Patents by Inventor Chin Chong Yew

Chin Chong Yew has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lapping carrier
    Patent number: 9352442
    Abstract: Implementations disclosed herein allow a printed circuit board (PCB) to be removeably secured to a lapping carrier. The lapping carrier may include a clamping mechanism and one or more alignment pins that thread through corresponding holes in the PCB. In other implementations, the lapping carrier includes insulation that prevents current leakage or short-circuiting of electrical paths on the PCB during contact with the clamping mechanism.
    Type: Grant
    Filed: July 2, 2013
    Date of Patent: May 31, 2016
    Assignee: SEAGATE TECHNOLOGY LLC
    Inventors: Kim Sek Tan, Choong Kit Mah, Soo Chun Loh, Choon Yen Lim, Chin Chong Yew, Leping Li, Yuik Zhi Lim
  • LAPPING CARRIER
    Publication number: 20150007430
    Abstract: Implementations disclosed herein allow a printed circuit board (PCB) to be removeably secured to a lapping carrier. The lapping carrier may include a clamping mechanism and one or more alignment pins that thread through corresponding holes in the PCB. In other implementations, the lapping carrier includes insulation that prevents current leakage or short-circuiting of electrical paths on the PCB during contact with the clamping mechanism.
    Type: Application
    Filed: July 2, 2013
    Publication date: January 8, 2015
    Applicant: Seagate Technology LLC
    Inventors: Kim Sek Tan, Choong Kit Mah, Soo Chun Loh, Choon Yen Lim, Chin Chong Yew, Leping Li, Yuik Zhi Lim