, and connecting the guard trace to a short-circuiting place through the via.
    Type: Application
    Filed: June 20, 2001
    Publication date: June 20, 2002
    Inventors: Bor-Ray Su, Chin-Chih Li