Patents by Inventor Chin-Chun CHENG

Chin-Chun CHENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11983475
    Abstract: A semiconductor device includes: M*1st conductors in a first layer of metallization (M*1st layer) and being aligned correspondingly along different corresponding ones of alpha tracks and representing corresponding inputs of a cell region in the semiconductor device; and M*2nd conductors in a second layer of metallization (M*2nd layer) aligned correspondingly along beta tracks, and the M*2nd conductors including at least one power grid (PG) segment and one or more of an output pin or a routing segment; and each of first and second ones of the input pins having a length sufficient to accommodate at most two access points; each of the access points of the first and second input pins being aligned to a corresponding different one of first to fourth beta tracks; and the PG segment being aligned with one of the first to fourth beta tracks.
    Type: Grant
    Filed: February 7, 2023
    Date of Patent: May 14, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Pin-Dai Sue, Po-Hsiang Huang, Fong-Yuan Chang, Chi-Yu Lu, Sheng-Hsiung Chen, Chin-Chou Liu, Lee-Chung Lu, Yen-Hung Lin, Li-Chun Tien, Yi-Kan Cheng
  • Patent number: 11978720
    Abstract: A method includes attaching a die to a thermal compression bonding (TCB) head through vacuum suction, wherein the die comprises a plurality of conductive pillars, attaching a first substrate to a chuck through vacuum suction, wherein the first substrate comprises a plurality of solder bumps, contacting a first conductive pillar of the plurality of conductive pillars to a first solder bump of the plurality of solder bumps, wherein contacting the first conductive pillar to the first solder bump results in a first height between a topmost surface of the first conductive pillar and a bottommost surface of the first solder bump, and adhering the first solder bump to the first conductive pillar to form a first joint, wherein adhering the first solder bump to the first conductive pillar comprises heating the TCB head.
    Type: Grant
    Filed: June 15, 2021
    Date of Patent: May 7, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Kai Jun Zhan, Chin-Fu Kao, Kuang-Chun Lee, Ming-Da Cheng, Chen-Shien Chen
  • Patent number: 11941298
    Abstract: A host system initiates an abort of a command that has been placed into a submission queue (SQ) of the host system. The host system identifies at least one of a first outcome and a second outcome. When the first outcome indicates that the command is not completed and the second outcome indicates that the SQ entry has been fetched from the SQ, the host system sends an abort request to a storage device, and issues a cleanup request to direct the host controller to reclaim host hardware resources allocated to the command. The host system adds a completion queue (CQ) entry to a CQ and sets an overall command status (OCS) value of the CQ entry based on at least one of the first outcome and the second outcome.
    Type: Grant
    Filed: April 19, 2022
    Date of Patent: March 26, 2024
    Assignee: MediaTek Inc.
    Inventors: Chih-Chieh Chou, Chia-Chun Wang, Liang-Yen Wang, Chin Chin Cheng, Szu-Chi Liu
  • Patent number: 11936418
    Abstract: A radar signal processing system with a self-interference cancelling function includes an analog front end (AFE) processor, an analog to digital converter (ADC), an adaptive interference canceller (AIC), and a digital to analog converter (DAC). The AFE processor receives an original input signal and generates an analog input signal. The ADC converts the analog input signal to a digital input signal. The AIC generates a digital interference signal digital interference signal by performing an adaptive interference cancellation process according to the digital input signal. The DAC converts the digital interference signal to an analog interference signal. Finally, the analog interference signal is fed back to the AFE and cancelled from the original input signal in the AFE processor while performing the front end process, reducing the interference of the static interference from the leaking of a close-by transmitter during the front end process.
    Type: Grant
    Filed: April 27, 2021
    Date of Patent: March 19, 2024
    Assignee: KAIKUTEK INC.
    Inventors: Mike Chun-Hung Wang, Chun-Hsuan Kuo, Mohammad Athar Khalil, Wen-Sheng Cheng, Chen-Lun Lin, Chin-Wei Kuo, Ming Wei Kung, Khoi Duc Le
  • Patent number: 11931187
    Abstract: A method for predicting clinical severity of a neurological disorder includes steps of: a) identifying, according to a magnetic resonance imaging (MRI) image of a brain, brain image regions each of which contains a respective portion of diffusion index values of a diffusion index, which results from image processing performed on the MRI image; b) for one of the brain image regions, calculating a characteristic parameter based on the respective portion of the diffusion index values; and c) calculating a severity score that represents the clinical severity of the neurological disorder of the brain based on the characteristic parameter of the one of the brain image regions via a prediction model associated with the neurological disorder.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: March 19, 2024
    Assignees: Chang Gung Medical Foundation Chang Gung Memorial Hospital at Keelung, Chang Gung Memorial Hospital, Linkou, Chang Gung University
    Inventors: Jiun-Jie Wang, Yi-Hsin Weng, Shu-Hang Ng, Jur-Shan Cheng, Yi-Ming Wu, Yao-Liang Chen, Wey-Yil Lin, Chin-Song Lu, Wen-Chuin Hsu, Chia-Ling Chen, Yi-Chun Chen, Sung-Han Lin, Chih-Chien Tsai
  • Patent number: 9724856
    Abstract: A molding machine, which is operable to mold plastic granules into a plastic piece, includes a machine body, a platform, a heater, and a pressing unit. The platform is installed at the machine body and defines a molding cavity to receive the plastic granules. The heater is installed at the machine body adjacent to the platform. The pressing unit is installed at the machine body and disposed above the platform. The pressing unit includes a pressure cylinder, a telescopic rod driven by the pressure cylinder to extend downward and retract upward, and a pressing plate coupled to the telescopic rod and disposed to correspond in position with the molding cavity, and driven by the pressure cylinder to move relative to the platform.
    Type: Grant
    Filed: April 29, 2014
    Date of Patent: August 8, 2017
    Assignee: Taiwan Green Point Enterprises Co., Ltd.
    Inventors: Chin-Chun Cheng, Shun-Tien Hung
  • Publication number: 20150151466
    Abstract: A molding machine, which is operable to mold plastic granules into a plastic piece, includes a machine body, a platform, a heater, and a pressing unit. The platform is installed at the machine body and defines a molding cavity to receive the plastic granules. The heater is installed at the machine body adjacent to the platform. The pressing unit is installed at the machine body and disposed above the platform. The pressing unit includes a pressure cylinder, a telescopic rod driven by the pressure cylinder to extend downward and retract upward, and a pressing plate coupled to the telescopic rod and disposed to correspond in position with the molding cavity, and driven by the pressure cylinder to move relative to the platform.
    Type: Application
    Filed: April 29, 2014
    Publication date: June 4, 2015
    Applicant: TAIWAN GREEN POINT ENTERPRISES CO., LTD.
    Inventors: Chin-Chun CHENG, Shun-Tien HUNG