Abstract: A heat dissipation device for transferring heat generated by a heat-producing element to a heat-dissipating element, includes a graphene plate, a main casing and a supporting plate. The graphene plate, in the form of relatively thin structure, has a first dissipation portion and a second dissipation portion extending from the first dissipation portion. The main casing, generally a planar structure, encloses the graphene plate therein, and has a first dissipation opening exposing the first dissipation portion of the graphene plate. The supporting plate extends integrally from the main casing in order to support the second dissipation portion of the graphene plate. The heat-producing element is inserted through the first dissipation opening in order to mount the same on the first dissipation portion of the graphene plate while the heat-dissipating element is mounted on the second dissipation portion of the graphene plate.

Abstract: A heat dissipation device for transferring heat generated by a heat-producing element to a heat-dissipating element, includes a graphene plate, a main casing and a supporting plate. The graphene plate, in the form of relatively thin structure, has a first dissipation portion and a second dissipation portion extending from the first dissipation portion. The main casing, generally a planar structure, encloses the graphene plate therein, and has a first dissipation opening exposing the first dissipation portion of the graphene plate. The supporting plate extends integrally from the main casing in order to support the second dissipation portion of the graphene plate. The heat-producing element is inserted through the first dissipation opening in order to mount the same on the first dissipation portion of the graphene plate while the heat-dissipating element is mounted on the second dissipation portion of the graphene plate.

Abstract: An EMI shielding device is set in an electronic device. The electronic device includes a shell, a circuit board set in the shell, and an electrical component set on the circuit board. The shielding device includes a middle board and a shielding cover. The middle board is set inside the electronic device. The shielding cover is set on the middle board and covers an outside of the electrical component. Thus, the EMI shielding device is structured. The material of the shielding cover is widely used, so the cost of the material is markedly reduced. After the shielding cover is opened, it is easy to restore the shielding state. The shielding cover is set inside the electronic device via the middle board, so assembly is easy and it is not limited by changes in the shape or the structure of the shell, so applicability is improved.

Abstract: An EMI shielding device is set in an electronic device. The electronic device includes a shell, a circuit board set in the shell, and an electrical component set on the circuit board. The shielding device includes a middle board and a shielding cover. The middle board is set inside the electronic device. The shielding cover is set on the middle board and covers an outside of the electrical component. Thus, the EMI shielding device is structured. The material of the shielding cover is widely used, so the cost of the material is markedly reduced. After the shielding cover is opened, it is easy to restore the shielding state. The shielding cover is set inside the electronic device via the middle board, so assembly is easy and it is not limited by changes in the shape or the structure of the shell, so applicability is improved.

Abstract: A coupling structure includes a first slide member, a second slide member slidably connected to the first slide member so as to be slidable relative to each other, and a spring member. The spring member has two opposite ends and a plurality of resilient turnings arranged in a predetermined sequence so as to have the same turning direction such that the resilient turnings are juxtaposed to one another and extend along a planar direction. The opposite ends of the spring member are connected respectively to the first and second slide members. Movement of the first and second slide members to a first position causes the spring member to possess a restoration force that is capable of retaining the first and second slide members at a second position different from the first position.

Abstract: A slide structure is implemented in electronic device such as mobile phone. The second component is moveably connected with the first component and is moved with respect to the first component. The spring includes two ends and is positioned within a clearance. One end is fixed to the first component, and the other end is fixed to the second component. The spring extends from one end along a first direction so that a first portion is formed. Then, the spring extends along a second direction to the other end so that a second portion which is opposite to the first direction is formed. When the first component is moved to a first position, the first portion and the second portion are compressed to establish a resilient force. Then, the first portion and the second portion are extended by the resilient force so that the first component is moved to a second position.

Abstract: An electromagnetic-shielding device disposed in an electronic device prevents that an electric component in the electronic device is interfered by electromagnetic wave. The electromagnetic-shielding device has at least one positioning and leaning wall, which is mounted on a laminate member as a part of a housing of the electronic device or a central plate within the electronic device. By means of the positioning and leaning wall, an electromagnetic-shielding mask is conveniently mounted within the electronic device so as to cover the electronic component.

Abstract: A coupling structure includes a first slide member, a second slide member slidably connected to the first slide member so as to be slidable relative to each other, and a spring member. The spring member has two opposite ends and a plurality of resilient turnings arranged in a predetermined sequence so as to have the same turning direction such that the resilient turnings are juxtaposed to one another and extend along a planar direction. The opposite ends of the spring member are connected respectively to the first and second slide members. Movement of the first and second slide members to a first position causes the spring member to possess a restoration force that is capable of retaining the first and second slide members at a second position different from the first position.

Abstract: An EMI shielding device is set in an electronic device. The electronic device includes a shell, a circuit board set in the shell, and an electrical component set on the circuit board. The shielding device includes a middle board and a shielding cover. The middle board is set inside the electronic device. The shielding cover is set on the middle board and covers an outside of the electrical component. Thus, the EMI shielding device is structured. The material of the shielding cover is widely used, so the cost of the material is markedly reduced. After the shielding cover is opened, it is easy to restore the shielding state. The shielding cover is set inside the electronic device via the middle board, so assembly is easy and it is not limited by changes in the shape or the structure of the shell, so applicability is improved.

Abstract: An EMI shielding device is set in an electronic device. The electronic device includes a shell, a circuit board set in the shell, and an electrical component set on the circuit board. The shielding device includes a middle board and a shielding cover. The middle board is set inside the electronic device. The shielding cover is set on the middle board and covers an outside of the electrical component. Thus, the EMI shielding device is structured. The material of the shielding cover is widely used, so the cost of the material is markedly reduced. After the shielding cover is opened, it is easy to restore the shielding state. The shielding cover is set inside the electronic device via the middle board, so assembly is easy and it is not limited by changes in the shape or the structure of the shell, so applicability is improved.

Abstract: An EMI shielding device is set in an electronic device. The electronic device includes a shell, a circuit board set in the shell, and an electrical component set on the circuit board. The shielding device includes a middle board and a shielding cover. The middle board is set inside the electronic device. The shielding cover is set on the middle board and covers an outside of the electrical component. Thus, the EMI shielding device is structured. The material of the shielding cover is widely used, so the cost of the material is markedly reduced. After the shielding cover is opened, it is easy to restore the shielding state. The shielding cover is set inside the electronic device via the middle board, so assembly is easy and it is not limited by changes in the shape or the structure of the shell, so applicability is improved.

Abstract: An EMI shielding device is set in an electronic device. The electronic device includes a shell, a circuit board set in the shell, and an electrical component set on the circuit board. The shielding device includes a middle board and a shielding cover. The middle board is set inside the electronic device. The shielding cover is set on the middle board and covers an outside of the electrical component. Thus, the EMI shielding device is structured. The material of the shielding cover is widely used, so the cost of the material is markedly reduced. After the shielding cover is opened, it is easy to restore the shielding state. The shielding cover is set inside the electronic device via the middle board, so assembly is easy and it is not limited by changes in the shape or the structure of the shell, so applicability is improved.

Abstract: An EMI shielding device is set in an electronic device. The electronic device includes a shell, a circuit board set in the shell, and an electrical component set on the circuit board. The shielding device includes a middle board and a shielding cover. The middle board is set inside the electronic device. The shielding cover is set on the middle board and covers an outside of the electrical component. Thus, the EMI shielding device is structured. The material of the shielding cover is widely used, so the cost of the material is markedly reduced. After the shielding cover is opened, it is easy to restore the shielding state. The shielding cover is set inside the electronic device via the middle board, so assembly is easy and it is not limited by changes in the shape or the structure of the shell, so applicability is improved.

Abstract: An EMI shielding device is set in an electronic device. The electronic device includes a shell, a circuit board set in the shell, and an electrical component set on the circuit board. The shielding device includes a middle board and a shielding cover. The middle board is set inside the electronic device. The shielding cover is set on the middle board and covers an outside of the electrical component. Thus, the EMI shielding device is structured. The material of the shielding cover is widely used, so the cost of the material is markedly reduced. After the shielding cover is opened, it is easy to restore the shielding state. The shielding cover is set inside the electronic device via the middle board, so assembly is easy and it is not limited by changes in the shape or the structure of the shell, so applicability is improved.

Abstract: An EMI shielding device (1) is set in an electronic device. The electronic device includes a shell, a circuit board set in the shell, and an electrical component set on the circuit board. The shielding device includes a middle board and a shielding cover. The middle board is set inside the electronic device. The shielding cover is set on the middle board and covers an outside of the electrical component. Thus, the EMI shielding device is structured. The material of the shielding cover is widely used, so the cost of the material is markedly reduced. After the shielding cover is opened, it is easy to restore the shielding state. The shielding cover is set inside the electronic device via the middle board, so assembly is easy and it is not limited by changes in the shape or the structure of the shell, so applicability is improved.

Abstract: A graphite heat dissipation apparatus and a clamping frame for clamping a graphite heat dissipation fin module are provided. The graphite heat dissipation apparatus includes a graphite heat dissipation fin module and at least one clamping frame. The graphite heat dissipation fin module includes a substrate and a plurality of graphite fins which are positioned at and extend from one surface of the substrate. The clamping frame includes at least one support bracket, at least one retention plates and a frame body. The support brackets are positioned at top surface of a chassis. The frame body upwardly extends from the support brackets, and the retention plates traverse extend across the side surface of the frame body. The retention plates are used to clamp the substrate so that the graphite fins are positioned above the chassis. The graphite heat dissipation fin module is used to draw hear away from the electronic device which can be positioned below the substrate and at the surface of the chassis.

Abstract: A graphite heat dissipation apparatus and a clamping frame for clamping a graphite heat dissipation fin module are provided. The graphite heat dissipation apparatus includes a graphite heat dissipation fin module and at least one clamping frame. The graphite heat dissipation fin module includes a substrate and a plurality of graphite fins which are positioned at and extend from one surface of the substrate. The clamping frame includes at least one support bracket, at least one retention plates and a frame body. The support brackets are positioned at top surface of a chassis. The frame body upwardly extends from the support brackets, and the retention plates traverse extend across the side surface of the frame body. The retention plates are used to clamp the substrate so that the graphite fins are positioned above the chassis. The graphite heat dissipation fin module is used to draw hear away from the electronic device which can be positioned below the substrate and at the surface of the chassis.

Abstract: A processing method for graphite piece, and comprising the steps of: using a pair of male and female dies to sandwich a graphite material in between the pair of dies and cut the graphite material to become the graphite piece with the specific figure. The male die and the female die continuously applying a force onto the graphite piece in order to form a predetermined second thickness by a backform disposed between the pair of male and female dies. It makes the density of graphite piece increase and promote the efficiency of conducting. Furthermore, bending the bent portion of graphite piece continuously can solve the problems of bent graphite piece with low density resulted in inefficiency. Moreover, after the radiator embedding in the surface of the graphite piece, bending the graphite piece continuously can make the radiator firmly connected to the graphite piece.

Abstract: An electromagnetic-shielding device disposed in an electronic device prevents that an electric component in the electronic device is interfered by electromagnetic wave. The electromagnetic-shielding device has at least one positioning and leaning wall, which is mounted on a laminate member as a part of a housing of the electronic device or a central plate within the electronic device. By means of the positioning and leaning wall, an electromagnetic-shielding mask is conveniently mounted within the electronic device so as to cover the electronic component.

Abstract: An EMI shielding device (1) is set in an electronic device. The electronic device includes a shell, a circuit board set in the shell, and an electrical component set on the circuit board. The shielding device includes a middle board and a shielding cover. The middle board is set inside the electronic device. The shielding cover is set on the middle board and covers an outside of the electrical component. Thus, the EMI shielding device is structured. The material of the shielding cover is widely used, so the cost of the material is markedly reduced. After the shielding cover is opened, it is easy to restore the shielding state. The shielding cover is set inside the electronic device via the middle board, so assembly is easy and it is not limited by changes in the shape or the structure of the shell, so applicability is improved.