Patents by Inventor Chin-Chun Wang
Chin-Chun Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11960191Abstract: A conductive structure is applied to an e-paper device, which includes a driving substrate and an e-paper film. The e-paper film is disposed on the driving substrate, and includes a transparent substrate, a common electrode layer, and a display medium layer disposed between the common electrode layer and the driving substrate. The common electrode layer is disposed on one side of the transparent substrate facing the driving substrate. The display medium layer includes a through hole. The conductive structure is disposed in the through hole and includes a conductive member and at least one spacer. The conductive member is electrically connected to the driving substrate and the common electrode layer. The spacer is disposed in/on the conductive member, and contacts with the driving substrate and the common electrode layer. An e-paper device with the conductive structure is also disclosed.Type: GrantFiled: July 9, 2021Date of Patent: April 16, 2024Assignee: SES-IMAGOTAG SAInventors: Chin-An Yang, Yew-Chun Wang
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Publication number: 20240120294Abstract: A chip package includes a substrate, a semiconductor chip, and a thermal conductive structure. The chip package includes a first and a second support structures below the thermal conductive structure. The first and the second support structures connect the substrate and corners of the thermal conductive structure. The thermal conductive structure has a side edge connecting the first and the second support structures. The first and the second support structures and the side edge together define of an opening exposing a space surrounding the semiconductor chip. The first and the second support structures are disposed along a side of the substrate. The first support structure is laterally separated from the side of the substrate by a first lateral distance. The side edge of the thermal conductive structure is laterally separated from the side of the substrate by a second lateral distance different than the first lateral distance.Type: ApplicationFiled: December 21, 2023Publication date: April 11, 2024Inventors: Shu-Shen YEH, Chin-Hua WANG, Kuang-Chun LEE, Po-Yao LIN, Shyue-Ter LEU, Shin-Puu JENG
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Patent number: 11953078Abstract: A gear module includes a rotating cylinder, a first planetary gear set, a second planetary gear set, a concave-convex structure, and a limit bearing set. The first planetary gear set is accommodated in the rotating cylinder and includes a driven gear; the second planetary gear set includes a positioning frame, second planetary gears pivoted to a positioning frame, a driven gear engaged with the second planetary gears, and the positioning frame has a through hole; the concave-convex structure includes a convex column extended from the rotating cylinder and a concave hole formed on the positioning frame, the convex column is plugged into the concave hole; the limit bearing set includes a first ball bearing sheathing the driven gear and mounted between the driven gear and the through hole, and a second ball bearing sheathing the convex column and mounted between the convex column and the concave hole.Type: GrantFiled: August 16, 2023Date of Patent: April 9, 2024Assignee: SHA YANG YE INDUSTRIAL CO., LTD.Inventors: Feng-Chun Tsai, Ming-Han Tsai, Chin-Fa Lu, Kai-Hsien Wang
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Patent number: 11941298Abstract: A host system initiates an abort of a command that has been placed into a submission queue (SQ) of the host system. The host system identifies at least one of a first outcome and a second outcome. When the first outcome indicates that the command is not completed and the second outcome indicates that the SQ entry has been fetched from the SQ, the host system sends an abort request to a storage device, and issues a cleanup request to direct the host controller to reclaim host hardware resources allocated to the command. The host system adds a completion queue (CQ) entry to a CQ and sets an overall command status (OCS) value of the CQ entry based on at least one of the first outcome and the second outcome.Type: GrantFiled: April 19, 2022Date of Patent: March 26, 2024Assignee: MediaTek Inc.Inventors: Chih-Chieh Chou, Chia-Chun Wang, Liang-Yen Wang, Chin Chin Cheng, Szu-Chi Liu
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Patent number: 11931187Abstract: A method for predicting clinical severity of a neurological disorder includes steps of: a) identifying, according to a magnetic resonance imaging (MRI) image of a brain, brain image regions each of which contains a respective portion of diffusion index values of a diffusion index, which results from image processing performed on the MRI image; b) for one of the brain image regions, calculating a characteristic parameter based on the respective portion of the diffusion index values; and c) calculating a severity score that represents the clinical severity of the neurological disorder of the brain based on the characteristic parameter of the one of the brain image regions via a prediction model associated with the neurological disorder.Type: GrantFiled: March 16, 2018Date of Patent: March 19, 2024Assignees: Chang Gung Medical Foundation Chang Gung Memorial Hospital at Keelung, Chang Gung Memorial Hospital, Linkou, Chang Gung UniversityInventors: Jiun-Jie Wang, Yi-Hsin Weng, Shu-Hang Ng, Jur-Shan Cheng, Yi-Ming Wu, Yao-Liang Chen, Wey-Yil Lin, Chin-Song Lu, Wen-Chuin Hsu, Chia-Ling Chen, Yi-Chun Chen, Sung-Han Lin, Chih-Chien Tsai
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Patent number: 11913132Abstract: A method for manufacturing a package includes generating an electric field between an anode and a cathode in an electroplating solution to electroplate a substrate electrically connected to the cathode; depositing metal on a central region of the substrate with a first deposition rate; depositing metal on an outer region of the substrate with a second deposition rate lower than the first deposition rate; and reducing the first deposition rate.Type: GrantFiled: May 18, 2022Date of Patent: February 27, 2024Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Chia Chun Hsu, Chin-Feng Wang
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Publication number: 20140335285Abstract: The present disclosure is directed to a system for a surface treatment via plasma generated by a slim and/or flexible electrode and the method thereof. By using the plasma, the surface treatment for an outer wall or an inner wall of a tube can be performed.Type: ApplicationFiled: November 8, 2013Publication date: November 13, 2014Inventors: Cheng-Che HSU, Chin-chun Wang, Yao-jhen Yang
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Patent number: 7427742Abstract: An imager includes a two-dimensional array of photosensors, each photosensor having a center point. A non-telecentric lens is positioned over the two-dimensional array of photosensors, and a two-dimensional array of microlenses is positioned over the two-dimensional array of photosensors. Each microlens is associated with a corresponding photosensor, and each microlens has a center point. A color filter array is positioned over the two-dimensional array of photosensors. The color filter array includes a plurality of color filter areas. Each color filter area is associated with a corresponding photosensor and has a center point. A layer of transmissive apertures is further positioned over the two-dimensional array of photosensors. Each aperture is associated with a corresponding photosensor and having a center point. The microlens is positioned over the corresponding photosensor such that the center point of the microlens is offset from the center point of the corresponding photosensor.Type: GrantFiled: October 14, 2003Date of Patent: September 23, 2008Assignee: Cypress Semiconductor CorporationInventors: Clifford I. Drowley, Chin-Chun Wang
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Publication number: 20040165097Abstract: An imager includes a two-dimensional array of photosensors, each photosensor having a center point. A non-telecentric lens is positioned over the two-dimensional array of photosensors, and a two-dimensional array of microlenses is positioned over the two-dimensional array of photosensors. Each microlens is associated with a corresponding photosensor, and each microlens has a center point. A color filter array is positioned over the two-dimensional array of photosensors. The color filter array includes a plurality of color filter areas. Each color filter area is associated with a corresponding photosensor and has a center point. A layer of transmissive apertures is further positioned over the two-dimensional array of photosensors. Each aperture is associated with a corresponding photosensor and having a center point. The microlens is positioned over the corresponding photosensor such that the center point of the microlens is offset from the center point of the corresponding photosensor.Type: ApplicationFiled: October 14, 2003Publication date: August 26, 2004Inventors: Clifford I. Drowley, Chin-Chun Wang
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Patent number: 4532074Abstract: A conductive molding composition for the preparation of high density capacitance electronic discs is disclosed. The improved composition contains only five ingredients and is characterized by superior playback without the necessity of washing the disc after pressing. The subject compositions contain as a dispersant isopropyl tri(dioctylpyrophosphato)titanate. Preferred compositions are additionally comprised of poly(vinyl chloride), conductive carbon black, diundecyl phalthalate as a plasticizer and a tin mercaptoester or tin alkyl mercaptide stabilizer.Type: GrantFiled: June 20, 1984Date of Patent: July 30, 1985Assignee: RCA CorporationInventors: Mohamed E. Labib, Chin-Chun Wang, Robert F. Poll