Abstract: An integrated circuit package and a method of forming the same are provided. The method includes attaching an integrated circuit die to a first substrate. A dummy die is formed. The dummy die is attached to the first substrate adjacent the integrated circuit die. An encapsulant is formed over the first substrate and surrounding the dummy die and the integrated circuit die. The encapsulant, the dummy die and the integrated circuit die are planarized, a topmost surface of the encapsulant being substantially level with a topmost surface of the dummy die and a topmost surface of the integrated circuit die. An interior portion of the dummy die is removed. A remaining portion of the dummy die forms an annular structure.

Abstract: The present invention relates to a pogo pin cooling system and a pogo pin cooling method and an electronic device testing apparatus having the system. The system mainly comprises a coolant circulation module, which includes a coolant supply channel communicated with an inlet of a chip socket and a coolant recovery channel communicated with an outlet of the chip socket. When an electronic device is accommodated in the chip socket, the coolant circulation module supplies a coolant into the chip socket through the coolant supply channel and the inlet, and the coolant passes through the pogo pins and then flows into the coolant recovery channel through the outlet.

Abstract: An inspection system with a thermal interface, and an electronic component inspection device and method are provided. First, a temperature regulator contacts an electronic component to be tested, where there is a thermal interface between the temperature regulator and the electronic component to be tested, and the electronic component to be tested includes a plurality of temperature sensing units. Then, the temperature regulator heats or cools the electronic component to be tested to a specific temperature, and the plurality of temperature sensing units of the electronic component to be tested detect temperatures at locations of the temperature sensing units. In this way, a contact condition between the temperature regulator and the electronic component to be tested, and quality or an aging status of the thermal interface can be determined.

Abstract: The diaphragm valve uses a metal dish-type diaphragm set to control the inflow and outflow of fluid. The metal dish-type diaphragm set is above an air flow channel to control the stem above the metal dish-type diaphragm set, and the air will be blocked by pressing the metal dish-type diaphragm to make it fit the metal valve base in the air flow channel; this non-metal valve base is fixed in the air flow channel by a fixed shrunk ring with a taper cross section, and the in-between metal diaphragm in the metal dish-type diaphragm set is annular in the center to reduce the metallic friction between metal diaphragms, to increase application times and to lower the leakage rate of the diaphragm valve.

Abstract: An electropolishing device having: an electrode device, which includes a positive electrode guide, a negative electrode guide, a positive electrode plate, a negative electrode plate and a negative working electrode; a clamping apparatus, which includes at least an insulated screw, an upper insulated piece and a lower insulated piece; and an insulated structure, which includes an upper insulated cover and a lower insulated cover.

Abstract: The diaphragm valve uses a metal dish-type diaphragm set to control the inflow and outflow of fluid. The metal dish-type diaphragm set is above an air flow channel to control the stem above the metal dish-type diaphragm set, and the air will be blocked by pressing the metal dish-type diaphragm to make it fit the metal valve base in the air flow channel; this non-metal valve base is fixed in the air flow channel by a fixed shrunk ring with a taper cross section, and the in-between metal diaphragm in the metal dish-type diaphragm set is annular in the center to reduce the metallic friction between metal diaphragms, to increase application times and to lower the leakage rate of the diaphragm valve.

Abstract: The present invention is an electropolishing process and device for electropolishing an inner surface of a long tube, especially applied to a long tube of greater than two meters and a diameter range between 0.3 and 5 cm. Wherein, the present invention comprises at least one tube, and one complex electrode. An inner surface of the tube is for electropolishing process, and it is an anode as well. The electrode is a cathode and placed on a center of a partition. An end of electrode connects to a cable, the cable is driven by an axial mechanism to be moved the electrode toward the axial mechanism itself. Inside of the tube is full o electrolyte, which is an electrifying medium to connect both anode and cathode. Further, electrolyte cooperates with the electrode to perform the electropolishing process on the inner surface of tube.

Abstract: The present invention is an electropolishing process means for inner and outer surfaces of a metal, especially applied to a metal that inner and outer surfaces both needing high clean and passivation. The present invention comprises: an electrode device, which includes a positive electrode guide, a negative electrode guide, a positive electrode plate, a negative electrode plate and a negative working electrode; a clamping apparatus, which includes at least an insulated screw, an upper insulated piece and a lower insulated piece; an insulated structure, which includes an upper insulated cover and a lower insulated cover.

Abstract: The present invention is an electropolishing process means for an inner surface of a long tube, especially applied to a long tube of greater than two meters and a diameter range between 0.3 to 5 cm. Wherein, the present invention comprises at least one tube, one complex electrode; an inner surface of the tube is for electropolishing process, and it is an anode as well; the electrode is a cathode and placed on a center of a partition; an end of electrode connects to a cable, the cable is driven by an axial mechanism to be moved toward the axial mechanism itself; inside tube are full of electrolyte, which is an electrifying medium to connect both anode and cathode, further, electrolyte cooperates with electrode to move for electropolishing process the inner surface of tube.

Abstract: A non-contact pick-up device is disclosed. The non-contact pick-up device mainly includes a disk, and a plurality of air nozzles on the disk. Each nozzle has an air channel; and an upper end of the channel is tilt outwards. Therefore, as a disc-shaped article is placed on the disk; air jets out from the nozzles, due to Bernoulli principle, pressure difference is formed on the disc-shaped article. Thus, due to the action of atmosphere pressure, the disc-shaped article will be clamped. The pick-up device may be used in semiconductor manufacturing process for clamping a wafer.

Abstract: A multiple station CD-ROM testing system includes a conveyance device, a first gripping device, a multiple station testing device having a number of testing stations arranged in a vertically stacked fashion, a second gripping device, a collection device, and a controlling device comprised of a single programmable logic control and a single personal computer. The conveyance device carries the CD-ROMs fed into the system forward. The first gripping device picks up the CD-ROMs on the conveyance device and positions the CD-ROMs into the testing stations of the multiple station testing device to have the CD-ROMs tested therein by means of the controlling device and removes the tested CD-ROMs out of the multiple station testing device and places them back to the conveyance device. The second gripping device picks up the tested CD-ROMs on the conveyance device and transfers the tested CD-ROMs to either a next process if the CD-ROMs pass the test or a flaw product collection device if the CD-ROMs fail the test.

Abstract: This invention discloses new compounds of the formula ##STR1## wherein X is selected from the group consisting of halogen and alkylsulfonyl; R.sup.1 is selected from the group consisting of alkyl, alkenyl, haloalkyl and alkynyl; and R.sup.2 is selected from the group consisting of alkyl, alkenyl, haloalkyl, alkynyl, alkoxyalkyl, cycloalkyl and ##STR2## WHEREIN P IS AN INTEGER FROM 0 TO 2; Y is selected from the group consisting of alkyl, alkenyl, halogen, haloalkyl, alkoxy, alkylthio, nitro and cyano; and m is an integer from 0 to 3.

Abstract: This invention discloses new compounds of the formula ##STR1## wherein X is halogen; and R.sup.1 is selected from the group consisting of alkyl, alkenyl, haloalkyl and ##STR2## wherein R.sup.2 and R.sup.3 are each selected from the group consisting of hydrogen and alkyl.

Abstract: This invention discloses new compounds of the formula ##STR1## WHEREIN X is selected from the group consisting of halogen and alkylsulfonyl; R.sup.1 is selected from the group consisting of alkyl, alkenyl, haloalkyl and alkynyl; m is an integer from 0 to 3; Y is selected from the group consisting of oxygen and sulfur; R.sup.2 is selected from the group consisting of alkyl and halogen; and n is an integer from 0 to 2.

Abstract: This invention discloses new compounds of the formula ##STR1## WHEREIN X is selected from the group consisting of alkyl, haloalkyl, alkoxy and halogen,; n is an integer from 0 to 2; R.sup.1 is selected from the group consisting of alkyl, alkenyl, haloalkyl and ##STR2## wherein R.sup.3 and R.sup.4 are each selected from the group consisting of hydrogen and alkyl; p is an integer from 0 to 3; Y is oxygen or sulfur; R.sup.2 is selected from the group consisting of alkyl and halogen; and q is an integer from 0 to 2. Further disclosed is the herbicidal utility of the foregoing compounds.

Abstract: This invention discloses new compounds of the formula ##STR1## WHEREIN X is selected from the group consisting of halogen and alkylsulfonyl; R.sup.1 is selected from the group consisting of alkyl, alkenyl, haloalkyl and alkynyl; m is an integer from 1 to 3; Y is selected from the group consisting of oxygen and sulfur; Z is selected from the group consisting of alkyl, alkenyl, halogen, haloalkyl, alkoxy, alkylthio, nitro and cyano; and n is an integer from 0 to 3.

Abstract: This invention discloses new compounds of the formula ##STR1## wherein X is selected from the group consisting of alkyl, halogen, haloalkyl and alkoxy; n is an integer from 0 to 2; R.sup.1 is selected from the group consisting of alkyl, alkenyl, haloalkyl and alkynyl; and R.sup.2 is selected from the group consisting of alkyl, alkenyl, haloalkyl, alkynyl, alkoxyalkyl, cycloalkyl and ##STR2## WHEREIN P IS AN INTEGER FROM 0 TO 2; Y is selected from the group consisting of alkyl, alkenyl, halogen, haloalkyl, alkoxy, alkylthio, nitro and cyano; and m is an integer from 0 to 3.

Abstract: This invention discloses new compounds of the formula ##STR1## wherein X is selected from the group consisting of alkyl, halogen, haloalkyl and alkoxy; n is an integer from 0 to 2; R.sup.1 is selected from the group consisting of alkyl, alkenyl, haloalkyl and ##STR2## wherein R.sup.4 and R.sup.5 are each selected from the group consisting of hydrogen and alkyl; and R.sup.2 and R.sup.3 are each selected from the group consisting of hydrogen, alkyl, alkenyl, haloalkyl, hydroxyalkyl, alkoxyalkyl, cycloalkyl and ##STR3## WHEREIN P IS THE INTEGER 0 OR 1; Y is selected from the group consisting of alkyl, alkoxy, alkylthio, halogen, haloalkyl, nitro and cyano; and m is an integer from 0 to 3.

Abstract: This invention discloses new compounds of the formula ##STR1## WHEREIN X is selected from the group consisting of halogen and alkylsulfonyl; R.sup.1 is selected from the group consisting of alkyl, alkenyl, haloalkyl and alkynyl; Z is selected from the group consisting of alkyl and halogen; and n is an integer from 0 to 2.

Abstract: This invention discloses new compounds of the formula ##STR1## WHEREIN Z is selected from the group consisting of alkyl, halogen, haloalkyl and alkoxy; p is an integer from 0 to 2; R.sup.1 is selected from the group consisting of alkyl, alkenyl, haloalkyl and ##STR2## wherein R.sup.2 and R.sup.3 are each selected from the group consisting of hydrogen and alkyl; X is selected from the group consisting of alkyl and halogen; and n is an integer from 0 to 4. Further disclosed is the herbicidal utility of the foregoing compounds.