Abstract: A camera module includes a substrate, a sensing chip, a lens module and a piezoelectric plate. The sensing chip is electrically connected with the substrate. The sensing chip includes a sensing region. The sensing chip is covered by the lens module. The sensing chip is arranged between the substrate and the lens module. When an external light beam passes through the lens module and projected on the sensing region, the sensing chip generates an image. The piezoelectric plate is arranged between the substrate and the lens module. When an electric power is provided to the piezoelectric plate, the piezoelectric plate is subjected to deformation, so that the lens group focuses on the sensing region. The present invention also provides a calibration method for the camera module.

Abstract: A camera module includes a substrate, a sensing chip, a lens module and a piezoelectric plate. The sensing chip is electrically connected with the substrate. The sensing chip includes a sensing region. The sensing chip is covered by the lens module. The sensing chip is arranged between the substrate and the lens module. When an external light beam passes through the lens module and projected on the sensing region, the sensing chip generates an image. The piezoelectric plate is arranged between the substrate and the lens module. When an electric power is provided to the piezoelectric plate, the piezoelectric plate is subjected to deformation, so that the lens group focuses on the sensing region. The present invention also provides a calibration method for the camera module.

Abstract: An assembling method is provided for assembling a camera module with a substrate and a lens module includes the following steps. In a step (A), a sensing chip is installed on a surface of the substrate. In a step (B), a fixture is assembled with the substrate, wherein plural inner walls of the fixture are arranged around at least a lateral edge of the substrate. In a step (C), a glue is coated on a periphery of the surface of the substrate, wherein a movable range of the glue is limited by the plural inner walls of the fixture. In a step (D), a lens holder of the lens module is installed on the surface of the substrate, so that the lens holder and the substrate are combined together through the glue. In a step (E), the fixture is separated from the substrate.

Abstract: An assembling method is provided for assembling a camera module with a substrate and a lens module includes the following steps. In a step (A), a sensing chip is installed on a surface of the substrate. In a step (B), a fixture is assembled with the substrate, wherein plural inner walls of the fixture are arranged around at least a lateral edge of the substrate. In a step (C), a glue is coated on a periphery of the surface of the substrate, wherein a movable range of the glue is limited by the plural inner walls of the fixture. In a step (D), a lens holder of the lens module is installed on the surface of the substrate, so that the lens holder and the substrate are combined together through the glue. In a step (E), the fixture is separated from the substrate.

Abstract: The present invention relates to a camera module, including an induction wafer and a non-circular lens. The induction wafer has an induction area. The non-circular lens is located above the induction wafer and covers the induction area, so that an external light ray can pass through the non-circular lens to be projected to the induction area. The non-circular lens is formed by cutting off a part of a circular lens, so as to generate a small-sized camera module. Therefore, the camera module of the present invention can be accommodated in a narrow space of a portable electronic device.

Abstract: A camera module includes a lens assembly, a power device with a first circuit board, a second circuit board and a welding element. The first circuit board is partially bent, and thus an electrical contact of the first circuit board is exposed to a lateral side of the power device. The second circuit board includes a conductive hole corresponding to the electrical contact. The conductive hole is exposed to a lateral side of the second circuit board. The welding element is installed on the lateral side of the power device and the lateral side of the second circuit board. The welding element is contacted with the electrical contact and the conductive hole, so that the first circuit board and the second circuit board are electrically connected with each other.

Abstract: A camera module includes a lens assembly, a power device with a first circuit board, a second circuit board and a welding element. The first circuit board is partially bent, and thus an electrical contact of the first circuit board is exposed to a lateral side of the power device. The second circuit board includes a conductive hole corresponding to the electrical contact. The conductive hole is exposed to a lateral side of the second circuit board. The welding element is installed on the lateral side of the power device and the lateral side of the second circuit board. The welding element is contacted with the electrical contact and the conductive hole, so that the first circuit board and the second circuit board are electrically connected with each other.

Abstract: A camera module includes a sensing chip, a lens module and a gluing element. The gluing element is disposed on the sensing chip and located at a side of the sensing region. The lens module covers the sensing chip. A lens assembly of the lens module is aligned with the sensing region. When the camera module is subject to a vibration, the particles within the camera module are moved to and adsorbed on the gluing element. Consequently, the camera module o can reduce the possibility of falling down the particles on the sensing region.

Abstract: A wireless audio-video (AV) transmission module is to be disposed in an AV source device. The AV source device includes an AV source unit for generating an AV signal. The wireless AV transmission module includes a video scaler unit and a wireless transmission unit. The video scaler unit is to be coupled electrically to the AV source unit, upscales a video signal of the AV signal from the AV source unit, and outputs an upscaled AV signal including the upscaled video signal. The wireless transmission unit is coupled electrically to the video scaler unit and wirelessly transmits the upscaled AV signal that includes the upscaled video signal.

Abstract: A wireless audio-video (AV) transmission module is to be disposed in an AV source device. The AV source device includes an AV source unit for generating an AV signal. The wireless AV transmission module includes a video scaler unit and a wireless transmission unit. The video scaler unit is to be coupled electrically to the AV source unit, upscales a video signal of the AV signal from the AV source unit, and outputs an upscaled AV signal including the upscaled video signal. The wireless transmission unit is coupled electrically to the video scaler unit and wirelessly transmits the upscaled AV signal that includes the upscaled video signal.

Abstract: A security system with power saving feature includes an electromagnetic lock and a sensing module. The electromagnetic lock is for receiving a limited supply of an electric power supplied by a power supply circuit before a full supply of the electric power is delivered to the electromagnetic lock. The sensing module may cause the full supply of the electric power upon sensing a specific action signal caused by an environment change. Therefore, the electromagnetic lock may operate in a lock state with only the limited supply of the electric power and still operate in the same lock state even after the generation of the triggering signal. Thus, the time during which the electromagnetic lock operates with the full supply of the electric power is minimized, limiting the total power consumption accordingly.

Abstract: The present invention is to provide a method for setting an image monitoring area and an apparatus thereof, comprising setting a trigger parameter and a stop parameter in an image processing software, calculating and analyzing a series of continuous image frames taken in a predetermined space by an image fetching unit by running the image processing software, determining whether the trigger parameter is included in a target image in the image frames, responsive to the determination being affirmative, automatically calculating, analyzing, and recording a trace of the target image moving in the image frames, stopping the recording of the trace when the stop parameter is detected in the target image, and setting an area defined by the trace of the target image as an image monitoring area to be monitored.

Abstract: The present invention is to provide a method for setting an image monitoring area and an apparatus thereof, comprising setting a trigger parameter and a stop parameter in an image processing software, calculating and analyzing a series of continuous image frames taken in a predetermined space by an image fetching unit by running the image processing software, determining whether the trigger parameter is included in a target image in the image frames, responsive to the determination being affirmative, automatically calculating, analyzing, and recording a trace of the target image moving in the image frames, stopping the recording of the trace when the stop parameter is detected in the target image, and setting an area defined by the trace of the target image as an image monitoring area to be monitored.