Abstract: A method of manufacturing a semiconductor device includes forming a photoresist layer including a photoresist composition over a substrate. The photoresist layer is selectively exposed to actinic radiation, the selectively exposed photoresist layer is developed to form a pattern in the photoresist layer. The photoresist composition includes a polymer including monomer units with photocleaving promoters, wherein the photocleaving promoters are one or more selected from the group consisting of living free radical polymerization chain transfer agents, electron withdrawing groups, bulky two dimensional (2-D) or three dimensional (3-D) organic groups, N-(acyloxy)phthalimides, and electron stimulated radical generators.

Abstract: A method of manufacturing a semiconductor device includes forming a first layer having an organic material over a substrate. A second layer is formed over the first layer, wherein the second layer includes a silicon-containing polymer having pendant acid groups or pendant photoacid generator groups. The forming a second layer includes: forming a layer of a composition including a silicon-based polymer and a material containing an acid group or photoacid generator group over the first layer, floating the material containing an acid group or photoacid generator group over the silicon-based polymer, and reacting the material containing an acid group or photoacid generator group with the silicon-based polymer to form an upper second layer including a silicon-based polymer having pendant acid groups or pendant photoacid generator groups overlying a lower second layer comprising the silicon-based polymer. A photosensitive layer is formed over the second layer, and the photosensitive layer is patterned.

Abstract: A method of forming a patterned photoresist layer includes the following operations: (i) forming a patterned photoresist on a substrate; (ii) forming a molding layer covering the patterned photoresist; (iii) reflowing the patterned photoresist in the molding layer; and (iv) removing the molding layer from the reflowed patterned photoresist. In some embodiments, the molding layer has a glass transition temperature that is greater than or equal to the glass transition temperature of the patterned photoresist. In yet some embodiments, the molding layer has a glass transition temperature that is 3° C.-30° C. less than the glass transition temperature of the patterned photoresist.

Abstract: A method for forming a chip package structure. The method includes bonding first connectors over a front surface of a semiconductor wafer. The method also includes dicing the semiconductor wafer from a rear surface of the semiconductor wafer to form semiconductor dies and mounting first and second semiconductor dies in the semiconductor dies over a top surface of the interposer substrate. The method further forming an encapsulating layer over the top surface of the interposer substrate to cover the first semiconductor die and the second semiconductor die. A first sidewall of the first semiconductor die faces a second sidewall of the second semiconductor die, and upper portions of the first sidewall and the second sidewall have a tapered contour, to define a top die-to-die distance and a bottom die-to-die distance that is less than the top die-to-die distance.

Abstract: A method of orthopedic treatment includes steps of: by using a computer aided design (CAD) tool based on profile data that is related to a to-be-treated part of a bone of a patient, obtaining a model of a preliminary instrument that substantially fits the to-be-treated part; by using the CAD tool, obtaining a model of a patient specific instrument (PSI) based on the model of the preliminary instrument; producing the PSI based on the model of the PSI, the PSI being adjustable; performing medical operation on the to-be-treated part, and then attaching the PSI to the to-be-treated part; after attaching the PSI to the to-be-treated part, adjusting the PSI such that the PSI is adapted to real conditions of the to-be-treated part.

Abstract: Touch sensitive input devices and routing trace configurations designed to reduce border dimensions of such devices are provided herein. The touch sensitive input devices include a touch panel having a plurality of transmit lines and a plurality of receive lines, which are arranged with the plurality of transmit lines in a grid pattern, such that a sense node is disposed on the touch panel at each intersection of the transmit and receive lines. More specifically, the touch panel includes a first subset of the transmit lines coupled to routing traces on only a first side of the touch panel, a second subset of the transmit lines coupled to routing traces on only a second side of the touch panel, and a third subset of the transmit lines coupled to routing traces on both the first side and the second side of the touch panel. Methods are provided herein for compensating for differences in routing trace path lengths, so as to provide accurate detection of touch event locations on the touch panel.

Abstract: The present invention provides a package structure. The package structure includes a substrate, an electronic component layer, an organic polymer layer and a protective layer. The electronic component layer is disposed on the substrate, the organic polymer layer is disposed on the electronic component layer, and the protective layer is disposed on the organic polymer layer. Therefore, compared with the conventional package structure, the present invention omits the fabrication of at least one passivation layer having an inorganic material, and at the same time simplifies the fabrication process and the layers of the package structure, thereby reducing the cost and increasing the productivity.

Abstract: A flexible substrate structure includes a flexible substrate, a first patterned metal layer and a second patterned metal layer. The flexible substrate has a first surface and a second surface which is opposite the first surface. The first patterned metal layer is disposed on the first surface of the flexible substrate. The second patterned metal layer is disposed on the second surface of the flexible substrate. The flexible substrate has at least one through hole. A manufacturing method of the flexible substrate structure includes: providing a flexible substrate having a first surface and a second surface which is opposite the first surface; forming a first patterned metal layer on the first surface of the flexible substrate, and forming a second patterned metal layer on the second surface of the flexible substrate; and performing a through hole process for forming at least one through hole in the flexible substrate.

Abstract: Touch sensitive input devices and routing trace configurations designed to reduce border dimensions of such devices are provided herein. The touch sensitive input devices include a touch panel having a plurality of transmit lines and a plurality of receive lines, which are arranged with the plurality of transmit lines in a grid pattern, such that a sense node is disposed on the touch panel at each intersection of the transmit and receive lines. More specifically, the touch panel includes a first subset of the transmit lines coupled to routing traces on only a first side of the touch panel, a second subset of the transmit lines coupled to routing traces on only a second side of the touch panel, and a third subset of the transmit lines coupled to routing traces on both the first side and the second side of the touch panel. Methods are provided herein for compensating for differences in routing trace path lengths, so as to provide accurate detection of touch event locations on the touch panel.

Abstract: A portable information handling system keyboard rests on a support surface of a housing with securing actions taken from above the housing, such as by screws that insert through the keyboard and then into the housing. A lattice cover having key openings fits over the keyboard to align adapters of its bottom surface with posts extending from the support surface through openings formed in the keyboard. The adapters snap to the posts to couple the cover against the keyboard so that the cover bottom surface presses the keyboard against the information handling systems upper support surface.

Abstract: A portable information handling system keyboard rests on a support surface of a housing with securing actions taken from above the housing, such as by screws that insert through the keyboard and then into the housing. A lattice cover having key openings fits over the keyboard to align adapters of its bottom surface with posts extending from the support surface through openings formed in the keyboard. The adapters snap to the posts to couple the cover against the keyboard so that the cover bottom surface presses the keyboard against the information handling systems upper support surface.

Abstract: The present disclosure provides a method for measuring an offset of a sub-pixel in an OLED manufacturing process, including: depositing OLED material onto a display unit in a substrate through a hollow portion of a mask, the display unit including an effective region and a peripheral measuring region at periphery of the effective region, the OLED material forming a plurality of effective sub-pixels within the effective region and forming a plurality of dummy sub-pixels within the peripheral measuring region; and using UV light to excite at least a portion of the dummy sub-pixels of the OLED material to emit light, and measuring the offset of the dummy sub-pixel with respect to a predetermined position of a corresponding light emitting unit located on the substrate.

Abstract: This invention provides a metering method of automatic exposure for determining an exposure value of a picture having a subject, including a subject detecting step that uses focus values of the picture to detect the subject, and an exposure value calculating step that uses an auto exposure metering function to calculate an exposure value of the picture. The present invention can provide a simpler and smaller metering method.

Abstract: A zoom tracking method for digital camera is disclosed. The method comprises storing a position table comprising data of several zoom position curves respect to positions of a focus lens and move the focus lens position by looking up said position table while moving a zoom lens position. The curves are divided into a first linear region, a second linear region and a nonlinear region to reduce the table size while still achieving good image quality.

Abstract: An auto focus method of a digital camera for moving a lens of the digital camera to the maximum focus value position is provided. According to certain criteria, the lens movement states are categorized into four states, i.e. an initial state, a coarse state, a mid state and a fine state. The numbers of search steps for the lens in different states are different.

Abstract: A zoom tracking method for digital camera is disclosed. The method comprises storing a position table comprising data of several zoom position curves respect to positions of a focus lens and move the focus lens position by looking up said position table while moving a zoom lens position. The curves are divided into a first linear region, a second linear region and a nonlinear region to reduce the table size while still achieving good image quality.

Abstract: This invention provides a metering method of automatic exposure for determining an exposure value of a picture having a subject, comprising a subject detecting step comprising using focus values of the picture to detect the subject, and an exposure value calculating step comprising using an auto exposure metering function to calculate an exposure value of the picture. The present invention can provide a simpler and smaller metering method.

Abstract: An auto focus method of a digital camera for moving a lens of the digital camera to the maximum focus value position is provided. According to certain criteria, the lens movement states are categorized into four states, i.e. an initial state, a coarse state, a mid state and a fine state. The numbers of search steps for the lens in different states are different.

Abstract: A suspension arm comprising a rising/descending device further consists of an inner sleeve; a retractable shaft and an elastic body inside, an outer sleeve connect to the inner sleeve, a clip ring on the top open of the outer sleeve.

Abstract: A pivotal shaft assembly for a plane display includes a bottom plate, a fixing member, a rotational member and a spherical nest device. The fixing member is mounted at the front side of the bottom plate and composed of a support base and a joint seat with the joint seat at a center thereof having a through shaft groove. The rotational member is a U shaped frame, extending downward along two lateral sides thereof a wing plate respectively with the wing plate beside an inner side thereof being a packing ring and a space in between fitting with the joining seat and an axial bolt passing over a securing hole of the two wing plates and the shaft groove with an end of the axial bolt being engaged to one of the wing plates and another end of the axial bolt being engaged to a threaded fastener to commonly enclose and press against two lateral sides of the joining seat.