Abstract: A chip package structure with a shielding cover includes a substrate, a chip, a pair of first passive components, a pair of second passive components, and a shielding cover. The chip, the pair of first passive components, the pair of second passive components, and the shielding cover are disposed on the substrate. The chip is electrically connected to the substrate. The shielding cover covers the chip and has leads connected to the substrate. The leads include a first lead and a second lead. The first lead connected to a portion of the substrate is located between the pair of first passive components and arranged along a first axis with the pair of first passive components. The second lead connected to a portion of the substrate is located between the pair of second passive components and arranged along a second axis with the pair of second passive components.

Abstract: A chip package structure with a shielding cover includes a substrate, a chip, a pair of first passive components, a pair of second passive components, and a shielding cover. The chip, the pair of first passive components, the pair of second passive components, and the shielding cover are disposed on the substrate. The chip is electrically connected to the substrate. The shielding cover covers the chip and has leads connected to the substrate. The leads include a first lead and a second lead. The first lead connected to a portion of the substrate is located between the pair of first passive components and arranged along a first axis with the pair of first passive components. The second lead connected to a portion of the substrate is located between the pair of second passive components and arranged along a second axis with the pair of second passive components.

Abstract: A miniaturized microwave sampler has a first substrate and a second substrate mounted together on a mounting surface, a ground layer formed on the mounting surface, a slot-line formed on the ground layer. A first microstrip line is formed on a top surface of the first substrate and has a first end as a local pulse signal input port. A T-shaped second microstrip line is formed on a bottom surface of the second substrate and achieves an electromagnetic coupling with the first microstrip line through the slot-line. The second microstrip line has a longitudinal segment and a latitudinal segment both being perpendicularly connected together. The longitudinal segment has one end as a radio frequency signal input port. The latitudinal segment further extends to form two output ports.