Abstract: An apparatus for removing both plastic leaded chip carrier and small outline package electronic components from carrier tapes includes a platform which supports the carrier tape and a drum which receives the cover tape which is peeled away from the carrier tape thereby releasing the electronic components. The electronic components slide under the influence of gravity along an adjustable guide into a collecting tube which has been clamped to the adjustable guide. The adjustable guide is capable of a position substantially perpendicular to the platform and a position substantially parallel to the platform thereby facilitating detaping of both plastic leaded chip carrier components and small outline package components.