Patents by Inventor Chin-Da Su

Chin-Da Su has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7097921
    Abstract: A sandwich ARC structure for preventing metal to contact from shifting, the sandwich ARC structure comprising a first Ti layer formed on a metal laer and a first TiN layer formed on the first Ti layer. A second Ti layer is formed on the first TiN layer and a second TiN layer is formed on the second Ti layer. Wherein the sandwich ARC structure formed of first Ti/first TiN/second Ti/second TiN will reduces the tress between said metal layer and a dielectric layer formed below the metal layer.
    Type: Grant
    Filed: May 29, 2003
    Date of Patent: August 29, 2006
    Assignee: Macronix International Co., Ltd.
    Inventors: Ching-Yu Chang, Yu-Lin Yen, Chin-Da Su
  • Publication number: 20040241466
    Abstract: A sandwich ARC structure for preventing metal to contact from shifting, the sandwich ARC structure comprising a first Ti layer formed on a metal laer and a first TiN layer formed on the first Ti layer. A second Ti layer is formed on the first TiN layer and a second TiN layer is formed on the second Ti layer. Wherein the sandwich ARC structure formed of first Ti/first TiN/second Ti/second TiN will reduces the tress between said metal layer and a dielectric layer formed below the metal layer.
    Type: Application
    Filed: May 29, 2003
    Publication date: December 2, 2004
    Inventors: Ching-Yu Chang, Yu-Lin Yen, Chin-Da Su