Patents by Inventor Chin-Feng Chang
Chin-Feng Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240113032Abstract: Interconnect structure packages (e.g., through silicon vias (TSV) packages, through interlayer via (TIV) packages) may be pre-manufactured as opposed to forming TIVs directly on a carrier substrate during a manufacturing process for a semiconductor die package at backend packaging facility. The interconnect structure packages may be placed onto a carrier substrate during manufacturing of a semiconductor device package, and a semiconductor die package may be placed on the carrier substrate adjacent to the interconnect structure packages. A molding compound layer may be formed around and in between the interconnect structure packages and the semiconductor die package.Type: ApplicationFiled: April 25, 2023Publication date: April 4, 2024Inventors: Kai-Fung CHANG, Chin-Wei LIANG, Sheng-Feng WENG, Ming-Yu YEN, Cheyu LIU, Hung-Chih CHEN, Yi-Yang LEI, Ching-Hua HSIEH
-
Publication number: 20230350600Abstract: The present invention provides a display method and structure of an intelligent memory, which is a temperature detection method and structure, which is used in a memory device, of which the memory device includes a substrate, a thermal sensor, a plurality of memory chips, a micro-control unit, and a notification module. The steps include generating at least one temperature data according to the temperature of the plurality of memory chips sensed by the thermal sensor, transmitting the at least one temperature data to the micro-control unit, and the micro-control unit determining whether the at least one temperature data exceeds a first threshold, When at least one temperature data exceeds the first threshold, the micro-control unit transmits a first control signal to a notification module, which can further be used for the method and structure for displaying real-time information.Type: ApplicationFiled: July 11, 2022Publication date: November 2, 2023Inventors: CHIN FENG CHANG, HSI LIN KUO
-
Publication number: 20230209768Abstract: The present invention provides a structure of uniform-temperature heat dissipation device. A thermal plate is disposed on a heat-emitting device on a substrate correspondingly. A thermal assembly is disposed on the thermal plate correspondingly and includes an outer casing and a thermal casing. The outer casing is disposed on the thermal plate. The thermal casing is disposed inside the outer casing. The thermal casing includes a heat dissipation fluid inside. By using the flow of the heat dissipation fluid inside the thermal casing, the heat from the heat-emitting device can be dissipated rapidly. Finally, a first heat dissipation member and a limiting recess clamp the outer casing and the first heat dissipation member can further dissipate the heat from the thermal assembly.Type: ApplicationFiled: January 11, 2022Publication date: June 29, 2023Inventors: CHIN FENG CHANG, KUAN TING CHEN
-
Patent number: 11488679Abstract: Disclosed is a method for grading memory modules comprising: a testing step which applies at least one test procedure to test a memory, each test procedure is provided with a reliability test; and a grading step which grades the memory into corresponding grade level according to test results of said at least one test procedure, and each test result includes a reliability test result wherein the reliability test has the following steps in sequence: performing a data-writing operation on the memory, wherein the data-writing operation is an operation that writes data to the memory; stopping electric charging the memory; halting a predetermined time period; electric charging the memory; checking data integrity of the memory; and generating the reliability test result according to the data integrity.Type: GrantFiled: September 14, 2021Date of Patent: November 1, 2022Assignee: TEAM GROUP INC.Inventors: Hsi-Lin Kuo, Ming-Hsun Chung, Chin-Feng Chang
-
Patent number: 11439004Abstract: Disclosed is a durable memory device comprising: a multilayer PCB having a plurality of circuit layers and a plurality of circuit layers insulating layers alternately arranged with each other, ach circuit layer being provided with a via through which the plurality of circuit layers are electrically connected, and the circuit layers has at least one ground layer; a memory member; a connection interface for connecting to a corresponding connecting portion of a computing device; and an anti-sulfuration-and-anti-high-voltage passive component which is disposed at the multilayer PCB and electrically connected to the connection interface and the memory member. By combining the anti-sulfuration-and-anti-high-voltage passive component and multilayer PCB, the durable memory device of the present invention is durable for the outdoor use.Type: GrantFiled: April 15, 2021Date of Patent: September 6, 2022Assignee: TEAM GROUP INC.Inventor: Chin Feng Chang
-
Publication number: 20220264740Abstract: Disclosed is a durable memory device comprising: a multilayer PCB having a plurality of circuit layers and a plurality of circuit layers insulating layers alternately arranged with each other, ach circuit layer being provided with a via through which the plurality of circuit layers are electrically connected, and the circuit layers has at least one ground layer; a memory member; a connection interface for connecting to a corresponding connecting portion of a computing device; and an anti-sulfuration-and-anti-high-voltage passive component which is disposed at the multilayer PCB and electrically connected to the connection interface and the memory member. By combining the anti-sulfuration-and-anti-high-voltage passive component and multilayer PCB, the durable memory device of the present invention is durable for the outdoor use.Type: ApplicationFiled: April 15, 2021Publication date: August 18, 2022Applicant: TEAM GROUP INC.Inventor: Chin Feng CHANG
-
Patent number: 11051392Abstract: The present invention relates to a heat dissipating device disposed on a circuit board. The heat dissipating device is provided with a first glue layer, a first graphene composite heat dissipating layer, a second glue layer, a second graphene composite heat dissipating layer, and a resin layer in this order from bottom to top. Furthermore, the first graphene composite heat dissipating layer and the second graphene composite heat dissipating layer are doped with a plurality of metal particles, and the first graphene composite heat dissipating layer and the second graphene composite heat dissipating layer are respectively covered by a metal layer. The above structure is simple, space-saving, and has good thermal conductivity.Type: GrantFiled: November 26, 2019Date of Patent: June 29, 2021Assignee: Team Group Inc.Inventor: Chin Feng Chang
-
Patent number: 11020873Abstract: A central axis adjustment structure of a tailstock of a woodworking lathe is disclosed. The tailstock has a circular hole therein, a front opening and a rear opening at front and rear ends of the tailstock. An end surface of the front opening has at least one screw hole. A guide rod is disposed in the circular hole, and has a rear end extending out of the rear opening. A collar is fitted onto an axial connecting shaft that is inserted in the circular hole. The guide rod is insertedly connected to a rear end of the axial connecting shaft. The collar has at least one perforation corresponding to the screw hole. At least one bolt is inserted through the perforation and screwed to the screw hole so that the collar is locked to the front end of the tailstock. A first annular gap is defined between the guide rod and the rear opening of the tailstock. A second annular gap is defined between the axial connecting shaft and the front opening of the tailstock.Type: GrantFiled: September 17, 2019Date of Patent: June 1, 2021Assignee: KINGSAND MACHINERY LTD.Inventor: Chin-Feng Chang
-
Publication number: 20210100090Abstract: The present invention relates to a heat dissipating device disposed on a circuit board. The heat dissipating device is provided with a first glue layer, a first graphene composite heat dissipating layer, a second glue layer, a second graphene composite heat dissipating layer, and a resin layer in this order from bottom to top. Furthermore, the first graphene composite heat dissipating layer and the second graphene composite heat dissipating layer are doped with a plurality of metal particles, and the first graphene composite heat dissipating layer and the second graphene composite heat dissipating layer are respectively covered by a metal layer. The above structure is simple, space-saving, and has good thermal conductivity.Type: ApplicationFiled: November 26, 2019Publication date: April 1, 2021Inventor: CHIN FENG CHANG
-
Publication number: 20210078197Abstract: A central axis adjustment structure of a tailstock of a woodworking lathe is disclosed. The tailstock has a circular hole therein, a front opening and a rear opening at front and rear ends of the tailstock. An end surface of the front opening has at least one screw hole. A guide rod is disposed in the circular hole, and has a rear end extending out of the rear opening. A collar is fitted onto an axial connecting shaft that is inserted in the circular hole. The guide rod is insertedly connected to a rear end of the axial connecting shaft. The collar has at least one perforation corresponding to the screw hole. At least one bolt is inserted through the perforation and screwed to the screw hole so that the collar is locked to the front end of the tailstock. A first annular gap is defined between the guide rod and the rear opening of the tailstock. A second annular gap is defined between the axial connecting shaft and the front opening of the tailstock.Type: ApplicationFiled: September 17, 2019Publication date: March 18, 2021Inventor: CHIN-FENG CHANG
-
Patent number: 10816083Abstract: A lubrication system of a power assembly of an electric scooter includes a case duct and a bearing seat duct formed in a case of the power assembly, and a driven gear shaft duct formed in a driven gear shaft of a driven gear. Lubricant flows to the case duct, the driven gear shaft duct, a driven gear bearing seat in the case, the bearing seat duct, a driving bearing seat in the case in sequence. The lubrication system has a short flowing distance of the lubricant to enhance the effects of lubrication and reducing temperature.Type: GrantFiled: August 9, 2018Date of Patent: October 27, 2020Assignee: Fukuta Electric & Machinery Co., Ltd.Inventors: Chin Feng Chang, Hung Chun Ke
-
Patent number: 10803713Abstract: A luminous solid-state disk, comprises: a solid-state disk; a light-emitting member; a light-emitting controller; a disk enclosure accommodating the solid-state disk, the light-emitting member and the light-emitting controller, the disk enclosure having a connection interface, the light-emitting controller in connection to the connection interface to receive, through the connection interface, a computer terminal information from a computer, the light-emitting controller uses, according to the computer terminal information, a control signal to control the light-emitting member, the disk enclosure having a main wall surface, which is transparent, wherein light from the light-emitting member directly transmits through the main wall surface or is reflected to transmit through the main wall surface. Through the above structure, the main wall surface can be used as an information display to inform the user of the computer information.Type: GrantFiled: September 19, 2019Date of Patent: October 13, 2020Assignee: TEAM GROUP INC.Inventors: Chin-Feng Chang, Tzu-Hsien Chuang, Hung-Lieh Lin
-
Patent number: 10597115Abstract: A controlling system of an electric scooter includes a case having a mounting room therein; and a circuit board received in the mounting room of the case, and having a recess portion at an edge thereof. A driving shaft of an electric motor has at least a section in the mounting room of the case and received in the recess portion of the circuit board. It may reduce a size of the case.Type: GrantFiled: August 9, 2018Date of Patent: March 24, 2020Assignee: Fukuta Electric & Machinery Co., Ltd.Inventors: Chin Feng Chang, Hung Chun Ke
-
Patent number: 10601286Abstract: A manufacturing method for a motor core includes a preparing step, a coating step, a stacking step, and a forming step. In the preparing step, the silicon steel sheets are cleaned and dried. In the coating step, an electrically insulating colloid is coated between each pair of adjacent silicon steel sheets. In the stacking step, the silicon steel sheets on which the electrically insulating colloid is applied are stacked on each other to form a layered structure. In the forming step, the stacked silicon steel sheets are subjected to a colloid curing process so that the electrically insulating colloid forms a thermosetting plastic. This reduces the chance of forming eddy currents, reducing the eddy current loss of the motor core during operation.Type: GrantFiled: June 13, 2017Date of Patent: March 24, 2020Assignee: FUKUTA ELECTRIC & MACHINERY CO., LTD.Inventor: Chin Feng Chang
-
Publication number: 20200049248Abstract: A lubrication system of a power assembly of an electric scooter includes a case duct and a bearing seat duct formed in a case of the power assembly, and a driven gear shaft duct formed in a driven gear shaft of a driven gear. Lubricant flows to the case duct, the driven gear shaft duct, a driven gear bearing seat in the case, the bearing seat duct, a driving bearing seat in the case in sequence. The lubrication system has a short flowing distance of the lubricant to enhance the effects of lubrication and reducing temperature.Type: ApplicationFiled: August 9, 2018Publication date: February 13, 2020Inventors: CHIN FENG CHANG, HUNG CHUN KE
-
Publication number: 20200047847Abstract: A controlling system of an electric scooter includes a case having a mounting room therein; and a circuit board received in the mounting room of the case, and having a recess portion at an edge thereof. A driving shaft of an electric motor has at least a section in the mounting room of the case and received in the recess portion of the circuit board. It may reduce a size of the case.Type: ApplicationFiled: August 9, 2018Publication date: February 13, 2020Inventors: CHIN FENG CHANG, HUNG CHUN KE
-
Publication number: 20200047848Abstract: A power assembly of an electric scooter includes a case, in which an electric motor, a driven gear, and a controller are received. The case has a base, and the base is provided with a separating layer to divide a space in the base into a first space and a second space. The electric motor has an output shaft and a driving gear connected to the output shaft. The driving gear is received in the first space of the base. The driven gear is received in the first space of the base and mesh with the driving gear. A gear shaft is connected to the driven gear, and the gear shaft has an end extending out of the case. The controller is provided in the second space of the base and electrically connected to the electric motor.Type: ApplicationFiled: August 9, 2018Publication date: February 13, 2020Inventors: CHIN FENG CHANG, HUNG CHUN KE
-
Patent number: D930586Type: GrantFiled: January 25, 2021Date of Patent: September 14, 2021Assignee: FUKUTA ELECTRIC & MACHINERY CO., LTD.Inventor: Chin Feng Chang
-
Patent number: D936105Type: GrantFiled: September 9, 2020Date of Patent: November 16, 2021Assignee: FUKUTA ELECTRIC & MACHINERY CO., LTD.Inventor: Chin Feng Chang
-
Patent number: D936106Type: GrantFiled: January 25, 2021Date of Patent: November 16, 2021Assignee: FUKUTA ELECTRIC & MACHINERY CO., LTD.Inventor: Chin Feng Chang