Abstract: An eye diagram construction display apparatus includes an amplifier, a first equalizer, an addition unit, a second equalizer, a bit error rate check unit, a clock recovery unit, a clock synthesizer, a processing unit and a display unit. The first equalizer is electrically connected to the amplifier. The addition unit is electrically connected to the first equalizer. The second equalizer is electrically connected to the addition unit. The bit error rate check unit is electrically connected to the addition unit. The clock recovery unit is electrically connected to the addition unit and the bit error rate check unit. The clock synthesizer is electrically connected to the clock recovery unit. The processing unit is electrically connected to the addition unit, the bit error rate check unit and the clock recovery unit. The display unit is electrically connected to the processing unit.

Abstract: The present invention provides a dual chip signal conversion device, comprising: a carrier, one side surface thereof being provided with at least a first contact and a second contact while the other side surface thereof being provided with at least a third contact and a fourth contact; a first chip disposed at one side surface of the carrier and electrically connected to the second and fourth contacts; a second chip disposed at one side surface of the carrier and electrically connected to the first chip; and an antenna disposed within the carrier and electrically connected to the second chip.

Abstract: The present invention provides a dual chip signal conversion device, comprising: a carrier, one side surface thereof being provided with at least a first contact and a second contact while the other side surface thereof being provided with at least a third contact and a fourth contact; a first chip disposed at one side surface of the carrier and electrically connected to the second and fourth contacts; a second chip disposed at one side surface of the carrier and electrically connected to the first chip; and an antenna disposed within the carrier and electrically connected to the second chip.

Abstract: The present invention provides a signal conversion device comprising: a substrate having a first surface and a second surface, the first surface being provided with a first contact region comprising at least a first contact and a second contact while the second surface being provided with a second contact region comprising at least a third contact and a fourth contact; wherein there is an electrical connection between the first and third contacts, and the second and fourth contacts are electrically connected to an IC fabricated using Wafer Level Chip Scale Package (WLCSP) or Chip On Film (COF) technology, and wherein the IC is disposed at the first surface or the second surface.

Abstract: The present invention provides an electronic wallet device for a mobile phone comprising a SIM card interface, comprising: a processing unit configured to provide a top-up service interface to the mobile phone and to receive and convert a first transaction instruction from the mobile phone into a top-up instruction; an authentication unit provided with an electronic wallet and configured to receive and convert the top-up instruction into an authorized top-up instruction and to write an amount to the electronic wallet according to the authorized top-up instruction; and an NFC antenna electrically connected to the authentication unit.

Abstract: The present invention provides an antenna device comprising: a contact substrate with a plurality of electrical contacts, an antenna substrate, and a connecting member connected between said contact substrate and said antenna substrate. Said connecting member is flexible and foldable and is provided with at least one corner portion. Said corner portion defines at least one horizontal section and at least one vertical section to render the antenna device better adaptability.

Abstract: The present invention provides a dual chip signal conversion device, comprising: a carrier, one side surface thereof being provided with at least a first contact and a second contact while the other side surface thereof being provided with at least a third contact and a fourth contact; a first chip disposed at one side surface of the carrier and electrically connected to the second and fourth contacts; a second chip disposed at one side surface of the carrier and electrically connected to the first chip; and an antenna disposed within the carrier and electrically connected to the second chip.

Abstract: The present invention provides a signal conversion device comprising: a substrate having a first surface and a second surface, the first surface being provided with a first contact region comprising at least a first contact and a second contact while the second surface being provided with a second contact region comprising at least a third contact and a fourth contact; wherein there is an electrical connection between the first and third contacts, and the second and fourth contacts are electrically connected to an IC fabricated using Wafer Level Chip Scale Package (WLCSP) or Chip On Film (COF) technology, and wherein the IC is disposed at the first surface or the second surface.

Abstract: The present disclosure provides a signal processing device comprising: a first substrate, one side surface thereof being provided with at least a first contact and a second contact while the other side surface thereof being provided with at least a third contact and a fourth contact, there being an electrical connection between the first and third contacts; a second substrate, one side surface thereof being provided with at least an integrated circuit or an antenna; and a first connecting portion for connecting the first and second substrates; wherein the second and fourth contacts are electrically connected to the integrated circuit or antenna via the first connecting portion.