Patents by Inventor Chin-Der CHEN

Chin-Der CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11199736
    Abstract: An electronic device is disclosed, which includes a first substrate structure, a flexible substrate and a first recess. The flexible substrate is disposed on the first substrate structure. The first recess is disposed on a first surface of the flexible substrate, and the first surface is close to the first substrate structure, wherein the first recess at least overlaps the first substrate structure.
    Type: Grant
    Filed: April 25, 2019
    Date of Patent: December 14, 2021
    Assignee: INNOLUX CORPORATION
    Inventors: Kuan-Jen Wang, Chien-Chih Chen, Chih-Chieh Fan, Chin-Der Chen, Cheng-Fu Wen, Chin-Lung Ting
  • Patent number: 10950685
    Abstract: A tiled electronic device includes a first electronic device and a second electronic device adjacent to each other. The first electronic device includes a first substrate having a first upper surface, a first lower surface, and a first side surface; and a first flexible substrate including a first upper portion, a first lower portion, and a first connection portion. The first upper portion is disposed corresponding to the first upper surface. The first lower portion is disposed corresponding to the first lower surface. The first connection portion is disposed corresponding to the first side surface. The second electronic device includes a second substrate having a second upper surface, a second lower surface, and a second side surface. The second side surface is opposite and adjacent to the first side surface. The first connection portion is located between the first side surface and the second side surface.
    Type: Grant
    Filed: February 28, 2019
    Date of Patent: March 16, 2021
    Assignee: INNOLUX CORPORATION
    Inventors: Chien-Chih Chen, Shan-Hung Tsai, Chin-Der Chen, Cheng-Fu Wen, Chin-Lung Ting
  • Publication number: 20190361285
    Abstract: An electronic device is disclosed, which includes a first substrate structure, a flexible substrate and a first recess. The flexible substrate is disposed on the first substrate structure. The first recess is disposed on a first surface of the flexible substrate, and the first surface is close to the first substrate structure, wherein the first recess at least overlaps the first substrate structure.
    Type: Application
    Filed: April 25, 2019
    Publication date: November 28, 2019
    Inventors: Kuan-Jen WANG, Chien-Chih CHEN, Chih-Chieh FAN, Chin-Der CHEN, Cheng-Fu WEN, Chin-Lung TING
  • Publication number: 20190305073
    Abstract: A tiled electronic device includes a first electronic device and a second electronic device adjacent to each other. The first electronic device includes a first substrate having a first upper surface, a first lower surface, and a first side surface; and a first flexible substrate including a first upper portion, a first lower portion, and a first connection portion. The first upper portion is disposed corresponding to the first upper surface. The first lower portion is disposed corresponding to the first lower surface. The first connection portion is disposed corresponding to the first side surface. The second electronic device includes a second substrate having a second upper surface, a second lower surface, and a second side surface. The second side surface is opposite and adjacent to the first side surface. The first connection portion is located between the first side surface and the second side surface.
    Type: Application
    Filed: February 28, 2019
    Publication date: October 3, 2019
    Inventors: Chien-Chih CHEN, Shan-Hung TSAI, Chin-Der CHEN, Cheng-Fu WEN, Chin-Lung TING